SOLAR CELL METALLIZATION USING INLINE ELECTROLESS PLATING
First Claim
1. A method for forming a photovoltaic cell electrode structure, wherein the photovoltaic cell comprises a semiconductor substrate having a passivation layer thereon, the method comprising:
- providing a plurality of contact openings through the passivation layer to the semiconductor substrate;
selectively plating a contact metal into the plurality of contact openings to deposit the contact metal by printing electroless plating solution directly into the contact openings;
depositing at least one metal containing layer over the deposited contact metal to form metal gridlines; and
firing the deposited contact metal and the at least one deposited metal containing layer.
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Accused Products
Abstract
Inline methods for forming a photovoltaic cell electrode structure, wherein the photovoltaic cell includes a semiconductor substrate having a passivation layer thereon, includes providing a plurality of contact openings through the passivation layer to the semiconductor substrate, selectively plating a contact metal into the plurality of contact openings by printing electroless plating solution into the plurality of contact openings to deposit the contact metal, depositing a metal containing material on the deposited contact metal, and firing the deposited contact metal and the deposited metal containing material. The metal containing material may include a paste containing a silver or silver alloy along with a glass frit and is substantially free to completely free of lead. The methods may also use light activation of the passivation layer or use seed layers to assist in the plating.
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Citations
26 Claims
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1. A method for forming a photovoltaic cell electrode structure, wherein the photovoltaic cell comprises a semiconductor substrate having a passivation layer thereon, the method comprising:
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providing a plurality of contact openings through the passivation layer to the semiconductor substrate; selectively plating a contact metal into the plurality of contact openings to deposit the contact metal by printing electroless plating solution directly into the contact openings; depositing at least one metal containing layer over the deposited contact metal to form metal gridlines; and firing the deposited contact metal and the at least one deposited metal containing layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. An inline system for forming a photovoltaic cell electrode structure, wherein the photovoltaic cell electrode structure comprises a semiconductor substrate having a passivation layer thereon, the inline system comprising:
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a contact opening forming device for providing a plurality of contact openings through the passivation layer to the semiconductor substrate, a printing device, located downstream from the contact opening forming device, for selectively printing electroless plating solution directly into the contact openings to form contact metal in the plurality of contact openings, a heating device to heat the substrate following the printing by the printing device, a metallic gridline deposition device, located downstream from the heating device, for depositing metallic gridlines over the contact metal, and a furnace device for firing the metallic gridlines and the substrate with the contact metal, wherein the inline system retains the photovoltaic cell electrode structure within the system during processing by the foregoing devices. - View Dependent Claims (22)
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23. A method to form a metal-based pattern on a substrate comprising:
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providing a substrate; selectively printing electroless plating solution onto the substrate in an image-wise fashion; heating the substrate to activate the printed electroless plating solution. - View Dependent Claims (24, 25, 26)
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Specification