Method of Forming Insulation Film by Modified PEALD
First Claim
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1. A method of forming an insulation film by plasma enhanced atomic layer deposition (PEALD), comprising:
- (i) introducing a precursor into a reaction space where a substrate is placed;
(ii) treating the precursor with a plasma;
(iii) adsorbing the plasma-treated precursor onto a surface of the substrate;
(iv) treating the adsorbed surface using a reactant gas and a plasma to form and fix a film, wherein steps (i) to (iv) constitute one cycle; and
(v) repeating the one cycle multiple times until an atomic layer of a desired thickness is obtained.
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Abstract
A method of forming an insulation film by alternating multiple times, respectively, a process of adsorbing a precursor onto a substrate and a process of treating the adsorbed surface using reactant gas and a plasma, wherein a plasma is applied in the process of supplying the precursor.
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Citations
15 Claims
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1. A method of forming an insulation film by plasma enhanced atomic layer deposition (PEALD), comprising:
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(i) introducing a precursor into a reaction space where a substrate is placed; (ii) treating the precursor with a plasma; (iii) adsorbing the plasma-treated precursor onto a surface of the substrate; (iv) treating the adsorbed surface using a reactant gas and a plasma to form and fix a film, wherein steps (i) to (iv) constitute one cycle; and (v) repeating the one cycle multiple times until an atomic layer of a desired thickness is obtained. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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Specification