Printed Antennas, Methods of Printing an Antenna, and Devices Including the Printed Antenna

• US 20100127084A1
• Filed: 11/24/2009
• Published: 05/27/2010
• Est. Priority Date: 11/25/2008
• Status: Active Grant

• Current Assignee: Ensurge Micropower ASA
• Original Assignee: Thin Film Electronics ASA
• Inventors: Choi, Criswell, PAVATE, Vikram
• Granted Patent: US 9,016,585 B2
• Time in Patent Office: Days
• US Class Current: 235/492
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07783 the coil being planar
• CPC Class Codes: H01Q 1/2208 associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems methods or arrangements for sensing record carriers, e.g. for reading patterns G06K7/00; record carrier for use with machines and with at least a part designed to carry digital markings G06K19/00
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 23/00 Antennas with active circuits or circuit elements integrated within them or attached to them
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• CPC Class Codes: Y10T 29/49018 with other electrical component

Abstract

Wireless devices such as sensors, interactive displays and electronic article surveillance (EAS) and/or radio frequency identification (RFID) tags including integrated circuitry and an antenna and/or inductor printed thereon, and methods for making and using the same, are disclosed. The device generally includes an integrated circuit on a substrate and an antenna, directly on the substrate and/or the integrated circuit, in electrical communication with the integrated circuit. The method of making a wireless device generally includes forming an integrated circuit on the substrate and printing at least part of an antenna or antenna precursor layer on the integrated circuit and/or substrate. The present invention advantageously provides a low cost wireless device capable of operating at MHz frequencies that can be manufactured in a shorter time period than conventional devices.

Claims

1. A method of manufacturing a device, comprising:

a) forming an integrated circuit on a first substrate; and

b) printing at least part of an antenna or antenna precursor layer on the integrated circuit and/or the first substrate, the antenna being in electrical communication with the integrated circuit.

2. The method of claim 1, wherein the integrated circuit comprises a printed integrated circuit (PIC).

3. The method of claim 2, wherein forming the PIC on the first substrate comprises printing at least one first layer of a first material in a first pattern on the first substrate.

4. The method of claim 3, wherein forming the PIC on the substrate (further) comprises printing a second layer of a second material in a second pattern on or above the first pattern.

5. The method of claim 3, wherein the second material comprises a dielectric precursor.

6. The method of claim 4, wherein forming the PIC on the substrate (further) comprises printing a third layer of a third material in a third pattern on or above the first and/or second pattern(s).

7. The method of claim 6, wherein the third material comprises a metal precursor.

8. The method of claim 2, wherein forming the PIC on the first substrate comprises forming the printed integrated circuit on a second substrate, then attaching the second substrate to the first substrate, the first substrate having a greater area than the second substrate.

9. The method of claim 2, wherein printing the antenna or antenna precursor layer on the PIC and/or the substrate comprises printing a first portion of the antenna on the PIC and a second portion of the antenna on the first substrate.

10. The method of claim 2, wherein printing the antenna or antenna precursor layer comprises:

a) printing an antenna precursor layer on the PIC and the first substrate; and

b) plating a metal conductor on the antenna precursor layer to form the antenna.

11. The method of claim 2, wherein printing the antenna or antenna precursor layer comprises printing the antenna or the antenna precursor layer on the PIC.

12. The method of claim 2, wherein the PIC comprises an uppermost passivation layer having first and second openings therein, exposing first and second conductive surfaces for electrically communicating with the PIC, and first and second ends of the antenna or the antenna precursor layer are printed onto the first and second conductive surfaces.

13. The method of claim 3, wherein printing the integrated circuit comprises screen printing, flexographic printing, gravure printing or inkjet printing.

14. A device, comprising:

a) an integrated circuit on a first substrate; and

b) an antenna, directly on the first substrate and/or the integrated circuit, in electrical communication with the integrated circuit.

15. The device of claim 14, wherein the integrated circuit comprises a printed integrated circuit (PIC).

16. The device of claim 15, further comprising a plurality of pads on the PIC, in electrical communication with the PIC, each pad also being in electrical communication with an end of the antenna.

17. The device of claim 15, wherein the PIC comprises a silicon layer in a first pattern on the first substrate, the silicon layer having a dome-shaped profile.

18. The device of claim 17, wherein the PIC further comprises a dielectric layer in a second pattern on or above the silicon layer.

19. The device of claim 15, wherein the PIC further comprises a metal in a third pattern on or above the first substrate, the first pattern and/or the second pattern.

20. The device of claim 14, further comprising a second substrate supporting the printed integrated circuit and having a smaller area than the first substrate, the second substrate being attached to the first substrate.

21. The device of claim 14, wherein the antenna comprises:

a) a seed layer in an antenna pattern on the PIC and the first substrate; and

b) a metal conductor on the seed layer.

22. The device of claim 15, wherein the PIC comprises an uppermost passivation layer having first and second openings therein, exposing first and second conductive surfaces in electrical communication with the PIC, and first and second ends of the antenna or the antenna precursor layer are in contact the first and second conductive surfaces.