LIGHT EMITTING APPARATUS AND METHOD FOR MANUFACTURING SAME
First Claim
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1. A light emitting apparatus, comprising:
- a substrate;
a semiconductor device including a semiconductor layer formed integrally on a major surface of the substrate; and
a light emitting device formed separately from the substrate, the light emitting device being mounted on the major surface of the substrate, electrically connected to the semiconductor device, and thermally connected to the substrate.
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Abstract
A light emitting apparatus, includes: a substrate; a semiconductor device including a semiconductor layer formed integrally on a major surface of the substrate; and a light emitting device formed separately from the substrate. The light emitting device is mounted on the major surface of the substrate, electrically connected to the semiconductor device, and thermally connected to the substrate.
26 Citations
20 Claims
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1. A light emitting apparatus, comprising:
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a substrate; a semiconductor device including a semiconductor layer formed integrally on a major surface of the substrate; and a light emitting device formed separately from the substrate, the light emitting device being mounted on the major surface of the substrate, electrically connected to the semiconductor device, and thermally connected to the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. A method for manufacturing a light emitting apparatus, the apparatus including a semiconductor device provided on a major surface of a substrate and a light emitting device provided on the major surface of the substrate, the light emitting device being electrically connected to the semiconductor device, the method comprising:
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forming an insulating layer on the major surface of the substrate; forming a semiconductor layer on the insulating layer and forming the semiconductor device to include the semiconductor layer; and mounting the light emitting device onto the major surface of the substrate to connect the light emitting device to the substrate through an opening of the insulating layer.
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20. A method for manufacturing a light emitting apparatus, the apparatus including a semiconductor device provided on a major surface of a substrate and a light emitting device provided on the major surface of the substrate, the light emitting device being electrically connected to the semiconductor device, the method comprising:
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forming an insulating layer on a support substrate; forming a semiconductor layer on the insulating layer and forming the semiconductor device to include the semiconductor layer; removing the support substrate; bonding the semiconductor device to the substrate; and mounting the light emitting device onto the major surface of the substrate to connect the light emitting device to the substrate through an opening of the insulating layer.
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Specification