×

INTEGRATED CAPICITOR WITH CABLED PLATES

  • US 20100127348A1
  • Filed: 11/21/2008
  • Published: 05/27/2010
  • Est. Priority Date: 11/21/2008
  • Status: Active Grant
First Claim
Patent Images

1. A capacitor in an integrated circuit (“

  • IC”

    ) comprising;

    a distribution grid formed in a first patterned metal layer of the integrated circuit;

    a first vertical conductive filament connected to and extending away from the distribution grid along a first direction;

    a second vertical conductive filament connected to and extending away from the distribution grid along a second direction opposite the first direction;

    a first grid plate formed in a second patterned metal layer proximate to the first patterned metal layer, the first grid plate surrounding the first vertical conductive filament in the second patterned metal layer;

    a second grid plate formed in a third patterned metal layer proximate to the first patterned metal layer, the first patterned metal layer disposed between the second patterned metal layer and the third patterned metal layer, the second grid plate surrounding the second vertical conductive filament in the third patterned metal layer, wherein the distribution grid, the first vertical conductive filament and the second vertical conductive filament are connected to and form a portion of a first node of the capacitor and the first grid plate and the second grid plate are connected to and form a first portion of a second node of the capacitor.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×