PROTECTION LAYERS FOR MEDIA PROTECTION DURING FABRICATION OF PROBE MEMORY DEVICE
First Claim
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1. An apparatus, comprising:
- a cantilever wafer having a plurality of cantilever probes for scanning a media layer;
a mover wafer comprising the media layer;
a bond ring connected to the cantilever wafer; and
a germanium layer and a silicon dioxide layer between the bond ring and the mover wafer.
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Abstract
A micro-electro-mechanical system (MEMS) seek-scan probe (SSP) memory device utilizes a protective layer over the delicate media layer to protect the media during harsh processing steps that may otherwise damage the media layer. The protective layer may comprise a layer of germanium and a layer of silicon dioxide.
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Citations
19 Claims
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1. An apparatus, comprising:
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a cantilever wafer having a plurality of cantilever probes for scanning a media layer; a mover wafer comprising the media layer; a bond ring connected to the cantilever wafer; and a germanium layer and a silicon dioxide layer between the bond ring and the mover wafer. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method, comprising:
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depositing a media layer on a mover wafer; depositing a germanium layer and a silicon dioxide layer over the media layer to protect the media layer during further processing; processing the mover wafer to form a mover; attaching a cantilever wafer to one side of the mover wafer with bond rings; and removing the germanium layer and a silicon dioxide layer from the media layer on the mover. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16)
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17. A seek-scan probe memory device, comprising:
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a cantilever wafer having a plurality of cantilever probes for scanning a media layer; a mover wafer comprising the media layer; circuitry formed on the mover wafer; a bond ring connected to the cantilever wafer; and a germanium layer and a silicon dioxide layer between the bond ring and the over wafer remaining after the manufacturing process. - View Dependent Claims (18, 19)
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Specification