THERMAL MANAGEMENT SYSTEM WITH GRAPHENE-BASED THERMAL INTERFACE MATERIAL

• US 20100128439A1
• Filed: 11/24/2008
• Published: 05/27/2010
• Est. Priority Date: 11/24/2008
• Status: Abandoned Application

• Current Assignee: General Electric Company
• Original Assignee: General Electric Company
• Inventors: Tsakalakos, Loucas, Tilak, Vinayak, Wetzel, Todd Garrett, Nagarkar, Kaustubh Ravindra
• Application Number:
  US12/276,498
• Publication Number:
  US 20100128439A1
• Time in Patent Office: Days
• US Class Current: 361/709
• CPC Class Codes: C09K 5/14 Solid materials, e.g. powdery or granular

Abstract

A thermal management system includes graphene paper disposed between a heat source and a heat sink to transfer heat therebetween. The graphene paper is oriented such that the individual layers are substantially perpendicular to the plane of the heat source and the plane of the heat sink to maximize heat transfer. The heat source and the heat sink can be any physical structure that emits and absorbs thermal energy, respectively. The graphene paper may be bonded to the heat source and the heat sink using a bonding agent, such as a thermally conductive material, and the like. The graphene paper may be formed in several different configurations, such as a spring structure, and the like.

Claims

1. A thermal interface material comprising a plurality of sheets of graphene paper bonded together using a bonding agent, wherein the plurality of sheets are oriented substantially parallel to each other.

2. The material of claim 1, wherein the graphene paper is interposed between a heat source and a heat sink to transfer heat between the heat source and the heat sink.

3. The material of claim 2, wherein the plurality of sheets of graphene paper is oriented substantially perpendicular to a plane of the heat source and a plane of the heat sink.

4. The material of claim 2, the bonding agent comprises a thermally conductive material for bonding the graphene paper to the heat source and the heat sink.

5. The material of claim 4, wherein the bonding agent comprises a thermally conductive material selected from the group consisting of graphite, copper, gold, silver, gallium, indium, thermal cement, and thermal epoxy.

6. A thermal management system, comprising:

a heat source;

a heat sink; and

a thermal interface material comprising a plurality of sheets of graphene bonded together using hydrogen or covalent bonding to form graphene paper, the graphene paper interposed between the heat source and the heat sink to transfer heat between the heat source and the heat sink.

7. The system of claim 6, wherein the plurality of sheets of graphene paper is oriented substantially perpendicular to a plane of the heat source and a plane of the heat sink.

8. The system of claim 6, further comprising a bonding agent for bonding the graphene paper to the heat source and the heat sink.

9. The system of claim 8, wherein the bonding agent comprises a thermally conductive material selected from the group consisting of graphite, copper, gold, silver, gallium, indium, thermal cement, and thermal epoxy.

10. The system of claim 6, wherein the heat source comprises an electronic circuit board, a solar cell, or a thermoelectric element.