ARC DISCHARGE DEVICE

• US 20100128441A1
• Filed: 05/18/2007
• Published: 05/27/2010
• Est. Priority Date: 05/18/2007
• Status: Active Grant

• Current Assignee: Sansha Electric Manufacturing Company Limited
• Original Assignee: Sansha Electric Manufacturing Company Limited
• Inventors: Uchida, Toshio, Inami, Kazunori, Ohnishi, Yuji, Soda, Osamu
• Granted Patent: US 8,223,496 B2
• Time in Patent Office: Days
• US Class Current: 361/709
• CPC Class Codes: H01L 25/115 the devices being arranged next to each other
• CPC Class Codes: H01L 25/18 the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H05K 7/209 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20909 takes precedence

Abstract

[Object] To incorporate more semiconductor elements in a small-sized lightweight power semiconductor module provided in an arc discharge device.

[Means for Settlement] A power supply unit of an arc discharge device includes a semiconductor module 1, and a radiator fitted onto the semiconductor module 1. The semiconductor module 1 includes a module casing 2, and common units 3a to 3c retained by the module casing 2. Each of the common units 3a to 3c has: a ceramic substrate 50 having a circuit surface disposed with a semiconductor element 54, and a radiation surface on a side opposite to the circuit surface; and a package 35 that exposes the radiation surface, and seals the circuit surface with heat resistant resin. The radiator is fitted onto the module casing 2 to be thereby brought into abutting contact with all of the radiation surfaces of the common units 3a to 3c. Based on such a configuration, more semiconductor elements can be incorporated in a small-sized lightweight power semiconductor module.

Claims

1. A power semiconductor module comprising:

a module casing having a radiator fitting surface facing to a radiator; and

two or more common units retained by said module casing, wherein

said common unit has;

a ceramic substrate having a circuit surface disposed with a semiconductor element, and a radiation surface opposed to said circuit surface; and

a package formed to expose said radiation surface and to seal said circuit surface with heat resistant resin,

said module casing has;

an opening that exposes the radiation surface of said common unit on said radiator fitting surface;

a radiator fitting part for fitting said radiator;

a unit abutting contact part that is brought into abutting contact with said common unit to sandwich said common unit with said radiator; and

a first electrode terminal extending from said package toward a side opposite to said radiation surface, and

said first electrode terminal is formed to be exposed outside said package from a valley line of a step part on said package, the step part opening into the side opposite to said radiation surface, and to be bent toward the side opposite to said radiation surface around said valley line.

2. The power semiconductor module according to claim 1, wherein said first electrode terminal is formed by being bent from a state where said first electrode terminal is embedded into one surface constituting said step part with a part thereof being exposed, and a width of a cross section thereof is formed so as to widen toward an exposure side.

3. The power semiconductor module according to claim 1 or 2, wherein

said module casing has a nut storage part formed as a concave portion for storing a nut;

said common unit has a second electrode terminal having a fastening hole for fastening a metal plate with use of said nut; and

said nut storage part is covered with said second electrode terminal of said common unit contained in said module casing.

4. An arc discharge device comprising a power supply unit that variously converts a frequency of an AC power supply supplied for arc discharge, wherein

said power supply unit comprises:

the power semiconductor module according to claim 1; and

a radiator fitted onto said power semiconductor module.