HIGH INTENSITY REPLACEABLE LIGHT EMITTING DIODE MODULE AND ARRAY

• US 20100128478A1
• Filed: 11/26/2008
• Published: 05/27/2010
• Est. Priority Date: 11/26/2008
• Status: Active Grant

• Current Assignee: In 2 Developments LLC
• Original Assignee: Deloren E. Anderson
• Inventors: Anderson, Deloren E.
• Granted Patent: US 7,972,037 B2
• Time in Patent Office: Days
• US Class Current: 362/249.20
• CPC Class Codes: F21K 9/23 Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
• CPC Class Codes: F21K 9/69 Details of refractors forming part of the light source
• CPC Class Codes: F21K 9/90 Methods of manufacture
• CPC Class Codes: F21S 2/005 of modular construction
• CPC Class Codes: F21V 17/002 with provision for interchangeability, i.e. component parts being especially adapted to be replaced by another part with the same or a different function F21V17/10 takes precedence
• CPC Class Codes: F21V 23/06 the elements being coupling devices , e.g. connectors
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21V 31/005 Sealing arrangements therefor
• CPC Class Codes: F21W 2131/10 Outdoor lighting
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H05B 33/02 Details
• CPC Class Codes: H05B 33/04 Sealing arrangements , e.g. against humidity
• CPC Class Codes: H05B 33/06 Electrode terminals
• CPC Class Codes: H05B 33/10 Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
• CPC Class Codes: H05B 45/58 involving end of life detection of LEDs
• CPC Class Codes: Y10S 362/80 Light emitting diode
• CPC Class Codes: Y10T 29/4973 Replacing of defective part

Abstract

A light fixture, comprising a matrix, a plurality of electrical sockets fixedly secured to the matrix and forming a rigid matrix of electrical sockets electrically interconnected in two dimensions. One or more light emitting diode modules are individually removable and replaceable within any individual electrical socket within the matrix. Each individual light emitting diode module includes a base and a light emitting diode, wherein the base is configured and arranged for fitted electrical engagement within the electrical socket.

Claims

1. A high intensity light emitting diode module for a high intensity light array, the module comprising:

a high intensity light emitting diode;

a heat sink thermally coupled to the high intensity light emitting diode;

a pair of contacts extending from the light emitting diode, each contact having a portion shaped to mate in retentive contact with corresponding contacts on an electrical connection board having an array of contacts forming a high intensity light array to produce a large volume of light;

a socket thermally coupled to the heat sink; and

a sealing element adapted to be compressed against a portion of the socket to provide a sealed electrical contact with the electrical connection board when the pair of contacts are mated with the corresponding contacts on the electrical connection board.

2. The high intensity light emitting diode module of claim 1 wherein the pair of contacts comprise male connectors for mating with contacts on the electrical connection board which comprise female connectors.

3. The high intensity light emitting diode module of claim 1 and further comprising a guide coupled to the high intensity light emitting diode adapted to fit with a mating guide coupled to the electrical connection board to align the contacts of the light emitting diode with the contacts on the electrical connection board.

4. The high intensity light emitting diode module of claim 1 wherein the sealing element comprises a compressible ring that provides a water tight seal with the socket when the module contacts are mated with the electrical connection board sealing the electrical connection from outside elements.

5. The high intensity light emitting diode module of claim 4 wherein the compressible ring comprises an 0-ring or a flat washer.

6. The high intensity light emitting diode module of claim 1 and further comprising a lens coupled to the light emitting diode to provide light directional control.

7. The high intensity light emitting diode module of claim 6 wherein the lens is adhered to the light emitting diode and provides a seal to protect the light emitting diode.

8. An array of high intensity light emitting diode modules, the array comprising:

a matrix;

a circuit board supported by the matrix;

a plurality of electrical sockets fixedly coupled to the matrix and forming a matrix of electrical sockets, wherein the circuit board has conductors between the sockets to provide one or more sets of series connections of the sockets such that light emitting diode modules removeably connected to all the sockets in a set cause a desired voltage drop, and wherein the sockets provide a pair of contacts for each module to sealingly retain each module in a water tight electrical connection with the socket.

9. The array of claim 8 wherein the sockets are electrically coupled via the circuit board in a desired pattern.

10. The array of claim 9 wherein the pattern is an oval pattern.

11. The array of claim 8 wherein the sets of series connected sockets have 10 or more sockets in each set.

12. The array of claim 8 wherein the sets of series connected sockets have a number of sockets in them equal to a supply voltage divided by a voltage drop per module.

13. An array of high intensity light emitting diode modules for high volume light applications, the array comprising:

a matrix;

a circuit board supported by the matrix;

a plurality of electrical sockets fixedly coupled to the matrix and forming a matrix of electrical sockets, wherein the circuit board has conductors between the sockets to provide one or more sets of series connections of the sockets such that light emitting diode modules removeably connected to all the sockets in a set cause a desired voltage drop, and wherein the circuit board provides a pair of contacts for each module and sealingly retain each module in a water tight electrical connection with the socket, and wherein each module comprises;

a high intensity light emitting diode;

a heat sink thermally coupled to the high intensity light emitting diode;

a pair of contacts extending from the light emitting diode, each contact having a portion shaped to removeably mate in contact with corresponding contacts on an electrical connection board; and

a sealing element adapted to be compressed against a socket to provide a sealed electrical contact with the electrical connection board when the pair of contacts are mated with the corresponding contacts on the electrical connection board, such that each module in the array of modules is replaceable.

14. The array of claim 13 wherein the array comprises a sufficient number of diode modules for large area outdoor lighting.

15. The array of claim 13 wherein the larger area outdoor lighting comprises parking lots, parking ramps, highways, streets, stores, warehouses, gas station canopies.

16. A high intensity light emitting diode module for a high intensity light array, the module comprising:

a high intensity light emitting diode;

a heat sink thermally coupled to the high intensity light emitting diode;

a socket thermally coupled to the heat sink;

a pair of contacts extending from the light emitting diode, each contact having a portion shaped to mate in retentive contact with corresponding contacts on an electrical connection board having an array of contacts forming a high intensity light array to produce a large volume of light;

a sealing element adapted to be compressed against a portion of the socket to provide a sealed electrical contact with the electrical connection board when the pair of contacts are mated with the corresponding contacts on the electrical connection board.

17. A method of replacing a high intensity light emitting diode, the method comprising:

identifying a high intensity light emitting diode that needs replacing in an high volume light emitting diode lighting array having a plurality of electrical sockets supported by a matrix and forming a matrix of electrical sockets, wherein the circuit board has conductors between the sockets to provide one or more sets of series connections of the sockets such that light emitting diode modules connected to all the sockets in a set cause a desired voltage drop, and wherein the circuit board provide a pair of contacts for each module and sealingly retain each module in a water tight electrical connection with the socket;

removing a module having the identified light emitting diode that needs replacing; and

inserting a replacement module into a socket, wherein the replacement module includes a high intensity light emitting diode, a heat sink thermally coupled to the high intensity light emitting diode, a pair of contacts extending from the light emitting diode, each contact having a portion shaped to removeably mate in contact with corresponding contacts on an electrical connection board, and a sealing element adapted to be compressed against the socket to provide a sealed electrical contact with the electrical connection board when the pair of contacts are mated with the corresponding contacts on the electrical connection board.