METHOD AND APPARATUS FOR LINEAR PAD CONDITIONING

• US 20100130107A1
• Filed: 11/09/2009
• Published: 05/27/2010
• Est. Priority Date: 11/24/2008
• Status: Abandoned Application

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Yilmaz, Alpay, Rangarajan, Jagan, Golubovsky, Edward
• Application Number:
  US12/615,216
• Publication Number:
  US 20100130107A1
• Time in Patent Office: Days
• US Class Current: 451/56
• CPC Class Codes: B24B 53/017 Devices or means for dressing, cleaning or otherwise conditioning lapping tools

Abstract

A method and apparatus for conditioning a polishing pad is described. The apparatus includes a base coupled to a platform, a first arm member having a first end coupled to the base, and a second arm member having a first end pivotably coupled to a second end of the first arm member and a conditioning disk coupled to a second end opposite the first end. The method includes rotating a polishing pad, urging a rotating conditioning disk against a polishing surface of the polishing pad, and moving the conditioning disk in a linear direction relative to the rotating polishing pad to perform a conditioning process.

Claims

1. An apparatus for conditioning a polishing pad, comprising:

a base coupled to a platform;

a first arm member having a first end coupled to the base and an opposing second end;

a second arm member having a first end pivotably coupled to a second end of the first arm member; and

a conditioning disk coupled to a second end of the second arm member opposite the first end of the first arm member.

2. The apparatus of claim 1, wherein the conditioning disk is coupled to a first actuator and a first transmission system disposed on one or both of the first arm member and the second arm member.

3. The apparatus of claim 1, wherein the conditioning disk is coupled to a first actuator disposed on the second end of the second arm member.

4. The apparatus of claim 1, wherein the base is coupled to a rotary actuator adapted to move the base relative to the platform.

5. The apparatus of claim 4, wherein the first arm member is fixedly coupled to the base.

6. The apparatus of claim 4, wherein the actuator is a vertical actuator providing vertical movement of the base relative to the platform.

7. The apparatus of claim 1, wherein the first arm member and second arm member are coupled to a first drive assembly comprising:

a motor having a first gear;

a second gear coupled to the first end of the second arm member; and

a belt coupling the first gear and the second gear.

8. The apparatus of claim 7, wherein the conditioning disk is coupled to a second drive assembly.

9. The apparatus of claim 8, wherein the second drive assembly includes a direct drive motor coupled to the conditioning disk.

10. The apparatus of claim 7, wherein the drive assembly articulates the first arm member and second arm member in a linear direction.

11. The apparatus of claim 10, wherein first arm member and second arm member articulate in a vertical plane.

12. The apparatus of claim 10, wherein first arm member and second arm member articulate in a horizontal plane.

13. A method of conditioning a polishing pad, comprising:

rotating a polishing pad;

urging a rotating conditioning disk against a polishing surface of the polishing pad; and

moving the conditioning disk in a linear direction relative to the rotating polishing pad to perform a conditioning process.

14. The method of claim 13, wherein the linear direction comprises a sweep pattern corresponding substantially to a radial dimension of the polishing surface.

15. The method of claim 13, wherein the linear direction comprises movement of the conditioning disk from a perimeter of the polishing surface to near a center of the polishing surface.

16. The method of claim 13, wherein the condition disk is coupled to an arm assembly moving in a horizontal direction during the conditioning process.

17. The method of claim 13, wherein the condition disk is coupled to an arm assembly moving in a vertical direction during the conditioning process.

18. An apparatus for conditioning a polishing pad, comprising:

a base coupled to a platform;

a first arm member coupled to the base;

a second arm member coupled to the first arm member;

a conditioning disk coupled to the second arm member opposite the base; and

a joint member coupled between the first arm member and the second arm member, the joint member adapted to provide rotation of the first arm member relative to the second arm member.

19. The apparatus of claim 18, further comprising:

a first transmission system coupled between the first arm member and the second arm member; and

a second transmission system coupled to the conditioning disk.

20. The apparatus of claim 18, wherein the first arm member and second arm member are coupled to a first drive assembly comprising:

a motor having a first gear;

a second gear coupled to a first end of the second arm member; and

a belt coupling the first gear and the second gear.

21. The apparatus of claim 20, further comprising:

a second drive assembly coupled to the conditioning disk.

22. The apparatus of claim 21, wherein the second drive assembly comprises a direct drive motor.

23. The apparatus of claim 21, wherein the second drive assembly comprises:

a motor coupled to the conditioning disk by one or more belts.

24. The apparatus of claim 19, wherein the first drive assembly articulates the first arm member and second arm member in a linear direction.

25. The apparatus of claim 24, wherein first arm member and second arm member articulate in a vertical plane.

26. The apparatus of claim 24, wherein first arm member and second arm member articulate in a horizontal plane.