BONDS AND METHOD FOR FORMING BONDS FOR A TWO-PHASE COOLING APPARATUS
First Claim
1. A two-phase cooling apparatus, comprising:
- an evaporator comprising;
a first layer having porous regions and non-porous regions, the porous regions having a plurality of through-holes extending through the first layer;
a cap structure formed such that when disposed over the first layer, at least a portion of the plurality of through-holes are unobstructed to liquid or vapor flow;
a bonding layer formed between the first layer and the cap structure, the bonding layer in contact with at least a portion of the non-porous regions of the first layer, the bonding layer comprising a bond; and
wherein the bonding layer is compatible with liquid and forms a hermetic seal between the first layer and the cap structure.
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Accused Products
Abstract
Bonds and method for forming bonds for a two-phase cooling apparatus are disclosed. In one aspect of the present disclosure, the two-phase cooling apparatus includes an evaporator. One embodiment of the evaporator includes, a first layer having porous regions and non-porous regions, the porous regions having a plurality of through-holes extending through the first layer, a cap structure formed such that when disposed over the first layer, at least a portion of the plurality of through-holes are unobstructed to liquid or vapor flow, a bonding layer formed between the first layer and the cap structure, the bonding layer in contact with at least a portion of the non-porous regions of the first layer, the bonding layer comprising a bond. The bonding layer is typically compatible with liquid and forms a hermetic seal between the first layer and the cap structure
84 Citations
20 Claims
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1. A two-phase cooling apparatus, comprising:
an evaporator comprising; a first layer having porous regions and non-porous regions, the porous regions having a plurality of through-holes extending through the first layer; a cap structure formed such that when disposed over the first layer, at least a portion of the plurality of through-holes are unobstructed to liquid or vapor flow; a bonding layer formed between the first layer and the cap structure, the bonding layer in contact with at least a portion of the non-porous regions of the first layer, the bonding layer comprising a bond; and wherein the bonding layer is compatible with liquid and forms a hermetic seal between the first layer and the cap structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A two-phase cooling apparatus, comprising:
an evaporator comprising; a silicon layer having porous regions and non-porous regions, the porous regions having a plurality of through-holes extending through the silicon layer; a cap structure formed such that when disposed over the silicon layer, at least a portion of the plurality of through-holes are unobstructed to liquid or vapor flow; a bonding layer formed between the silicon layer and the cap structure, the bonding layer in contact with at least a portion of the non-porous regions of the first layer; the bonding layer comprising; an adhesion layer disposed on at least a portion of the non-porous regions of the silicon layer; a barrier layer disposed on the adhesion layer; and a bond comprised substantially of gold and tin disposed on the barrier layer; wherein the bonding layer is compatible with liquid and forms a hermetic seal between the silicon layer and the cap structure.
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16. A method of forming an evaporator of a two-phase cooling apparatus, comprising:
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forming porous regions in a semiconductor material layer, the porous regions having a plurality of through-holes in the semiconductor material layer, the semiconductor material layer having non-porous regions exclusive of the porous regions; forming a cap structure such that when disposed over the semiconductor material layer, at least a portion of the plurality of through-holes of the semiconductor material layer are unobstructed; bonding the silicon layer and the cap structure using a bonding layer; wherein, the bonding layer is formed on the semiconductor material layer at a portion of the non-porous regions; and wherein the bonding layer is compatible with liquid and forms a hermetic seal between the semiconductor material layer and the cap structure. - View Dependent Claims (17, 18, 19, 20)
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Specification