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BONDS AND METHOD FOR FORMING BONDS FOR A TWO-PHASE COOLING APPARATUS

  • US 20100132404A1
  • Filed: 12/03/2008
  • Published: 06/03/2010
  • Est. Priority Date: 12/03/2008
  • Status: Abandoned Application
First Claim
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1. A two-phase cooling apparatus, comprising:

  • an evaporator comprising;

    a first layer having porous regions and non-porous regions, the porous regions having a plurality of through-holes extending through the first layer;

    a cap structure formed such that when disposed over the first layer, at least a portion of the plurality of through-holes are unobstructed to liquid or vapor flow;

    a bonding layer formed between the first layer and the cap structure, the bonding layer in contact with at least a portion of the non-porous regions of the first layer, the bonding layer comprising a bond; and

    wherein the bonding layer is compatible with liquid and forms a hermetic seal between the first layer and the cap structure.

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