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Device Built By Joining A Plurality Of Layers

  • US 20100132990A1
  • Filed: 11/26/2007
  • Published: 06/03/2010
  • Est. Priority Date: 12/22/2006
  • Status: Abandoned Application
First Claim
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1. A method of manufacturing a multilayer device, the method comprising:

  • providing a first layer or stack of layers having an exposed surface;

    providing a second layer or stack of layers having an exposed surface;

    creating a depression in said exposed surface of the first layer or stack of layers;

    depositing electrically active material onto the first layer or stack of layers in the depression, an electrical component being created from the electrically active material in the device; and

    joining the exposed surfaces of the first layer or stack of layers and second layer or stack of layers after the electrically active material has been deposited.

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