APPARATUS, SYSTEM AND METHOD FOR USE IN MOUNTING ELECTRONIC ELEMENTS

• US 20100133002A1
• Filed: 01/28/2010
• Published: 06/03/2010
• Est. Priority Date: 03/28/2006
• Status: Active Grant

• Current Assignee: Cree Huizhou Solid State Lighting Company Limited (Smart Global Holdings Incorporated)
• Original Assignee: CREE Hong Kong Limited (Wolfspeed, Inc.)
• Inventors: Xuan, Wong, Cheong, Cheng Siu, Hui, Xie Jian
• Granted Patent: US 9,035,439 B2
• Time in Patent Office: Days
• US Class Current: 174/536
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1815 Shape
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H05K 5/0091 Housing specially adapted for small components for resistors H01C; for capacitors H01G; for integrated circuits H01L23/00
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing

Abstract

The present embodiments provide surface mount devices and/or systems. In some embodiments, the surface mount devices comprise a casing having a recess formed extending at least partially into said casing; and first and second leads each of which is at least partially encased by said casing and each of which has a portion exposed through said recess, wherein at least one of said first and second leads has one or more size reduction features in its said exposed portion that reduces the surface area to provide an increased surface bonding area to said casing around said lead.

Claims

1. A surface mount device comprising:

a casing having a recess formed extending at least partially into said casing; and

first and second leads each of which is at least partially encased by said casing and each of which has a portion exposed through said recess, wherein at least one of said first and second leads has one or more size reduction features in its said exposed portion that reduces the surface area to provide an increased surface bonding area to said casing around said lead.

2. The device of claim 1, wherein said one or more size reduction features comprises one or more indentations.

3. The device of claim 1, further comprising one or more electronic and/or optoelectronic devices coupled to at least one of the leads at said portion exposed through said recess.

4. The device of claim 1, wherein said first and second leads have a portion extending through the exterior of said casing.

5. The device of claim 1, further comprising a fill material disposed within said recess and extending through and bonding to said bonding area around said leads.

6. The device of claim 2, wherein said one or more indentations are substantially trapezoidal shaped.

7. The device of claim 4, wherein the first and second leads have increased thicknesses in the portions extending from said casing.

8. The device of claim 4, wherein at least one of said first and second leads extends through at least one side surface of said casing, and at least one of another of first and second leads extends through at least another side surface of said casing.

9. The device of claim 1, wherein said first and second leads comprise vacant areas to further increase the casing bonding area around said leads.

10. The device of claim 9, wherein at least some of said vacant areas comprise through holes.

11. The device of claim 9, wherein at least some of said vacant areas comprise circular through holes.

12. The device of claim 1, wherein said first and second leads comprise at least one stepped portion.

13. A surface mount device comprising:

a casing comprising a first surface having a recess extending into the casing; and

first and second leads at least partially encased by said casing, said first lead having a chipset portion at least partially exposed through said recess, said second lead proximate said first lead, said second lead having a head portion exposed through said recess, wherein said chipset portion has at least one indentation.

14. The device of claim 13, wherein said first and second leads extend through a second surface of the casing, and wherein said first and second leads have increased thicknesses exterior to the casing.

15. The device of claim 13, wherein said chipset portion comprising first and second indentations defined along a length of said chipset portion, with first portions of said first and second indentations being encased by said casing and second portions of said first and second indentations extending into the area exposed by said recess.

16. The device of claim 15, wherein said first and second indentations are on opposite sides of said chipset portion.

18. The device of claim 13, wherein said first and second leads comprise vacant areas to further increase the casing bonding area around said leads.

19. The device of claim 18, wherein at least some of said vacant areas comprise circular through holes.

20. The device of claim 13, wherein said first and second leads comprise at least one stepped portion.

17. The device of claim 17, further comprising fill material disposed within at least a portion of said recess, wherein casing material extends through first portions of said first and second indentations and said fill material extends through second portions of said first and second indentations.

21. A method of manufacturing a surface mount device, comprising:

providing a first lead element comprising a chipset portion, the chipset portion comprising a first indentation and a second indentation;

providing a second lead element comprising a head portion;

encasing a portion of the first and second lead elements in a casing, the first and second lead elements are positioned apart, the area between the first and second elements define an insulation gap, the second indentation partially defines the insulation gap, and the chipset portion and the head portion terminate interior to the casing; and

forming a recess in a first surface of the casing and exposing a portion of the chipset portion, a portion of the head portion, and a portion of the first and second indentations through the recess.

22. The method of claim 21, further comprising:

extending the first and second lead elements through a second surface of the casing; and

bending the first and second lead elements along the second surface.

23. The method of claim 21, wherein providing the first and second lead elements comprises shaping the first and second lead elements such that the portion of the first and second lead elements bent along the second surface has a thickness greater than a thickness of the first and second lead elements encased by the casing.

24. The method of claim 21, wherein providing the first lead element comprises shaping the chipset portion of the first lead element such that the chipset portion extends through the area exposed by the recess, and shaping the first and second indentations on opposite sides of said chipset portion;

and

the encasing comprises encasing a second portion of the first indentation with the casing such that casing material extends through at least a portion of the second portion of the first indentation, and encasing a second portion of the second indentation with the casing such that casing material extends through at least a portion of the second portion of the second indentation.