LIQUID DISPENSING SYSTEMS ENCOMPASSING GAS REMOVAL

• US 20100133292A1
• Filed: 06/11/2007
• Published: 06/03/2010
• Est. Priority Date: 06/13/2006
• Status: Active Grant

• Current Assignee: Advanced Technology Materials, Inc. (Entegris Incorporated)
• Original Assignee: Advanced Technology Materials, Inc. (Entegris Incorporated)
• Inventors: Ware, Donald D., Mikkelsen, Kirk, O'Dougherty, Kevin T., Tom, Glenn M., Gerold, Jason, Dathe, Paul, Koland, Amy, Cisewski, Michael A.
• Granted Patent: US 8,336,734 B2
• Time in Patent Office: Days
• US Class Current: 222/1
• CPC Class Codes: B65D 83/62 by membrane, bag, or the like containers in which the content is delivered by the contracting forces inherent in the bag B65D83/0061
• CPC Class Codes: B67D 7/0261 specially adapted for transferring liquids of high purity
• CPC Class Codes: B67D 7/763 of air separators
• CPC Class Codes: Y10T 137/313 Gas carried by or evolved from liquid

Abstract

Systems are described for delivery of a wide variety of materials in which liquid and gas or vapor states are concurrently present, from a package preferably including a fluid-containing collapsible liner. Headspace gas is removed from a pressure dispensing package prior to liquid dispensation therefrom, and ingress gas is removed thereafter during dispensation operation. At least one sensor senses presence of gas or a gas-liquid interface in a reservoir or gas-liquid separation region. A gas removal system including an integral reservoir, at least one sensor, and at least one flow control elements may be included within a connector adapted to mate with a pressure dispensing package, for highly efficient removal of gas from the liquid being dispensed from the container.

Claims

1. A fluid dispensing system comprising at least one pressure dispense package adapted to hold fluid for pressure dispensing, and a gas removal apparatus adapted to remove gas from the pressure dispense package before and during pressure dispensation of the fluid.

2. The system of claim 1, wherein the fluid comprises a liquid, and the gas prior to removal thereof contacts the liquid.

3. The system of claim 1, wherein the gas removal apparatus is adapted to remove (i) headspace gas from the at least one package prior to dispensing of fluid therefrom and (ii) ingress gas entering the at least one package subsequent to removal of said headspace gas from the at least one package.

4. The system of claim 1, wherein the at least one pressure dispense package includes a liner adapted to hold said fluid, and said liner is disposed within an overpack container.

5. The system of claim 4, wherein said liner comprises a flexible material, and said overpack container comprises a wall material that is substantially more rigid than said flexible material.

6. The system of claim 5, wherein the package comprises a bag-in-can (BIC), bag-in-drum (BID), or bag-in-bottle (BIB) package.

7. The system of claim 5, wherein said liner comprises a polymeric film material.

8. The system of claim 7, wherein the polymeric film material comprises any of polyethylene, polytetrafluoroethylene, polyvinylalcohol, polypropylene, polyurethane, polyvinylidene chloride, polyvinylchloride, polyacetal, polystyrene, polyacrylonitrile, polybutylene, polyamide, polyester, and multilayer laminates.

9. The system of claim 7, wherein the liner comprises a multilayer laminate includes:

a fluoropolymer liner film; and

a barrier layer comprising any of polyamide, polyetheretherketone (PEEK), polymonochlorotrifluoroethylene (PCTFE), polyester, polyethylene naphthalate (PEN), polyethylene terephthalate (PET), liquid crystal polymer (LCP), a metal, an oxide, a carbon material, an organic-inorganic composite, and a blend, composite, coating, or combination of any of the foregoing.

10. The system of claim 9, wherein the fluoropolymer film comprises any of polytetrafluoroethylene (PTFE), perfluoroalkoxy (PFA), fluorinated ethylene propylene (FEP), ethylene chlorotrifluoroethlyene (ECTFE), and a blend, composite, or combination of two or more of the foregoing.

11. The system of claim 9, wherein the multilayer laminate further comprises a third layer comprising any of polyethylene (MDPE), nylon, polyamide, ethylene vinyl alcohol (EVOH), and copolymers including ethylene and non-ethylene monomers.

12. The system of claim 9, wherein the multilayer laminate comprises a third layer characterized by any of comprising any of:

(i) substantially the same composition as fluorinated polymer layer;

(ii) substantially the same coefficient of thermal expansion as the fluorinated polymer layer;

(iii) a substantially higher melting temperature than the barrier layer; and

(iv) a substantially non-stick surface character when heated to an absolute temperature of at least ninety percent of its melting point.

13. The system of claim 7, wherein the polymeric film material has a thickness in a range of from about 1 mil to about 30 mils.

14. The system of claim 4, wherein the liner is compressible such that an interior volume thereof may be reduced to about 0.25% or less, about 0.05% or less, or about 0.005% or less, of a rated fill volume of the liner.

15. The system of claim 4, wherein the liner holds said fluid in a zero headspace or near zero headspace state.

16. The system of claim 4, wherein the at least one pressure dispense package is devoid of a diptube.

17. The system of claim 4, adapted for dispensing of at least 99.9% volume of material from the liner.

18. The system of claim 4, further comprising a radio frequency identification tag associated with the liner.

19. The system of claim 1, wherein the at least one pressure dispense package is devoid of a liner.

20. The system of claim 1, wherein the at least one package contains a chemical reagent.

21. The system of claim 20, wherein the chemical reagent comprises a microelectronic device manufacturing chemical reagent.

22. The system of claim 20, wherein the chemical reagent comprises photoresist.

23. The system of claim 1, coupled in fluid-supplying relationship to a fluid-utilizing apparatus to supply substantially bubble-free fluid to said fluid-utilizing apparatus.

24. The system of claim 1, coupled in fluid-supplying relationship to a microelectronic device manufacturing tool to supply substantially bubble-free fluid to said tool.

25. The system of claim 1, further comprising flow circuitry adapted to interconnect the at least one pressure dispense package with the gas removal apparatus.

26. The system of claim 1, further comprising a pressurized gas source adapted to supply gas to the at least one package for pressure dispensing of fluid from the at least one package.

27. The system of claim 26, wherein the pressurized gas source comprises any of a pump, a compressor, and a gas tank.

28. The system of claim 4, further comprising a source of pressurized gas in fluid communication with a volume defined between the collapsible liner and the overpack container.

29. The system of claim 26, further comprising a controller adapted to control flow of pressurizing gas from the pressurizing gas source.

30. The system of claim 1, further comprising an operator interface adapted to monitor status of the fluid dispensing and allow input by a user of the system.

31. The system of claim 1, wherein the gas removal apparatus comprises:

a ventable reservoir adapted to receive said fluid; and

flow circuitry providing at least intermittent fluid communication between the at least one pressure dispense package and the ventable reservoir.

32. The system of claim 31, wherein the ventable reservoir comprises a gas outlet disposed at a first level, and comprises a liquid outlet disposed at a second level arranged below the first level.

33. The system of claim 32, wherein the gas removal apparatus further comprises:

a sensor adapted to sense accumulation of gas within the reservoir, and to responsively generate an output signal indicative of such condition; and

at least a first control element adapted to effect removal of gas from the reservoir responsive to the output signal.

34. The system of claim 33, wherein the sensor is in sensory communication with the ventable reservoir at a level intermediately disposed between the first level and the second level.

35. The system of claim 33, wherein the sensor output signal is indicative of any of:

presence of a gas, absence of a gas, presence of a liquid, absence of a liquid, presence of a bubble, and presence of a liquid-gas interface.

36. The system of claim 33, wherein the sensor comprises a capacitive sensor.

37. The system of claim 33, wherein the sensor comprises a capacitive sensor in indirect contact with the reservoir.

38. The system of claim 33, wherein the sensor comprises a photosensor or optical sensor.

39. The system of claim 33, wherein the sensor comprises a teachable sensor.

40. The system of claim 33, wherein the at least a first control element comprises a first actuatable valve.

41. The system of claim 31, wherein the ventable reservoir has a vertical axis, an average internal cross-sectional area perpendicular to the vertical axis, and a gas collection zone disposed along an upper boundary of the ventable reservoir, wherein the gas collection zone has an internal cross-sectional area perpendicular to the vertical axis that is substantially smaller than the average internal cross-sectional area of the ventable reservoir.

42. The system of claim 41, wherein the gas removal apparatus further comprises:

a sensor adapted to sense accumulation of gas within the gas collection zone, and to responsively generate an output signal indicative of such condition; and

at least a first control element adapted to effect removal of gas from the gas collection zone responsive to the output signal.

43. The system of claim 41, wherein the internal cross-sectional area of the gas collection zone is less than or equal to about one-half the average internal cross-sectional area of the ventable reservoir.

44. The system of claim 41, wherein the internal cross-sectional area of the gas collection zone is less than or equal to about one-fourth the average internal cross-sectional area of the ventable reservoir.

45. The system of claim 41, wherein the internal cross-sectional area of the gas collection zone is less than or equal to about one-eighth the average internal cross-sectional area of the ventable reservoir.

46. The system of claim 41, further comprising at least one baffle disposed within the ventable reservoir and adapted to promote transport of microbubbles to the gas collection zone

47. The system of claim 41, further comprising a fluid inlet conduit, and a pressure transducer in fluid communication with any of the fluid inlet conduit and the ventable reservoir.

48. The system of claim 31, wherein the ventable reservoir is internal to a connector physically coupled to the pressure dispense package.

49. The system of claim 32, further comprising a fluid inlet in fluid communication with the ventable reservoir at a level higher than the second level corresponding to the liquid outlet.

50. The system of claim 31, wherein the gas removal apparatus includes:

a bubble sensor in sensory communication with the flow circuitry upstream of the ventable reservoir and operable to generate an output signal indicative of presence of bubbles in liquid dispensed from the pressure dispense package; and

a control element adapted to vent said ventable reservoir responsive to the output signal, to permit liquid substantially free of bubbles to be withdrawn from said ventable reservoir.

51. The system of claim 50, wherein the gas removal apparatus includes:

a pressure transducer;

a chemical supply valve; and

a headspace removal valve;

wherein said headspace removal valve is operatively coupled with at least one sensor comprising any of a bubble sensor, a photodetector, and a capacitive sensor, to effect removal of gas from the pressure dispense package, and said chemical supply valve is adapted to modulate flow of the liquid dispensed from the pressure dispense package.

52. The system of claim 51, further comprising a controller operatively coupled with the pressure transducer, the at least one sensor, and any of the chemical supply valve and the headspace removal valve, to control pressure dispensing from the pressure dispense package.

53. The system of claim 31, further comprising a filter adapted for any of (1) preventing passage of particles through a flow regulation device associated with the at least one pressure dispense package, and (2) restricting the passage of bubbles into the reservoir.

54. The system of claim 31, further comprising a filter disposed in fluid communication between the at least one package and the reservoir.

55. The system of claim 31, in at least intermittent fluid communication with a source of cleaning fluid, the system further comprising a controller adapted to initiate a cleaning operation utilizing said cleaning fluid for cleaning at least a portion of said gas removal apparatus.

56. The system of claim 2, wherein the gas removal apparatus includes a valve that is arranged to open and selectively discharge said headspace gas and said ingress gas, said valve being adapted to prevent egress of liquid through the valve.

57. The system of claim 2, wherein said valve includes a housing having a float element therein, and said float element is translatable between a closed position at which fluid is prevented from egress from the valve, and at least one non-closed position at which gas can flow through and egress the valve, and any liquid present in the housing is prevented from egress through the valve.

58. The system of claim 1, further comprising an empty detect apparatus adapted to detect an empty or approach to empty state of said at least one package.

59. The system of claim 58, wherein the empty detect apparatus includes a pressure transducer.

60. The system of claim 59, wherein the pressure transducer is adapted to sense pressure droop of fluid dispensed from said package and to responsively generate a corresponding output.

61. The system of claim 1, wherein said at least one pressure dispense package comprises a first and a second pressure dispense package, and the system further comprises a control system arranged to generate an output signal indicative of any of said first package and said second package being at or near an empty state.

62. The system of claim 61, wherein, responsive to said output signal, said control system effects automatic switching from a first state of dispensation of fluid from one of the first or the second pressure dispense package to a second state of dispensation of fluid from the other of the first or the second pressure dispense package when one of the first or the second pressure dispense package is at or near said empty state.

63. The system of claim 1, further comprising a reservoir adapted to supply fluid deriving from said at least one package, when any of said at least one package is empty or near empty of said fluid.

64. The system of claim 1, as adapted for switching upon an empty or near empty state of a first package of said at least one package to a second package of said at least one package, for continuity of pressure dispensing of said fluid.

65. The system of claim 1, wherein the at least one package and gas removal apparatus are interconnected by flow circuitry containing at least one fluid control device comprising any of a solenoid valve and a pressure regulator.

66. The system of claim 65, wherein the pressure regulator comprises a current to pressure controlled regulator.

67. A method comprising:

(a) pressure dispensing fluid from the system of any of claims 1-65, (b) removing headspace gas from the at least one package prior to the pressure dispensing of fluid therefrom, and (c) removing ingress gas entering the liquid subsequent to removal of said headspace gas from the package, throughout the pressure dispensing.

68. The method of claim 67, comprising manufacture of a microelectronic device.

69. The method of claim 68, wherein the microelectronic device comprises any of a semiconductor product and a flat panel display.

70. A connector adapted to mate with a pressure dispense package, the connector comprising a gas removal apparatus adapted to remove gas from the pressure dispense package before and during dispensing of a liquid therefrom, wherein the gas prior to removal thereof contacts the liquid.

71. The connector of claim 70, wherein the gas removal apparatus is adapted to remove (i) headspace gas from the package prior to dispensation of liquid therefrom, and (ii) ingress gas entering the at least one package subsequent to removal of said headspace gas from the package.

72. The connector of claim 70, wherein the gas removal apparatus comprises a ventable reservoir adapted to receive said liquid from the pressure dispense package.

73. The connector of claim 72, wherein the ventable reservoir comprises a gas outlet disposed at a first level, and comprises a liquid outlet disposed at a second level arranged below the first level

74. The connector of claim 73, wherein the gas removal apparatus further comprises at least one sensor adapted to sense accumulation of gas within the reservoir, and to responsively generate an output signal indicative of such condition.

75. The connector of claim 74, wherein the at least one sensor comprises any of a capacitive sensor, a photosensor, and an optical sensor.

76. The connector of claim 75, wherein any sensor of the at least one sensor is teachable.

77. The connector of claim 74, wherein the gas removal apparatus further comprises at least a first control element adapted to effect removal of gas from the reservoir responsive to the output signal.

78. The connector of claim 74, wherein the output signal of the at least one sensor is indicative of any of:

presence of a gas, absence of a gas, presence of a liquid, absence of a liquid, presence of a bubble, and presence of a liquid-gas interface.

79. The connector of claim 72, wherein the ventable reservoir has a vertical axis, an average internal cross-sectional area perpendicular to the vertical axis, and a gas collection zone disposed along an upper boundary of the ventable reservoir, wherein the gas collection zone has an internal cross-sectional area perpendicular to the vertical axis that is substantially smaller than the average internal cross-sectional area of the ventable reservoir.

80. The connector of claim 79, wherein the gas removal apparatus further comprises:

a sensor adapted to sense accumulation of gas within the gas collection zone, and to responsively generate an output signal indicative of such condition; and

at least a first control element adapted to effect removal of gas from the gas collection zone responsive to the output signal.

81. The connector of claim 79, wherein the internal cross-sectional area of the gas collection zone is less than or equal to about one-half the average internal cross-sectional area of the ventable reservoir.

82. The connector of claim 79, wherein the internal cross-sectional area of the gas collection zone is less than or equal to about one-fourth the average internal cross-sectional area of the ventable reservoir.

83. The connector of claim 79, wherein the gas removal apparatus comprises at least one automatically controlled valve.

84. The connector of claim 72, further comprising a filter disposed upstream of the reservoir.

85. The connector of claim 70, wherein the pressure dispense package has a liner disposed therein to hold a liquid, and wherein the connector comprises:

a main body portion defining a reservoir and including a probe that interfaces with the liner to provide a fluid-tight seal between the liner and probe, with the probe including a conduit extending upwardly into the reservoir and terminating at an upper end therein below an upper end of the reservoir, so that liquid flowing upwardly in the connector passes through the conduit and flows from the upper end thereof into the reservoir, for disengagement in the reservoir of gas from the liquid, to form a liquid level interface between the liquid and the gas in the reservoir;

at least one sensor in sensor relationship with the reservoir;

a liquid discharge valve;

a gas discharge valve; and

a valve controller operatively coupled with the at least one sensor and responsively arranged to control said gas discharge valve and liquid discharge valve so as to separate gas from liquid in said reservoir, and to separately discharge said gas and said liquid.

86. The connector of claim 85, wherein said valve controller comprises an integrated circuit logic controller disposed in said main body portion.

87. The connector of claim 85, wherein a pressure transducer is disposed in said main body portion, operatively coupled with said valve controller, and arranged to detect an empty condition in the container to which the connector is coupled.

88. The connector of claim 85, wherein said at least one sensor comprises a plurality of level sensors.

89. The connector of claim 70, coupled in fluid-receiving relationship with a pressurized gas source.

90. The connector of claim 70, coupled in fluid-donating relationship with a semiconductor fabrication process tool adapted to utilize said liquid.

91. A liquid dispensing system, comprising the connector of any of claims 70-90 coupled with a pressure dispense package.

92. The liquid dispensing system of claim 91, wherein said pressure dispense package includes a liner disposed within an overpack container

93. The liquid dispensing system of claim 92, further comprising a chemical reagent disposed within said liner.

94. The liquid dispensing system of claim 93, wherein the chemical reagent comprises a microelectronic device manufacturing chemical reagent.

95. A semiconductor processing system comprising the liquid dispensing system of claim 91.

96. A method comprising:

(a) pressure dispensing fluid from at least one pressure dispense package through the connector of any of claims 70-90, (b) removing headspace gas from the at least one package prior to the pressure dispensing of fluid therefrom, and (c) removing ingress gas entering the liquid subsequent to removal of said headspace gas from the package, throughout the pressure dispensing.

97. The method of claim 96, further comprising manufacture of a microelectronic device.

98. The method of claim 96, wherein the microelectronic device comprises any of a semiconductor product and a flat panel display.

99. A method comprising:

(a) pressure dispensing liquid from a pressure dispense package, (b) removing headspace gas from the package prior to the pressure dispensing of liquid therefrom to a fluid-utilizing application, and (c) removing unwanted gas entering the liquid subsequent to removal of said headspace gas from the package, throughout the pressure dispensing.

100. The method of claim 99, wherein said package comprises a liquid-containing liner disposed within an overpack container, said pressure dispensing comprises supplying a pressurized gas to a space between the liner and the overpack container.

101. The method of claim 99, further comprising:

passing said liquid to a ventable gas/liquid separation zone in a connector coupled with said package;

sensing presence or accumulation of gas in the gas/liquid separation zone; and

venting said gas from the gas/liquid separation zone responsive to the sensing step.

102. The method of claim 99, further comprising:

passing said liquid to a ventable reservoir fluidically coupled with said package;

sensing presence or accumulation of gas in the reservoir; and

venting said gas from the reservoir responsive to the sensing step.

103. The method of any of claim 101 or 102, wherein dispensation of liquid from the package to a liquid-utilizing process is performed continuously during said venting.

104. The method of any of claim 101 or 102, further comprising interrupting said pressure dispensing during said venting.

105. The method of any of claim 101 or 102, wherein the sensing and venting steps are repeated multiple times prior to complete dispensation of substantially all liquid contents from the pressure dispense package.

106. The method of any of claim 101 or 102, wherein the sensing step employs a capacitive sensor.

107. The method of any of claim 101 or 102, wherein the sensing step employs a photosensor or optical sensor.

108. The method of any of claim 101 or 102, wherein said liquid comprises a microelectronic device manufacturing chemical reagent.

109. The method of claim 108, comprising manufacture of a microelectronic device.

110. The method of claim 109, wherein the microelectronic device comprises any of a semiconductor product and a flat panel display.

111. A system adapted to perform the method of any of claim 101 or 102.