Paste Composition for Forming Heat-Resistant Conductive Patterns on Substrate

• US 20100133484A1
• Filed: 11/30/2009
• Published: 06/03/2010
• Est. Priority Date: 12/01/2008
• Status: Abandoned Application

• Current Assignee: exax, Inc.
• Original Assignee: exax, Inc.
• Inventors: Heo, Soon Yeong, Park, Seong Sil
• Application Number:
  US12/627,392
• Publication Number:
  US 20100133484A1
• Time in Patent Office: Days
• US Class Current: 252/511
• CPC Class Codes: H01B 1/22 the conductive material comprising metals or alloys
• CPC Class Codes: H05K 1/095 for polymer thick films, i.e. having a permanent organic polymeric binder
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/0154 Polyimide
• CPC Class Codes: H05K 3/341 Surface mounted components

Abstract

A paste composition for forming heat-resistant and electrically conductive patterns on substrate by direct printing includes conductive particles, polyamic acid, and solvent. The paste composition can form solderable electric circuits or solderable antenna on substrate, especially on flexible sheets by direct printing to simplify processes, to save time and cost, and to minimize waste.

Claims

1. A paste composition for forming heat-resistant and electrically conductive patterns by direct printing comprising:

conductive particles;

polyamic acid; and

solvent.

2. The paste composition according to claim 1, wherein the polyamic acid is defined as Formula 1 as below

where R1 and R2, respectively, are a hydrocarbon chain or a hetero-atomic chain having N, O and/or S, or indicate a bridge or fusion between benzene rings.

3. The paste composition according to claim 2, wherein the polyamic acid are prepared by polyaddition of aromatic diacid anhydride defined as formula 2 below and aromatic diamine defined as formula 3 below

where R1 and R2, respectively, are a hydrocarbon chain or a hetero-atomic chain having N, O and/or S, or indicate a bridge or fusion between benzene rings.

4. The paste composition according to claim 3, wherein the aromatic diacid anhydride defined is 1,2,4,5-benzentetracarboxylic dianhydride, 3,3′

,4,4′

-benzophenonetetracarboxylic dianhydride (“

BTDA”

), oxydiphthalic anhydride (“

ODPA”

), 3,3′

,4,4′

-diphenylsulfonetetracarboxylic anhydride(“

DSDA”

), biphenyltetracarboxylic dianhydride(“

BPDA”

), 3-hydroquinone-o,o′

-diacetic anhydride(“

HQDA”

) or 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride(“

BPADA”

); and

the aromatic diamine is m-phenylenediamine, p-phenylenediamine, oxydianyline, 4,4′

-diaminodiphenylsulfone or 4,4′

-diaminobenzophenone.

5. The paste composition according to claim 3, wherein the solvent or the medium for the polyamic acid, the aromatic diacid anhydride and the aromatic diamine is selected from the group consisting of N,N-dimethylformamide, N,N-dimethylacetamide, N-methylpyrrolidone, tetramethylurea, dimethylsulfoxide and mixture thereof.

6. The paste composition according to claim 3, wherein the conductive particles are particles of electrically conductive material selected from the group consisting of metal, nonmetal, oxides, carbides, borides, nitrides, carbonitrides and carboneous material.

7. The paste composition according to claim 1, wherein the substrate is paper, polyester film or polyimide film.

8. The paste composition according to claim 1, wherein the direct printing is brushing, spraying, roller coating, screen printing, gravure printing, offset printing, flexography, dispensing, rotary screen printing or inkjet printing.

9. The paste composition according to claim 1, wherein the conductive patterns are Rfid antenna.