LIGHT EMITTING APPARATUS
First Claim
1. A light emitting apparatus, comprising:
- a plurality of LED chips;
a substrate provided with a first electrode connected in common to ends of the plurality of LED chips and second electrodes formed to correspond respectively to the plurality of LED chips;
an upper package formed on the substrate to surround the plurality of LED chips and to have a partition crossing the first electrode at the center of the upper package;
and a molding member for encapsulating the plurality of LED chips,wherein the molding member is divided by the partition of the upper package.
0 Assignments
0 Petitions
Accused Products
Abstract
The present invention provides a light emitting apparatus comprising a three-color light emitting device unit including at least three light emitting diode (LED) chips for respectively emitting red, green and blue light; a white light emitting device unit including at least one blue LED chip with a fluorescent substance formed thereon; and a substrate provided with a first electrode connected in common to ends of the LED chips and second electrodes formed to correspond respectively to the LED chips. Further, the present invention provides a light emitting apparatus comprising a plurality of LED chips; a substrate provided with a first electrode connected in common to ends of the plurality of LED chips and second electrodes formed to correspond respectively to the plurality of LED chips; an upper package formed on the substrate to surround the plurality of LED chips and to have a partition crossing the first electrode at the center of the upper package; and a molding member that encapsulates the plurality of LED chips and is divided by the partition of the upper package.
18 Citations
6 Claims
-
1. A light emitting apparatus, comprising:
-
a plurality of LED chips; a substrate provided with a first electrode connected in common to ends of the plurality of LED chips and second electrodes formed to correspond respectively to the plurality of LED chips; an upper package formed on the substrate to surround the plurality of LED chips and to have a partition crossing the first electrode at the center of the upper package; and a molding member for encapsulating the plurality of LED chips, wherein the molding member is divided by the partition of the upper package. - View Dependent Claims (2, 3, 4, 5, 6)
-
Specification