Method for Producing Semiconductor Components and Thin-Film Semiconductor Component
First Claim
Patent Images
1. A method for producing semiconductor components, comprising the steps of:
- forming a layer composite containing a semiconductor material on a growth substrate;
applying a flexible carrier layer to the layer composite;
curing the flexible layer to form a self-supporting carrier layer; and
stripping away the growth substrate.
2 Assignments
0 Petitions
Accused Products
Abstract
The invention relates to a method for producing semiconductor components, wherein a layer composite (6) containing a semiconductor material is formed on a growth substrate (1), a flexible carrier layer is applied to the layer composite (6), the flexible carrier layer is cured to form a self-supporting carrier layer (2), and the growth substrate (1) is stripped away. As an alternative, the carrier layer (2) may have a base layer (2b) and an adhesion layer (2a) adhering on the layer composite.
58 Citations
78 Claims
-
1. A method for producing semiconductor components, comprising the steps of:
-
forming a layer composite containing a semiconductor material on a growth substrate; applying a flexible carrier layer to the layer composite; curing the flexible layer to form a self-supporting carrier layer; and stripping away the growth substrate. - View Dependent Claims (10, 11, 12, 63, 64, 65, 66, 67, 68, 69, 70, 71, 72, 73, 74, 75, 76, 77, 78)
-
-
2. A method for producing semiconductor components, comprising the steps of:
-
forming a layer composite containing a semiconductor material on a growth substrate; applying a self-supporting carrier layer to the layer composite, wherein the carrier layer has a base layer and an adhesion layer, which faces the layer composite and which adheres on the layer composite; and stripping away the growth substrate. - View Dependent Claims (3, 4, 5, 6, 7, 8, 9, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
-
-
25. A thin-film semiconductor component comprising:
-
a layer stack; and a self-supporting carrier layer arranged on the layer stack, wherein the carrier layer is cured. - View Dependent Claims (32, 33, 34, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62)
-
-
26. A thin-film semiconductor component comprising:
-
a layer stack; a self-supporting carrier layer arranged on the layer stack, wherein the carrier layer has a base layer and an adhesion layer, which faces the layer stack and which adheres on the layer stack. - View Dependent Claims (27, 28, 29, 30, 31, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47)
-
Specification