RADIO FREQUENCY IDENTIFICATION INLAY WITH IMPROVED READABILITY
First Claim
1. A radio-frequency identification (RFID) inlay comprising:
- a microchip;
an antenna coupled to a port of the microchip;
a ground-plane disposed substantially parallel to the antenna; and
a high-impedance body disposed substantially parallel to the antenna and between the antenna and the ground-plane.
1 Assignment
0 Petitions
Accused Products
Abstract
A radio-frequency identification (RFID) inlay is provided that is substantially isolated from the environment in proximity to one side of the device. A radio-frequency identification (RFID) inlay is provided including a two-port microchip having a first and a second port, a first antenna coupled to the first port of the two-port microchip, a ground-plane, a first high-impedance body disposed substantially parallel to the first antenna and between the first antenna and the ground-plane, the first high-impedance body insulated from the ground-plane. The RFID inlay further includes a second antenna coupled to the second port of the two-port microchip, and a second high-impedance body disposed substantially parallel to the second antenna and between the second antenna and the ground-plane, the second high-impedance body insulated from the ground-plane.
42 Citations
28 Claims
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1. A radio-frequency identification (RFID) inlay comprising:
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a microchip; an antenna coupled to a port of the microchip; a ground-plane disposed substantially parallel to the antenna; and a high-impedance body disposed substantially parallel to the antenna and between the antenna and the ground-plane. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A radio-frequency identification (RFID) inlay comprising:
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a two-port microchip having a first and a second port;
a first antenna coupled to the first port of the two-port microchip;a ground-plane; a first high-impedance body disposed substantially parallel to the first antenna and between the first antenna and the ground-plane, the first high-impedance body insulated from the ground-plane; a second antenna coupled to the second port of the two-port microchip; and a second high-impedance body disposed substantially parallel to the second antenna and between the second antenna and the ground-plane, the second high-impedance body insulated from the ground-plane. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28)
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Specification