WIDEBAND RF 3D TRANSITIONS

• US 20100134376A1
• Filed: 12/01/2008
• Published: 06/03/2010
• Est. Priority Date: 12/01/2008
• Status: Abandoned Application

• Current Assignee: Toyota Motor Engineering & Manufacturing North America Incorporated (Toyota Motor Corporation)
• Original Assignee: Toyota Motor Engineering & Manufacturing North America Incorporated (Toyota Motor Corporation)
• Inventors: Margomenos, Alexandros, Rida, Amin
• Application Number:
  US12/325,652
• Publication Number:
  US 20100134376A1
• Time in Patent Office: Days
• US Class Current: 343/848
• CPC Class Codes: H01L 2223/6627 Waveguides, e.g. microstrip line, strip line, coplanar line
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01P 5/028 between strip lines
• CPC Class Codes: H01Q 13/206 Microstrip transmission line antennas
• CPC Class Codes: H01Q 21/0037 linear waveguide fed arrays
• CPC Class Codes: H01Q 21/065 Patch antenna array

Abstract

Apparatus and methods according to examples of the present invention include providing an electrical interconnection between an RF circuit and an antenna, the electrical interconnection including a transition via through an antenna substrate. The electrical connection can be configured so as to provide low losses.

Claims

1. An apparatus, the apparatus being a radar apparatus comprising:

an antenna substrate, having a first side and a second side;

an antenna disposed on the first side of the antenna substrate;

a transition between the first and second sides of the antenna substrate, the transition including;

a first via pad supported by the first side of the antenna substrate;

a second via pad supported by the second side of the antenna substrate; and

a transition via passing through the antenna substrate, connecting the first and second via pads; and

an antenna feed supported by the first side of the antenna substrate, the antenna feed electrically interconnecting the first via pad and at least part of the antenna,

the transition via, first via pad, and second via pad being configured so that the transition is impedance matched to the antenna feed.

2. The apparatus of claim 1, the first side of the antenna substrate supporting a ground region,

the ground region partially surrounding the first via pad and being spaced apart from it by a gap.

3. The apparatus of claim 2, the apparatus further comprising shorting vias between the ground region and a ground plane adjacent the second side of the antenna substrate.

4. The apparatus of claim 2, the antenna feed comprising a coplanar waveguide and a microstrip line, the coplanar waveguide ending at the first via pad,

the ground region extending around the first via pad and the coplanar waveguide.

5. The apparatus of claim 4, the ground region being tapered, the ground region having an edge extending at an oblique angle relative to the microstrip line.

6. The apparatus of claim 4, the an edge extending at an oblique angle relative to the microstrip line having a rounded profile.

7. The apparatus of claim 4, the shorting vias being positioned so as to suppress edge radiation from the coplanar waveguide.

8. The apparatus of claim 1, the capacitance of the via pads and self-inductance of the transition via giving a transition impedance of 50 ohms.

9. The apparatus of claim 1, the apparatus further comprising:

a radio-frequency circuit (RF circuit) supported on the second side of the substrate, and

a co-planar waveguide on the second side of the antenna substrate electrically interconnecting the RF circuit and the second via pad.

10. The apparatus of claim 9, the electrical interconnection between the RF circuit and the antenna having a loss of less than −

18 db between 60 GHz and 90 GHz.

11. The apparatus of claim 9, the RF circuit being flip-chip mounted to the second side of the antenna substrate.

12. The apparatus of claim 9, further comprising a circuit board adjacent the second side of the antenna substrate,

the circuit board supporting an electronic control circuit in communication with the RF circuit.

13. The apparatus of claim 1, the antenna substrate comprising a polymer.

14. An apparatus, the apparatus being a radar apparatus comprising:

an antenna substrate, having a first side and a second side;

an antenna disposed on the first side of the antenna substrate, an transition between the first side and the second side, the transition comprising;

a first via pad supported by the first side of the antenna substrate;

a second via pad supported by the second side of the antenna substrate; and

a transition via passing through the antenna substrate, connecting the first and second via pads;

an antenna feed supported by the first side of the antenna substrate, the antenna feed interconnecting the first via pad and at least part of the antenna;

a ground region supported by the first side, partially surrounding the first via pad and being spaced apart from the first via pad by a gap; and

a ground plane substantially adjacent the second side of the antenna substrate; and

a plurality of shorting vias electrically interconnecting the ground region and the ground plane.

15. The apparatus of claim 14, the antenna comprising an array of conducting patches,

the ground plane partially surrounding the second via pad and extending beneath the array of conducting patches so as to provide a ground plane for the antenna.

16. The apparatus of claim 14, the antenna feed comprising a coplanar waveguide portion and a microstrip line,

the coplanar waveguide portion extending between the first via pad and the microstrip line,

the ground region extending around and being spaced apart from the first via pad and the coplanar waveguide.

17. The apparatus of claim 16, the shorting vias being positioned to suppress losses from the coplanar waveguide.

18. The apparatus of claim 16, the ground region having an edge extending away from the microstrip line at an oblique angle to the microstrip line,

the oblique angle being between 10 degrees and 80 degrees, inclusive.

19. The apparatus of claim 16, the ground region having edges extending away from each side of the microstrip line at an oblique angle to the microstrip line, the oblique angle being between 45-80 degrees.

20. The apparatus of claim 14, the apparatus comprising a plurality of transition vias, each transition via interconnecting the RF circuit and a column of antenna patches.

21. An apparatus, the apparatus being a radar apparatus comprising

an antenna substrate, having a first side and a second side;

an antenna, comprising conducting elements supported by the first side of the antenna substrate;

a radio-frequency circuit (RF circuit) substantially adjacent the second side of the antenna substrate;

an electrical interconnection between the antenna and the RF circuit, the electrical interconnection including;

a transition via passing through the antenna substrate and connecting a first via pad on the first side and a second via pad on the second side;

an antenna feed, located on the first side of the antenna substrate and electrically interconnecting the via pad and at least part of the antenna; and

a waveguide connection, located on the second side of the antenna substrate and electrically interconnecting the RF circuit and the second via pad;

a ground region on the first side, the ground region having an edge extending around the first via pad and a portion of the antenna feed, the edge then extending away from the antenna feed at an oblique angle;

a ground plane substantially adjacent the second side of the antenna substrate; and

a plurality of shorting vias between the ground region and the ground plane,

the electrical interconnection between the antenna and the RF circuit presenting a generally constant impedance so as to reduce

22. The apparatus of claim 21, the electrical interconnection having a return loss of less than −

18 decibels for the frequency range 60-90 gigahertz.

23. The apparatus of claim 21, the apparatus being a radio-frequency front end assembly for a radar,

the antenna being a patch antenna comprising an array of conducting patches supported by the first side of the antenna substrate,

the apparatus comprising a plurality of an electrical interconnections, each electrical connection connecting to a group of antenna elements.

24. The apparatus of claim 21, the antenna feed comprising a coplanar waveguide portion and a microstrip line,

the coplanar waveguide portion comprising a conducting stripe having portions of the ground region proximate each side thereof,

the microstrip line electrically interconnecting the first coplanar waveguide with the antenna.

25. The apparatus of claim 24, the conducting stripe of the coplanar waveguide being narrower than the microstrip line.

26. The apparatus of claim 21, the apparatus further comprising a circuit board adjacent the second side of the antenna substrate,

the circuit board supporting an electronic control circuit in electrical communication with the RF circuit, the control circuit comprising a microprocessor,

the circuit board further supporting a conducting sheet located so as to provide the ground plane.

27. The apparatus of claim 21, the antenna substrate forming part of a housing for the RF circuit and the circuit board.

28. The apparatus of claim 21, the transition via comprising an electrical conductor,

the transition via having an outer diameter between 10 microns and 1 mm inclusive,

the transition via having a length approximately equal to an antenna substrate thickness,

the antenna substrate being a generally planar sheet, the antenna substrate thickness being between 10 microns and 1 mm inclusive.