ELECTRONIC COMPONENT MOUNTING MODULE AND ELECTRICAL APPARATUS
First Claim
Patent Images
1. An electronic component mounting module including:
- a non-metallic board having an electronic component, which generates heat when operating, mounted on one surface thereof, and having the other surface disposed on a heat radiating member; and
a metallic fine particle layer formed so as to be made to intervene between the other surface of the board and the heat radiating member.
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Abstract
The invention provides an electronic component mounting module capable of increasing the adhesion between the board and the heat radiating member, improving the thermal conductivity, and effectively radiating heat generated from the LEDs being an electronic component. The LEDs are mounted on the surface of the ceramics board, and the rear surface 1b side of the board is disposed at the heat radiating member. A metallic fine particle layer having high thermal conductivity and flexibility is made to intervene between the board and the heat radiating member.
12 Citations
4 Claims
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1. An electronic component mounting module including:
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a non-metallic board having an electronic component, which generates heat when operating, mounted on one surface thereof, and having the other surface disposed on a heat radiating member; and a metallic fine particle layer formed so as to be made to intervene between the other surface of the board and the heat radiating member. - View Dependent Claims (2, 3, 4)
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Specification