Substrate Bonding Apparatus and Substrate Bonding Method

• US 20100139836A1
• Filed: 02/10/2010
• Published: 06/10/2010
• Est. Priority Date: 08/10/2007
• Status: Active Grant

• Current Assignee: Nikon Corporation
• Original Assignee: Nikon Corporation
• Inventors: HORIKOSHI, Takahiro
• Granted Patent: US 8,454,771 B2
• Time in Patent Office: Days
• US Class Current: 156/64
• CPC Class Codes: H01L 21/67092 Apparatus for mechanical treatment or grinding or cutting, see the relevant groups in subclasses B24B or B28D
• CPC Class Codes: H01L 21/68 for positioning, orientation or alignment
• CPC Class Codes: H01L 22/12 for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions electrical measurement of diffusions H01L22/14
• CPC Class Codes: H01L 2223/5442 comprising non digital, non alphanumeric information, e.g. symbols
• CPC Class Codes: H01L 2223/54426 for alignment
• CPC Class Codes: H01L 2223/54453 for use prior to dicing
• CPC Class Codes: H01L 2223/54493 Peripheral marks on wafers, e.g. orientation flats, notches, lot number
• CPC Class Codes: H01L 23/544 Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A substrate bonding apparatus is equipped with a first table that holds one wafer of two wafers, a stage device that holds the other wafer in an orientation capable of opposing to the one wafer and that is movable at least within an XY plane, an interferometer system that measures positional information of the stage device within the XY plane, a first mark detection system that can detect subject marks including alignment marks on the other wafer held by the stage device, and a second mark detection system fixed to a part (the second table) of the stage device that can detect subject marks including alignment marks on the one wafer held by the first table.

Claims

1. A substrate bonding apparatus that bonds two substrates, the apparatus comprising:

a first stage that holds one substrate of the two substrates;

a second stage that holds the other substrate of the two substrates in an orientation capable of opposing to the one substrate, and is movable relative to the first stage at least within a two-dimensional plane;

a position measuring system that measures positional information of the second stage at least within the two-dimensional plane;

a first detection system that can detect a subject mark that includes a mark on the substrate held by the second stage; and

a second detection system mounted on the second stage, which can detect a subject mark that includes a mark on the substrate held by the first stage.

2. The substrate bonding apparatus according to claim 1, wherein

the second detection system is fixed to the second stage.

3. The substrate bonding apparatus according to claim 1, wherein

at least one of the first detection system and the second detection system can simultaneously detect a plurality of marks arranged on the substrate that is subject to the detection.

4. The substrate bonding apparatus according to claim 3, wherein

at least one of the first detection system and the second detection system includes a plurality of detection devices that can individually detect each of the plurality of marks.

5. The substrate bonding apparatus according to claim 4, wherein

of the plurality of detection devices, one detection device and the other detection device are relatively movable within the two-dimensional plane.

6. The substrate bonding apparatus according to claim 5, wherein

one of the one detection device and the other detection device is fixed to a member serving as a base on which the one detection device and the other detection device are installed, and the other is movable within the two-dimensional plane with respect to the member serving as the base.

7. The substrate bonding apparatus according to claim 6, further comprising:

a relative position measuring system that measures a relative position of the one detection device and the other detection device within the two-dimensional plane.

8. The substrate bonding apparatus according to claim 5, wherein

the one detection device and the other detection device are independently movable within the two-dimensional plane.

9. The substrate bonding apparatus according to claim 8, further comprising:

a detection system position measuring system that measures positional information of the one detection device and the other detection device within the two-dimensional plane.

10. The substrate bonding apparatus according to claim 1, wherein

the first detection system is opposed to the substrate held by the second stage when the second detection system is opposed to the substrate held by the first stage.

11. The substrate bonding apparatus according to claim 1, wherein

when at least a part of the first detection system and at least a part of the second detection system are opposed to each other, the first stage and a section, on which the substrate is mounted, of the second stage are located on sides opposite to each other with respect to a center of an opposed section of the first detection system that is opposed to the second detection system.

12. The substrate bonding apparatus according to claim 1, wherein

the second stage includes a stage main section that is movable within the two-dimensional plane and a table that is movable at least in a direction orthogonal to the two-dimensional plane on the stage main section and holds the other substrate, and the second detection system is arranged on the stage main section.

13. The substrate bonding apparatus according to claim 12, wherein

the table is movable in a predetermined range in the direction orthogonal to the two-dimensional plane that includes a position with which a surface of the substrate held by the table is positioned at a detection point of the first detection system, and

the position measuring system can further measure positional information of the table in the direction orthogonal to the two-dimensional plane.

14. The substrate bonding apparatus according to claim 12, wherein

the table is movable in a tilt direction with respect to the two-dimensional plane, on the second stage, and

the position measuring system can further measure tilt information of the table.

15. The substrate bonding apparatus according to claim 1, further comprising:

a separation distance measuring system that measures a separation distance between the substrate held by the first stage and the substrate held by the second stage.

16. The substrate bonding apparatus according to claim 1, wherein

the position measuring system includes a plurality of interferometers each of which irradiates a reflection surface arranged on a part of the stage with a measurement beam.

17. The substrate bonding apparatus according to claim 1, wherein

a detection subject of the first detection system further includes a first fiducial mark, and

a detection subject of the second detection system further includes a second fiducial mark.

18. The substrate bonding apparatus according to claim 17, wherein

the first fiducial mark and the second fiducial mark are formed on a same mark member.

19. The substrate bonding apparatus according to claim 18, wherein

the second detection system can detect the second fiducial mark concurrently with the first detection system detecting the first fiducial mark.

20. The substrate bonding apparatus according to claim 19, wherein

the first fiducial mark and the second fiducial mark are a same mark.

21. The substrate bonding apparatus according to claim 20, wherein

the same mark includes a slit-shaped light-transmitting section formed in a membrane-like member that is arranged on a part of the mark member.

22. The substrate bonding apparatus according to claim 21, wherein

the slit-shaped light-transmitting section is formed by removing a part of a light-shielding membrane formed on a surface of a transparent film.

23. The substrate bonding apparatus according to claim 21, wherein

the slit-shaped light-transmitting section is formed by forming a slit-shaped opening in a part of a plate-shaped light-shielding member.

24. The substrate bonding apparatus according to claim 18, wherein

the mark member transmits a probe beam of the first and second detection systems.

25. The substrate bonding apparatus according to claim 24, further comprising:

a tilt measuring system that measures a tilt of the mark member.

26. The substrate bonding apparatus according to claim 18, wherein

the mark member is movable between a position with which a corresponding fiducial mark is positioned within a detection field of at least one the first and second detection systems, and a withdrawal position to which the mark member withdraws from the position.

27. The substrate bonding apparatus according to claim 26, further comprising:

a mark driving device that drives the mark member.

28. The substrate bonding apparatus according to claim 27, wherein

the mark driving device is arranged on the second stage.

29. The substrate bonding apparatus according to claim 1, wherein

the first detection system includes one of a transmissive microscope that detects a beam transmitted through a subject mark and a reflective microscope that detects a reflected beam from the subject mark, and

the second detection system includes one of the transmissive microscope and the reflective microscope.

30. The substrate bonding apparatus according to claim 1, wherein

the first stage is movable in the direction orthogonal to the two-dimensional plane.

31. The substrate bonding apparatus according to claim 30, wherein

the first stage is movable between a first position with which a surface of the substrate held by the first stage is positioned in a plane parallel to the two-dimensional plane that includes a detection point of the second detection system, and a second position to which the first stage withdraws from the first position.

32. The substrate bonding apparatus according to claim 1, wherein

the first stage and the second stage each hold the substrate via a substrate holding member.

33. A substrate bonding method of bonding two substrates, the method comprising:

a first process of causing a first member to hold a first substrate that is one of the two substrates;

a second process of causing a second member that is movable at least within a two-dimensional plane to which the first member is opposed to hold a second substrate that is the other of the two substrates;

a third process of detecting a common fiducial mark using a first detection system and a second detection system that is mounted on the second member, respectively;

a fourth process of detecting a plurality of alignment marks on the second substrate held by the second member using the first detection system, and measuring positional information of the second member at the time of detection of each of the alignment marks;

a fifth process of detecting a plurality of alignment marks on the first substrate held by the first member using the second detection system, and measuring the positional information of the second member at the time of detection of each of the alignment marks; and

a sixth process of overlaying the two substrates based on results of the third, fourth and fifth processes.

34. The substrate bonding method according to claim 33, wherein

in each of the fourth process and the fifth process, the second member is moved within the two-dimensional plane.

35. The substrate bonding method according to claim 33, wherein

in the fourth process, the plurality of alignment marks on the second substrate are simultaneously detected using a plurality of detection devices that the first detection system has, and

in the fifth process, the plurality of alignment marks on the first substrate are simultaneously detected using a plurality of detection devices that the second detection system has.

36. The substrate bonding method according to claim 35, wherein

in at least one of the fourth process and the fifth process, prior to the detection of the plurality of alignment marks, one detection device and the other detection device of the plurality of detection devices are relatively moved within the two-dimensional plane and the alignment mark is positioned within a detection field of each of the one detection device and the other detection device.

37. The substrate bonding method according to claim 33, wherein

in the fourth process, prior to the detection of the plurality of alignment marks, at least a section, which holds the second substrate, of the second member is driven in a direction orthogonal to the two-dimensional plane and a surface of the second substrate is positioned at a detection point of the first detection system.

38. The substrate bonding method according to claim 37, wherein

in the fourth process, after the detection of the plurality of alignment marks, at least the section, which holds the second substrate, of the second member is driven in the direction orthogonal to the two-dimensional plane and the surface of the second substrate is withdrawn from the detection point of the first detection system.

39. The substrate bonding method according to claim 33, wherein

in the fifth process, prior to the detection of the plurality of alignment marks, the first member is driven in the direction orthogonal to the two-dimensional plane and a surface of the first substrate is positioned at a detection point of the second detection system.

40. The substrate bonding method according to claim 33, wherein

in the third process, prior to the detection of the fiducial mark, a mark member on which the fiducial mark is formed is positioned at a predetermined position and the fiducial mark is detected respectively using the first and second detection systems, and then, the mark member is withdrawn from the predetermined position.

41. The substrate bonding method according to claim 33, wherein

in the third process, further, a baseline of the second detection system with respect to the first detection system is obtained.

42. The substrate bonding method according to claim 41, wherein

in the fourth process, further, a first relative positional relation between the fiducial mark and the plurality of alignment marks arranged on a surface of the second substrate is obtained.

43. The substrate bonding method according to claim 42, wherein

in the fifth process, further, a second relative positional relation between the fiducial mark and the plurality of alignment marks arranged on a surface of the first substrate is obtained.

44. The substrate bonding method according to claim 43, wherein

in the sixth process, further, a target position of the second member is obtained from the baseline, the first relative positional relation and the second relative positional relation, the target position satisfying a desired overlaying condition of the two substrates that are held by the second member and the first member, respectively.

45. The substrate bonding method according to claim 44, wherein

the desired overlaying condition is a positional relation in which a square sum of a relative distance on the two-dimensional plane between the alignment marks being paired, among the plurality of alignment marks arranged on the surfaces of the two substrates, is the minimum.

46. The substrate bonding method according to claim 44, wherein

the desired overlaying condition is a positional relation in which an absolute value of a relative distance on the two-dimensional plane between the alignment marks being paired, among the plurality of alignment marks arranged on the surfaces of the two substrates, is substantially equal for all pairs of the plurality of alignment marks.

47. The substrate bonding method according to claim 44, wherein

the sixth process further includes a process of overlaying the first substrate and the second substrate by positioning the second member at the target position and driving at least the section, which holds the second substrate, of the second member in the direction orthogonal to the two-dimensional plane.

48. The substrate bonding method according to claim 33, wherein

the sixth process includes a process of computing the target position of the second member that satisfies a desired overlaying condition of the first and second substrates using results of the third, fourth and fifth processes.

49. The substrate bonding method according to claim 48, wherein

the desired overlaying condition is a positional relation in which a square sum of a relative distance on the two-dimensional plane between the alignment marks being paired, among the plurality of alignment marks arranged on the surfaces of the two substrates, is the minimum.

50. The substrate bonding method according to claim 48, wherein

the desired overlaying condition is a positional relation in which an absolute value of a relative distance on the two-dimensional plane between the alignment marks being paired, among the plurality of alignment marks arranged on the surfaces of the two substrates, is substantially equal for all pairs of the plurality of alignment marks.

51. The substrate bonding method according to claim 48, wherein

the sixth process further includes a process of overlaying the first substrate and the second substrate by positioning the second member at the target position and driving at least the section, which holds the second substrate, of the second member in the direction orthogonal to the two-dimensional plane.

52. The substrate bonding method according to claim 33, further comprising:

a seventh process of measuring positional information that includes a rotational direction within the two-dimensional plane of the first substrate held by the first member, wherein

in the second process, the second member is caused to hold the second substrate in a state where at least a rotational deviation of the second substrate with respect to the first substrate is adjusted taking the measured positional information into consideration.

53. The substrate bonding method according to claim 52, further comprising:

a process of withdrawing the first substrate held by the first member by driving the first member in a direction perpendicular to the two-dimensional plane, prior to the second process.

54. The substrate bonding method according to claim 33, further comprising:

a seventh process of measuring positional information that includes a rotational direction within the two-dimensional plane of the first substrate held by the first member; and

an eighth process of adjusting at least a rotational deviation of the second substrate with respect to the first substrate, by rotating at least the section, which holds the second substrate, of the second member, taking the positional information measured in the seventh process into consideration, the eight process being performed between the second process and the fourth process.

55. The substrate bonding method according to claim 54, further comprising:

a process of withdrawing the first substrate held by the first member by driving the first member in a direction perpendicular to the two-dimensional plane, prior to the second process.

56. The substrate bonding method according to claim 33, wherein

in the first and second processes, the first member and the second member are caused to hold the first substrate and the second substrate via two holding members, respectively, and

in the six process, further, the two holding members are fixed in an overlaid state using an attachment, and the two holding members are detached from the first member and the second member, respectively.

57. The substrate bonding method according to claim 33, wherein

in the fourth process and the fifth process, the positional information of the second member is measured using a position measuring system that includes at least three interferometers, the at least three interferometers being at least one interferometer that irradiates at least one measurement beam on a reflection surface arranged on the second member so as to be orthogonal to the two-dimensional plane and at least two interferometers that each irradiate at least one measurement beam on another reflection surface arranged on the second member so as to be orthogonal to the two-dimensional plane and the reflection surface.

58. The substrate bonding method according to claim 33, wherein

the first member is caused to hold a fiducial member on which a plurality of marks between which a relative positional relation is known is arranged, the second member is moved within the two-dimensional plane while the positional information of the second member is measured, and the relative positional relation of the plurality of marks is re-measured by detecting the plurality of marks using the second detection system, and then a detection error of the second detection system that depends on a physical quantity related to a position of the second member is corrected using the re-measured relative positional relation and the known relative positional relation.

59. The substrate bonding method according to claim 58, wherein

the relative positional relation between the plurality of marks is obtained by causing the second member to hold the fiducial member, moving the second member within the two-dimensional plane while measuring the positional information of the second member and detecting the plurality of marks using the first detection system.

60. The substrate bonding method according to claim 58, wherein

the physical quantity related to the position of the second member includes at least one of a stop position of the second member, and a distance, a direction, a time, a speed and an acceleration from another stop position of the second member to the stop position, the another stop position being a position of the second member just before the second member reaches the stop position.

61. A substrate bonding method of bonding two substrates, the method comprising:

a first process of causing a first member to hold a first substrate that is one of the two substrates, parallel to a predetermined two-dimensional plane;

a second process of measuring positional information that includes a rotational direction within the two-dimensional plane of the first substrate held by the first member;

a third process of causing a second member that is movable within the two-dimensional plane to hold a second substrate that is the other of the two substrates; and

a fourth process of bonding both the substrates by adjusting a relative position of the second substrate held by the second member with respect to the first substrate held by the first member.

62. The substrate bonding method according to claim 61, wherein

in the third process, the second member is caused to hold the second substrate in a state where at least a rotational deviation of the second substrate with respect to the first substrate is adjusted taking the measured positional information into consideration.