DEVICE APPLICATIONS FOR VOLTAGE SWITCHABLE DIELECTRIC MATERIAL HAVING HIGH ASPECT RATIO PARTICLES
First Claim
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1. A device comprising:
- a formation of voltage switchable dielectric (VSD) material, wherein the VSD material comprises;
a binder;
high aspect ratio (HAR) particles that are conductive or semi-conductive and dispersed as nanoscale particles within the binder; and
conductor and/or semiconductor particles;
said conductor and/or semiconductor particles being distributed in the binder;
wherein HAR particles and said conductor and/or semiconductor particles are combined to provide said composition with a characteristic of being (i) dielectric in absence of a voltage that exceeds a characteristic voltage level, and (ii) conductive with application of said voltage exceeding said characteristic voltage level.
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Abstract
One or more embodiments provide for a device that utilizes voltage switchable dielectric material having semi-conductive or conductive materials that have a relatively high aspect ratio for purpose of enhancing mechanical and electrical characteristics of the VSD material on the device.
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Citations
10 Claims
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1. A device comprising:
a formation of voltage switchable dielectric (VSD) material, wherein the VSD material comprises; a binder; high aspect ratio (HAR) particles that are conductive or semi-conductive and dispersed as nanoscale particles within the binder; and conductor and/or semiconductor particles;
said conductor and/or semiconductor particles being distributed in the binder;wherein HAR particles and said conductor and/or semiconductor particles are combined to provide said composition with a characteristic of being (i) dielectric in absence of a voltage that exceeds a characteristic voltage level, and (ii) conductive with application of said voltage exceeding said characteristic voltage level. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. An electronic device comprising:
a layer of voltage switchable dielectric (VSD) material formed by; (i) creating a mixture comprising a binder, metallic and/or inorganic semi-conductor particles, and conductive or semi-conductive organic material; (ii) applying the mixture to a target location on the device; and (iii) curing the mixture at the target location.
Specification