Electronic Device and Method for Manufacturing Thereof

• US 20100140734A1
• Filed: 02/18/2010
• Published: 06/10/2010
• Est. Priority Date: 11/08/2006
• Status: Active Grant

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: WATANABE, Toru, MORI, Takeshi, INABA, Shogo, SATO, Akira
• Granted Patent: US 7,880,245 B2
• Time in Patent Office: Days
• US Class Current: 257/503
• CPC Class Codes: B81B 2207/015 the micromechanical device and the control or processing electronics being integrated on the same substrate
• CPC Class Codes: B81B 2207/07 Interconnects
• CPC Class Codes: B81C 1/00246 Monolithic integration, i.e. micromechanical structure and electronic processing unit are integrated on the same substrate
• CPC Class Codes: B81C 2203/0136 Growing or depositing of a covering layer
• CPC Class Codes: B81C 2203/0714 Forming the micromechanical structure with a CMOS process
• CPC Class Codes: B81C 2203/0735 Post-CMOS, i.e. forming the micromechanical structure after the CMOS circuit
• CPC Class Codes: H01L 21/7682 the dielectric comprising air gaps
• CPC Class Codes: H01L 24/05 of an individual bonding area
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/14 Integrated circuits

Abstract

An electronic device, including a substrate, a functional structure constituting a functional element formed on the substrate, and a cover structure forming a cavity portion in which the functional structure is disposed, is disclosed. In the electronic device, the cover structure includes a laminated structure of an interlayer insulating film and a wiring layer, the laminated structure being formed on the substrate in such a way that it surrounds the cavity portion, and the cover structure has an upside cover portion covering the cavity portion from above, the upside cover portion being formed with part of the wiring layer that is disposed above the functional structure.

Claims

1. An electronic device comprising:

a substrate;

a functional element formed above the substrate;

a guard ring surrounding the functional element, the guard ring being away from the functional element;

an interlayer insulating film surrounding the guard ring;

a first cover layer formed above the guard ring and the functional element, the first cover layer being away from the functional element, the first cover layer including a plurality of holes; and

a second cover layer formed above the first cover layer.

2. The electronic device according to claim 1, wherein the second cover layer includes a conductive material.

3. The electronic device according to claim 2, wherein the conductive material of the second cover layer includes Al, W or Ti.

4. The electronic device according to claim 1, wherein the second cover layer includes an insulating material.

5. The electronic device according to claim 4, wherein the insulating material of the second cover layer includes silicon oxide or silicon nitride.

6. The electronic device according to claim 1, wherein the guard ring includes a first guard ring and a second guard ring formed above the first guard ring.

7. The electronic device according to claim 6, wherein a material of the functional element is the same as a material of the first guard ring.

8. The electronic device according to claim 1, wherein the interlayer insulating film includes a first interlayer insulating film and a second interlayer insulating film formed above the first insulating film.

9. The electronic device according to claim 1 further comprises a passivation film formed above the first cover layer, the passivation film including an opening which exposes a part of the first cover layer, the part of the first cover layer being used as a pad.

10. An electronic device comprising:

a substrate;

a functional element formed above the substrate;

a guard ring surrounding the functional element, the guard ring being away from the functional element;

an interlayer insulating film surrounding the guard ring;

a first cover layer formed above the guard ring and the functional element, the first cover layer being away from the functional element, the first cover layer including a first plurality of holes;

a second cover layer formed above the first cover layer, the second cover layer including a second plurality of holes; and

a third cover layer formed above the second cover layer.

11. The electronic device according to claim 10, wherein the second plurality of holes overlaps the first cover layer in a plan view.

12. The electronic device according to claim 10, wherein a material of the functional element is the same as a material of the guard ring.

13. The electronic device according to claim 10, wherein the first plurality of holes overlaps the second cover layer in the plan view.

14. The electronic device according to claim 10, further comprising a passivation film formed above the second cover layer, the film having an opening which exposes a part of the second cover layer, the part of the second cover layer being used as a pad.