PHOSPHOR LAYER ARRANGEMENT FOR USE WITH LIGHT EMITTING DIODES

• US 20100141182A1
• Filed: 02/12/2010
• Published: 06/10/2010
• Est. Priority Date: 09/10/2008
• Status: Abandoned Application

• Current Assignee: Bridgelux Incorporated
• Original Assignee: Bridgelux Incorporated
• Inventors: Shi, Wei
• Application Number:
  US12/705,216
• Publication Number:
  US 20100141182A1
• Time in Patent Office: Days
• US Class Current: 315/363
• CPC Class Codes: F21K 9/23 Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
• CPC Class Codes: F21K 9/64 using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
• CPC Class Codes: F21L 4/027 the light sources being a LED
• CPC Class Codes: F21S 8/08 with a standard F21S6/00 takes precedence
• CPC Class Codes: F21W 2131/103 of streets or roads
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/58 Optical field-shaping elements

Abstract

Phosphor layer arrangement for use with light emitting diodes. In an aspect, a light emitting diode apparatus is provided that includes a least one light emitting diode, an encapsulation covering the at least one light emitting diode, a lens having a phosphor layer formed upon a bottom surface, the lens positioned to cover at least part of the encapsulation, and an air gap between the phosphor layer and the encapsulation. In an aspect, a light emitting diode lamp is provided that includes a package, a least one light emitting diode, an encapsulation covering the at least one light emitting diode, a lens having a phosphor layer formed upon a bottom surface, wherein the lens is positioned to cover at least part of the encapsulation, and an air gap between the phosphor layer and the encapsulation.

Claims

1. A light emitting diode lamp comprising:

a package;

a least one light emitting diode;

an encapsulation covering the at least one light emitting diode;

a lens having a phosphor layer formed upon a bottom surface, wherein the lens is positioned to cover at least part of the encapsulation; and

an air gap between the phosphor layer and the encapsulation.

2. The lamp of claim 1, wherein said phosphor layer comprises an inorganic dye.

3. The lamp of claim 1, wherein said phosphor layer has a uniform thickness.

4. The lamp of claim 1, wherein said phosphor layer has a varying thickness.

5. The lamp of claim 1, wherein said phosphor layer has a thickness in the range of 5 to 500 microns.

6. The lamp of claim 1, wherein said air gap has a thickness in the range of 5 to 1000 microns.

7. The lamp of claim 1, further comprising a stepped reflector that forms a boundary for the encapsulation.

8. The lamp of claim 7, wherein said stepped reflector comprises a wire bonding region.

9. An illumination device comprising:

a power source;

a light emitting diode lamp in electrical communication with the power source, the light emitting diode lamp comprising;

a package;

a least one light emitting diode;

an encapsulation covering the at least one light emitting diode;

a lens having a phosphor layer formed upon a bottom surface, wherein the lens is positioned to cover at least part of the encapsulation; and

an air gap between the phosphor layer and the encapsulation.

10. The illumination device of claim 9, wherein said phosphor layer comprises an inorganic dye.

11. The illumination device of claim 9, wherein said phosphor layer has a uniform thickness.

12. The illumination device of claim 9, wherein said phosphor layer has a varying thickness.

13. The illumination device of claim 9, wherein said phosphor layer has a thickness in the range of 5 to 500 microns.

14. The illumination device of claim 9, wherein said air gap has a thickness in the range of 5 to 1000 microns.

15. The illumination device of claim 9, further comprising a stepped reflector that forms a boundary for the encapsulation.

16. The illumination device of claim 15, wherein said stepped reflector comprises a wire bonding region.

17. A light emitting diode apparatus comprising:

a least one light emitting diode;

an encapsulation covering the at least one light emitting diode; and

a lens having a phosphor layer formed between first and second lens portions, the lens positioned so that the second lens portion fits against the encapsulation.

18. The apparatus of claim 17, wherein said phosphor layer comprises an inorganic dye.

19. The apparatus of claim 17, wherein said phosphor layer has a uniform thickness.

20. The apparatus of claim 17, wherein said phosphor layer has a varying thickness.

21. The apparatus of claim 17, wherein said phosphor layer has a thickness in the range of 5 to 500 microns.

22. The apparatus of claim 17, further comprising a stepped reflector that forms a boundary for the encapsulation.

23. The apparatus of claim 22, wherein said stepped reflector comprises a wire bonding region.