Trace fuse with positive expulsion
First Claim
Patent Images
1. An improved circuit interruption device for printed wiring boards or similar constructions comprising alternating layers of electrical conductors and dielectric material, the interruption device comprising:
- at least one melting element, and;
at least one expulsion element, being arranged spatially such that the at least one melting element and at least one expulsion element lie on or are immediately adjacent a surface of the printed wiring board or similar construction and are arranged spatially with respect to one another such that current flowing in the least one melting element is generally opposed to current flowing in the at least one expulsion element.
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Abstract
A circuit interruption device for printed wiring boards having a positive expulsion device for removing melted fuse material, plasma and debris from the printed wiring board.
43 Citations
18 Claims
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1. An improved circuit interruption device for printed wiring boards or similar constructions comprising alternating layers of electrical conductors and dielectric material, the interruption device comprising:
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at least one melting element, and; at least one expulsion element, being arranged spatially such that the at least one melting element and at least one expulsion element lie on or are immediately adjacent a surface of the printed wiring board or similar construction and are arranged spatially with respect to one another such that current flowing in the least one melting element is generally opposed to current flowing in the at least one expulsion element. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. An improved circuit interruption device for printed wiring boards or similar constructions comprising alternating layers of electrical conductors and dielectric material, the interruption device comprising:
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at least one melting element, and; at least one expulsion element, being arranged such that each of the at least one melting element and at least one expulsion element lie on or are immediately adjacent a surface or edge of the printed wiring board or similar construction and are arranged spatially with respect to one another such that a magnetic field surrounding the at least one expulsion element exerts a force on the at least one melting element sufficient to force molten, vaporized or plasma material of the at least one melting element away from that surface or edge of the printed wiring board to which it lies on or is immediately adjacent.
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16. An improved circuit interruption device for protecting an electrical circuit at least partially located on a printed wiring board or similar construction comprising alternating layers of electrical conductors and dielectric materials, the interruption device comprising:
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at least one melting element, liquefying at a predetermined thermal point caused by an over current condition in the protected electrical circuit, and; at least one expulsion element, being arranged such that each of the at least one melting element and at least one expulsion element lie on or are immediately adjacent a surface or edge of the printed wiring board or similar construction and are arranged spatially with respect to one another such that a magnetic field surrounding the at least one expulsion element exerts an expulsion force on the at least one melting element sufficient to force liquefied, vaporized or plasma material of the at least one melting element away from that surface or edge of the printed wiring board to which it lies on or is immediately adjacent. - View Dependent Claims (17, 18)
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Specification