ELECTRONIC DEVICE FOR VOLTAGE SWITCHABLE DIELECTRIC MATERIAL HAVING HIGH ASPECT RATIO PARTICLES

• US 20100141376A1
• Filed: 02/10/2010
• Published: 06/10/2010
• Est. Priority Date: 07/29/2006
• Status: Active Grant

• Current Assignee: Littelfuse Incorporated
• Original Assignee: Shocking Technologies, Inc.
• Inventors: Kosowsky, Lex, Fleming, Robert
• Granted Patent: US 7,981,325 B2
• Time in Patent Office: Days
• US Class Current: 338/20
• CPC Class Codes: B82Y 10/00 Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
• CPC Class Codes: H01B 1/22 the conductive material comprising metals or alloys
• CPC Class Codes: H01B 1/24 the conductive material comprising carbon-silicon compounds, carbon or silicon
• CPC Class Codes: H01C 17/0652 containing carbon or carbides
• CPC Class Codes: H01C 7/1006 Thick film varistors
• CPC Class Codes: H01C 7/105 Varistor cores H01C7/12 takes precedence
• CPC Class Codes: H05K 1/0257 Overvoltage protection
• CPC Class Codes: H05K 1/0259 Electrostatic discharge [ESD] protection
• CPC Class Codes: H05K 1/0373 containing additives, e.g. fillers H05K1/036 takes precedence
• CPC Class Codes: H05K 1/167 incorporating printed resistors
• CPC Class Codes: H05K 2201/0248 Needles or elongated particles; Elongated cluster of chemically bonded particles microfibers H05K2201/0251; stacked conductors H05K2201/0379
• CPC Class Codes: H05K 2201/0257 Nanoparticles inks comprising nanoparticles H05K1/097
• CPC Class Codes: H05K 2201/026 Nanotubes or nanowires
• CPC Class Codes: H05K 2201/0272 Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
• CPC Class Codes: H05K 2201/0738 Use of voltage responsive materials, e.g. voltage switchable dielectric or varistor materials
• CPC Class Codes: H05K 2203/0723 Electroplating, e.g. finish plating
• CPC Class Codes: H05K 2203/105 Using an electrical field; Special methods of applying an electric potential electroplating H05K2203/0723
• CPC Class Codes: H05K 3/188 by direct electroplating
• CPC Class Codes: Y10S 977/742 Carbon nanotubes, CNTs
• CPC Class Codes: Y10S 977/779 Possessing nanosized particles, powders, flakes, or clusters other than simple atomic impurity doping
• CPC Class Codes: Y10T 428/30 : Self-sustaining carbon mass or layer with impregnant or other layer
• CPC Class Codes: Y10T 428/31678 : Of metal

Abstract

One or more embodiments provide for a device that utilizes voltage switchable dielectric material having semi-conductive or conductive materials that have a relatively high aspect ratio for purpose of enhancing mechanical and electrical characteristics of the VSD material on the device.

Claims

1. An electronic device comprising:

a layer of voltage switchable dielectric (VSD) material formed by;

(i) creating a mixture comprising a binder, metallic and/or inorganic semi-conductor particles, and conductive or semi-conductive organic material;

(ii) applying the mixture to a target location on the device; and

(iii) curing the mixture at the target location.

2. The electronic device of claim 1, further comprising:

a first electrode and a second electrode, and

wherein the target location is a span between the first and second electrode.

3. The electronic device of claim 1, wherein the device corresponds to a substrate device, and wherein the VSD material is provided as a layer that is within a thickness of the substrate.

4. The electronic device of claim 3, wherein the VSD material underlies one or more contact elements for connecting the substrate to another device, and wherein the one or more contact elements include an aperture to electrically connect a surface of an individual contact element to the VSD layer.

5. The electronic device of claim 1, wherein the electronic device is a device selected from a group consisting of a light-emitting diode, a radio-frequency device, a discrete device, and a semi-conductor package or substrate.

6. The electronic device of claim 1, wherein the conductive or semi-conductive organic material and the conductor or semiconductor particles the formation of VSD material are substantially uniformly distributed in an overall thickness of the binder.

7. The device of claim 6, wherein the conductive or semi-conductive organic material of the formation of VSD material includes single and/or multi-walled carbon nanotubes.

8. The device of claim 1, wherein the conductive or semi-conductive organic material of the formation of VSD material includes a pure carbon compound corresponding to one of carbon graphite, carbon fiber, or a diamond powder.

9. The device of claim 1, wherein the conductor and/or semiconductor particles the formation of VSD material includes a metal or a metal complex.