Method and Apparatus for Making a Radio Frequency Inlay

• US 20100141453A1
• Filed: 09/24/2007
• Published: 06/10/2010
• Est. Priority Date: 09/26/2006
• Status: Active Grant

• Current Assignee: HID Global GmbH (Assa Abloy AB)
• Original Assignee: Assa Abloy Identification Technology Group AB (Assa Abloy AB)
• Inventors: Finn, David
• Granted Patent: US 7,971,339 B2
• Time in Patent Office: Days
• US Class Current: 340/572.700
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: H01F 41/041 Printed circuit coils apparatus or processes for manufacturing printed circuits in general H05K3/00
• CPC Class Codes: H01F 41/064 Winding non-flat conductive wires, e.g. rods, cables or cords
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/4809 Loop shape
• CPC Class Codes: H01L 2224/4813 Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2224/48699 Principal constituent of the connecting portion of the wire connector being Aluminium (Al)
• CPC Class Codes: H01L 2224/78301 Capillary
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/85203 Thermocompression bonding
• CPC Class Codes: H01L 2224/85205 Ultrasonic bonding
• CPC Class Codes: H01L 23/48 Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/78 : Apparatus for connecting with wire connectors
• CPC Class Codes: H01L 24/85 : using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/20752 : larger or equal to 20 microns less than 30 microns
• CPC Class Codes: H01L 2924/2076 : equal to or larger than 100 microns
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: Y10T 29/49002 : Electrical device making
• CPC Class Codes: Y10T 29/49016 : Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/49071 : by winding or coiling
• CPC Class Codes: Y10T 29/49117 : Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49128 : Assembling formed circuit to base

Abstract

A method and apparatus are provided for making radio frequency (RF) inlays. The RF inlays include an integrated circuit and an antenna affixed to a substrate material carrying the integrated circuit. During processing, portions of the wire forming the antenna are located adjacent to, but not directly over the integrated circuit. In the subsequent processing step, the wire ends are placed in contact with and secured to the integrated circuit terminal areas.

Claims

1. A method of manufacturing a radio frequency inlay, said method comprising:

providing a substrate defining a substrate plane, and an integrated circuit positioned on said substrate or in a recess formed on said substrate, and a pair of terminal areas associated with said integrated circuit;

affixing a wire to said substrate, said affixing step including;

positioning a first portion of said wire on said substrate laterally offset and spaced from one of said terminal areas;

(ii) affixing a second portion of the wire to the substrate to form the windings of an antenna;

(iii) positioning a third portion of said wire on said substrate laterally offset and spaced from the other of said terminal areas.

2. A method, as claimed in claim 1, wherein:

said positioning steps include placing said wires on said substrates but not embedded in said substrate.

3. A method, as claimed in claim 1, wherein:

said first and third portions are repositioned by a mechanical device.

4. A method, as claimed in claim 3, wherein:

said first portion and said second portion are moved by a brush or comb.

5. A method, as claimed in claim 1, wherein:

said positioning step includes embedding wire in said substrate.

6. A method of manufacturing a radio frequency transponder unit, said method comprising the steps of:

providing a substrate, said substrate defining a substrate plane;

providing an integrated circuit and at least two terminal areas associated with the integrated circuit;

positioning said integrated circuit and at least two associated terminal areas on said substrate or in a recess associated with said substrate;

embedding portions of a continuous length of wire in said substrate to form an antenna and to form first and second end portions of said antenna to connect to said at least two terminal areas, said embedding step including;

at a position laterally offset from said terminal areas embedding a first portion of said first end portion in said substrate and positioning a second portion of said first end portion over said substrate and not embedding the second portion in said substrate;

(ii) following said second portion, embedding a length of wire in said substrate to form an antenna;

(iii) at a position laterally offset from said terminal areas forming a second end portion of said wire, said second end portion comprising a first portion following said antenna portion, said first portion not embedded in said substrate, and a second portion following said first portion and said second portion is embedded in said substrate;

displacing the first and second end portions of wire such that at least some of said first and second end portions of wire are positioned over at least some portion of corresponding terminal areas; and

electrically connecting said at least some of said first and second end portions of wire to the corresponding terminal areas.

7. A method, as claimed in claim 6, wherein displacing said first and second end portions is performed by a mechanical device.

8. A method, as claimed in claim 6, wherein:

said displacing steps removes wire from said substrate that had been previously embedded in said substrate.

9. A method, as claimed in claim 8, wherein said first portion of said first end portion and said second portion of said second end portion are removed from an embedded state as a result of displacing said first and second end portions.

10. In combination, a substrate defining a substrate plane, and an integrated circuit position on said substrate or in a recess formed in said substrate, a pair of terminal areas associated with said integrated circuit, and a wire affixed to said substrate to form an antenna, said wire comprising a first portion laterally offset and spaced from one of said terminal areas, a second portion of the wire embedded in said substrate to form windings of the antenna, and a third portion of said wire laterally offset and spaced from the other of said terminal areas.

11. The combination of claim 10, wherein said first and third portions of said wire lie on said substrate but are not embedded in said substrate.