Thermally Dissipative Enclosure Having Shock Absorbing Properties
First Claim
1. A thermally dissipative housing for heat generating electronic components, the thermally dissipative housing comprising:
- a rigid housing having an interior and an exterior, the interior having an interior surface area;
a printed circuit board disposed within the rigid housing, the printed circuit board comprising one or more of the heat generating electronic components; and
a compliant heat spreader thermally coupled to the one or more of the heat generating electronic components, the compliant heat spreader passing along the interior of the rigid housing across at least twenty-five percent of the interior surface area.
1 Assignment
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Accused Products
Abstract
A thermally dissipative housing (200) includes a rigid housing (203) and a compliant heat spreader (215). The compliant heat spreader (215) is thermally coupled to a heat-generating component (201) disposed within the thermally dissipative housing (200). The compliant heat spreader (215) removes heat from the heat-generating component (201) and transfers it along an interior surface of the rigid housing (203) by passing along an interior (209) of the rigid housing (203) across at least a portion of the interior surface area (211) of the rigid housing (203). The compliant heat spreader (215) transfers heat to the surface of the rigid housing (203) without substantially interfering with the shock absorbing properties of the rigid housing (203).
38 Citations
20 Claims
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1. A thermally dissipative housing for heat generating electronic components, the thermally dissipative housing comprising:
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a rigid housing having an interior and an exterior, the interior having an interior surface area; a printed circuit board disposed within the rigid housing, the printed circuit board comprising one or more of the heat generating electronic components; and a compliant heat spreader thermally coupled to the one or more of the heat generating electronic components, the compliant heat spreader passing along the interior of the rigid housing across at least twenty-five percent of the interior surface area. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. An image production device, comprising:
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a projector mounted within the image production device; a compliant thermally conductive material thermally coupled to the projector; and a housing having a rigidity greater than the compliant thermally conductive material and a thermal conductivity less than the compliant thermally conductive material; wherein the substrate is fixed relative to the housing and the compliant thermally conductive material is thermally coupled to the housing; and wherein the compliant thermally conductive material passes along an interior of the housing across at least a portion of an interior of the housing. - View Dependent Claims (20)
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Specification