EFFICIENT LED ARRAY
First Claim
1. A light emitting diode (LED) lamp comprising:
- a package; and
a light emitting diode apparatus coupled to the package and comprising;
a metal substrate having a reflective surface; and
a plurality of LED chips mounted directly to the reflective surface of the metal substrate to allow for thermal dissipation, and wherein at least a portion of the LED chips are spaced apart from each other to allow light to reflect from a portion of the reflective surface that is located between the portion of the LED chips.
3 Assignments
0 Petitions
Accused Products
Abstract
An efficient LED array. In an aspect, an LED apparatus includes a metal substrate having a reflective surface, and LED chips mounted directly to the reflective surface to allow for thermal dissipation, and wherein at least a portion of the LED chips are spaced apart from each other to allow light to reflect from a portion of the reflective surface that is located between the portion of the LED chips. In another aspect, a method includes configuring a metal substrate to have a reflective surface, and mounting a plurality of LED chips directly to the reflective surface of the metal substrate to allow for thermal dissipation, and wherein at least a portion of the LED chips are spaced apart from each other to allow light to reflect from a portion of the reflective surface that is located between the portion of the LED chips.
15 Citations
16 Claims
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1. A light emitting diode (LED) lamp comprising:
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a package; and a light emitting diode apparatus coupled to the package and comprising; a metal substrate having a reflective surface; and a plurality of LED chips mounted directly to the reflective surface of the metal substrate to allow for thermal dissipation, and wherein at least a portion of the LED chips are spaced apart from each other to allow light to reflect from a portion of the reflective surface that is located between the portion of the LED chips. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. An illumination device comprising:
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a power source; a light emitting diode lamp in electrical communication with the power source, the light emitting diode lamp comprising; a package; and a light emitting diode apparatus coupled to the package and comprising; a metal substrate having a reflective surface; and a plurality of LED chips mounted directly to the reflective surface of the metal substrate to allow for thermal dissipation, and wherein at least a portion of the LED chips are spaced apart from each other to allow light to reflect from a portion of the reflective surface that is located between the portion of the LED chips. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
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Specification