METHOD TO INTEGRATE MICRO ELECTRO MECHANICAL SYSTEM AND CMOS IMAGE SENSOR
First Claim
Patent Images
1. A method to integrate a micro electro mechanical system and an image sensor, comprising:
- providing a substrate comprising a micro electro mechanical system (MEMS) region and an image sensor region, said micro electro mechanical system region comprising a micro electro mechanical system component and said image sensor region comprising an image sensor element; and
performing an etching procedure on said substrate to form a micro electro mechanical system trench in said micro electro mechanical system region and an image sensor trench in said image sensor region, said etching procedure comprising carrying out at least a dry etching and at least a wet etching.
1 Assignment
0 Petitions
Accused Products
Abstract
A method to integrate a micro electro mechanical system and a CMOS image sensor is disclosed. First a substrate is provided. The substrate includes a micro electro mechanical system (MEMS) region and a CMOS image sensor (CIS) region. The micro electro mechanical system region includes a micro electro mechanical system component and the CMOS image sensor region includes a CMOS image sensor element. Second, an etching procedure is performed on the substrate to form a micro electro mechanical system trench and a CMOS image sensor trench. The etching procedure includes at least a dry etching and at least a wet etching.
-
Citations
13 Claims
-
1. A method to integrate a micro electro mechanical system and an image sensor, comprising:
-
providing a substrate comprising a micro electro mechanical system (MEMS) region and an image sensor region, said micro electro mechanical system region comprising a micro electro mechanical system component and said image sensor region comprising an image sensor element; and performing an etching procedure on said substrate to form a micro electro mechanical system trench in said micro electro mechanical system region and an image sensor trench in said image sensor region, said etching procedure comprising carrying out at least a dry etching and at least a wet etching. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
-
Specification