RETAINING RING AND ARTICLES FOR CARRIER HEAD

• US 20100144255A1
• Filed: 02/10/2010
• Published: 06/10/2010
• Est. Priority Date: 09/08/2000
• Status: Active Grant

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Nagengast, Andrew J., Chen, Hung Chih, Bennett, Doyle E.
• Granted Patent: US 8,376,813 B2
• Time in Patent Office: Days
• US Class Current: 451/398
• CPC Class Codes: B24B 37/30 for single side lapping of plane surfaces
• CPC Class Codes: B24B 37/32 Retaining rings

Abstract

A carrier head for chemical mechanical polishing that has a base, a mounting assembly connected to the base having a surface for contacting a substrate, and a retaining ring secured to the base. The retaining ring can include perfluoroalkoxy, polyetherketoneketone, polybenzimidazole, a semi-crystalline thermoplastic polyester, or a long molecular chain molecule produced from poly-paraphenylene terephthalamide.

Claims

1. A retaining ring for a chemical mechanical polishing head, comprising:

an upper portion configured to be secured to a base; and

a lower portion having a bottom surface to contact a polishing pad during polishing, wherein the lower portion includes a semi-crystalline thermoplastic polyester.

2. The retaining ring of claim 1, wherein the lower portion consists of the semi-crystalline thermoplastic polyester.

3. The retaining ring of claim 1, wherein the lower portion includes at least one of graphite or carbon fibers.

4. The retaining ring of claim 1, wherein the lower portion includes polytetrafluoroethylene.

5. The retaining ring of claim 4, wherein the lower portion includes at least one of graphite or carbon fibers.

6. The retaining ring of claim 1, wherein the upper portion is more rigid than the lower portion.

7. The retaining ring of claim 6, wherein the upper portion comprises stainless steel or aluminum.

8. The retaining ring of claim 1, wherein the upper portion and the lower portion are the same material.

9. A carrier head for chemical mechanical polishing, comprising:

a base;

a mounting assembly attached to the base having a surface for contacting a substrate; and

a retainer having an upper portion configured to be secured to a base and a lower portion having a bottom surface to contact a polishing pad during polishing, wherein the lower portion includes a semi-crystalline thermoplastic polyester.

10. The carrier head of claim 9, wherein the lower portion consists of the semi-crystalline thermoplastic polyester.

11. The carrier head of claim 9, wherein the lower portion includes at least one of graphite or carbon fibers.

12. The carrier head of claim 9, wherein the lower portion includes polytetrafluoroethylene.

13. The carrier head of claim 12, wherein the lower portion includes at least one of graphite or carbon fibers.

14. The carrier head of claim 9, wherein the upper portion is more rigid than the lower portion.

15. The carrier head of claim 14, wherein the upper portion comprises stainless steel or aluminum.

16. The retaining ring of claim 9, wherein the upper portion and the lower portion are the same material.