SPINAL IMPLANTS INCLUDING A SENSOR AND METHODS OF USE

• US 20100145387A1
• Filed: 02/18/2010
• Published: 06/10/2010
• Est. Priority Date: 01/27/2006
• Status: Active Grant

• Current Assignee: Warsaw Orthopedic Incorporated (Medtronic Plc)
• Original Assignee: Warsaw Orthopedic Incorporated (Medtronic Plc)
• Inventors: Bruneau, Aurelien, Lange, Eric C., Anderson, Kent M.
• Granted Patent: US 8,216,279 B2
• Time in Patent Office: Days
• US Class Current: 606/249
• CPC Class Codes: A61B 17/7062 Devices acting on, attached to, or simulating the effect of, vertebral processes, vertebral facets or ribs rib fixation devices A61B17/8076; Tools for such devices
• CPC Class Codes: A61B 2090/064 for measuring force, pressure or mechanical tension

Abstract

A method spacing spinal elements includes installing a first spinal implant having a sensor associated therewith; selecting a second spinal implant based on measurement data provided by the sensor; and replacing the first spinal implant with the second spinal implant. The first and second implants may be installed in separate surgical procedures, or during the same surgical procedure, and the implants may be positioned between a superior spinous process and an inferior spinous process and advantageously directly engage the same. The selection of the second implant may be based on the data provided by the sensor and a material property of the second spinal implant, such as its stiffness. The measurement data may correspond to strain or force data. The sensor may be, but is not required to be, embedded in the first spinal implant. A corresponding apparatus is described.

Claims

1. An interspinous implant, comprising:

a superior saddle adapted to accept a superior spinous process, an inferior saddle adapted to accept an inferior spinous process, and a compressible body therebetween;

a sensor disposed in said body;

said sensor adapted to generate measurement data indicative of at least one of forces acting on said implant and strain of said implant.

2. The interspinous implant of claim 1 wherein said sensor comprises a strain gage.

3. The interspinous implant of claim 1 further comprising a removable module disposed in said body;

said sensor disposed in said removable module.

4. An interspinous implant kit, comprising:

a first interspinous implant comprising;

a superior saddle adapted to accept a superior spinous process, an inferior saddle adapted to accept an inferior spinous process, and an intermediate section therebetween;

a sensor disposed in said intermediate section;

said sensor adapted to generate measurement data indicative of at least one of forces acting on said first interspinous implant and strain of said first interspinous implant;

a second interspinous implant having a superior saddle adapted to accept the superior spinous process, an inferior saddle adapted to accept the inferior spinous process, and a compressible body therebetween;

said second interspinous implant having a second mechanical material property;

a third interspinous implant having a superior saddle adapted to accept the superior spinous process, an inferior saddle adapted to accept the inferior spinous process, and a compressible body therebetween;

said third interspinous implant having a third mechanical material property of the same type, but different than, said second mechanical material property.

5. An interspinous implant kit, comprising:

a receiver body adapted to be implanted between a superior spinous process and an inferior spinous process;

said receiver body comprising a superior saddle adapted to accept the superior spinous process, an inferior saddle adapted to accept the inferior spinous process, and an intermediate section therebetween;

said intermediate section comprising a module-receiving bay;

first, second, and third modules configured to be interchangeably received in said module-receiving bay;

said first module having a sensor disposed therein;

said sensor adapted to generate measurement data indicative of at least one of forces acting on said receiver body and strain when mated to said receiver body;

said second module having a second mechanical material property; and

said third module having a third mechanical material property of the same type, but different than, said second mechanical material property.