METHOD FOR PACKAGING CIRCUITS AND PACKAGED CIRCUITS
First Claim
1. A method, comprising:
- curing adhesive to fix a first substrate to a second substrate, and to align first saw streets separating a plurality of first dice on the first substrate with second saw streets separating a plurality of second dice on the second substrate;
forming a plurality of through apertures in the aligned first and second saw streets;
forming electrical connections from the first dice on the first substrate to the second dice on the second substrate; and
singulating aligned first and second dice from a remainder of the fixed first and second substrates.
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Accused Products
Abstract
A method for packaging integrated circuit chips (die) is described that includes providing a base substrate with package level contacts, coating a base substrate with adhesive, placing dies on the adhesive, electrically connecting the die to the package level contacts, and removing the backside of the base substrate to expose the backside of the package level contacts. Accordingly, an essentially true chip scale package is formed. Multi-chip modules are formed by filling gaps between the chips with an encapsulant. In an embodiment, chips are interconnected by electrical connections between package level contacts in the base substrate. In an embodiment, substrates each having chips are adhered back-to-back with through vias formed in aligned saw streets to interconnect the back-to-back chip assembly.
113 Citations
20 Claims
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1. A method, comprising:
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curing adhesive to fix a first substrate to a second substrate, and to align first saw streets separating a plurality of first dice on the first substrate with second saw streets separating a plurality of second dice on the second substrate; forming a plurality of through apertures in the aligned first and second saw streets; forming electrical connections from the first dice on the first substrate to the second dice on the second substrate; and singulating aligned first and second dice from a remainder of the fixed first and second substrates. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method, comprising:
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curing adhesive to fix a first substrate to a second substrate, and to align first saw streets separating a plurality of first dice on the first substrate with second saw streets separating a plurality of second dice on the second substrate; lazing the first saw street, the adhesive, and the second saw street to form through holes; forming electrical connections from the first dice on the first substrate to the second dice on the second substrate through the through holes; and singulating aligned first and second dice from a remainder of the fixed first and second substrates. - View Dependent Claims (11, 12, 13, 14)
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15. A method, comprising:
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curing adhesive to fix a first substrate to a second substrate, and to align first saw streets separating a plurality of first dice on the first substrate with second saw streets separating a plurality of second dice on the second substrate; cutting a kerf in the first saw streets of the first substrate through the first substrate; removing the adhesive between at least some of the plurality of first dice; lazing the second saw street to form through holes; forming electrical connections from the first dice on the first substrate to the second dice on the second substrate through the through holes; and singulating aligned first and second dice from a remainder of the fixed first and second substrates. - View Dependent Claims (17, 18, 19, 20)
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16. The method of 15, wherein removing the adhesive between at least some of the plurality of first dice includes chemically etching the adhesive.
Specification