Multiple-Substrate Transfer Apparatus and Multiple-Substrate Processing Apparatus

• US 20100147396A1
• Filed: 12/15/2008
• Published: 06/17/2010
• Est. Priority Date: 12/15/2008
• Status: Abandoned Application

• Current Assignee: ASM Japan K.K. (ASM International NV), Cosco Management Incorporated (Dorel Industries Incorporated)
• Original Assignee: ASM Japan K.K. (ASM International NV)
• Inventors: Yamagishi, Takayuki, Kobayashi, Tamihiro
• Application Number:
  US12/335,371
• Publication Number:
  US 20100147396A1
• Time in Patent Office: Days
• US Class Current: 137/15.10
• CPC Class Codes: C23C 16/54 Apparatus specially adapted for continuous coating
• CPC Class Codes: H01L 21/6719 characterized by the construction of the processing chambers, e.g. modular processing chambers
• CPC Class Codes: H01L 21/67196 characterized by the construction of the transfer chamber
• CPC Class Codes: H01L 21/67742 Mechanical parts of transfer devices robots in general in B25J
• CPC Class Codes: H01L 21/67754 horizontal transfer of a batch of workpieces
• CPC Class Codes: Y10T 137/0402 Cleaning, repairing, or assembling

Abstract

A multiple-substrate processing apparatus includes: a reaction chamber comprised of two discrete reaction stations aligned one behind the other for simultaneously processing two substrates; a transfer chamber disposed underneath the reaction chamber, for loading and unloading substrates to and from the reaction stations simultaneously; and a load lock chamber disposed next to the transfer chamber. The transfer arm includes one or more end-effectors for simultaneously supporting two substrates one behind the other as viewed in the substrate-loading/unloading direction.

Claims

1. A multiple-substrate processing apparatus comprising:

a reaction chamber comprised of two discrete reaction stations for simultaneously processing two substrates, said reaction stations being aligned along a substrate-loading/unloading direction;

a transfer chamber disposed underneath the reaction chamber, for loading and unloading substrates to and from the reaction stations;

a load lock chamber disposed next to the transfer chamber, said load lock chamber being provided with a transfer arm for loading and unloading substrates to and from the transfer chamber, said transfer arm comprising one or more end-effectors for simultaneously supporting two substrates one behind the other as viewed in the substrate-loading/unloading direction; and

a transfer robot disposed in the vicinity of the load lock chamber, for loading and unloading substrates to and from the transfer arm.

2. The multiple-substrate processing apparatus according to claim 1, further comprising another reaction chamber, another transfer chamber, and another transfer arm, wherein the reaction chamber and the another reaction chamber, the transfer chamber and the another transfer chamber, and the transfer arm and the another transfer arm are disposed side by side, wherein the load lock chamber accommodates both the transfer arm and the another transfer arm, and the another transfer arm is accessible to the transfer robot.

3. The multiple-substrate processing apparatus according to claim 2, further comprising a common exhaust system connected to a dry pump which is shared by the reaction chamber, the another reaction chamber, the transfer chamber, and the another transfer chamber.

4. The multiple-substrate processing apparatus according to claim 3, wherein the another reaction chamber comprises two discrete reaction stations for simultaneously processing two substrates, said reaction stations of the another reaction chamber being aligned along the substrate-loading/unloading direction, the multiple-substrate processing apparatus further comprising four gas supply systems each connected to a different one of the two reaction stations of the reaction chamber and the two reaction stations of the another reaction chamber.

5. The multiple-substrate processing apparatus according to claim 1, wherein the reaction chamber, the transfer chamber, and the load lock chamber are provided with different exhaust ports, wherein the exhaust port of the reaction chamber and the exhaust port of the transfer chamber are connected downstream of the reaction chamber and the transfer chamber and alternately selected by a valve or valves.

6. The multiple-substrate processing apparatus according to claim 5, wherein the exhaust port of the transfer chamber is disposed at a position below substrates placed on susceptors provided for the respective reaction stations.

7. The multiple-substrate processing apparatus according to claim 1, wherein each reaction station has an associated susceptor having a lowered position and a raised processing position, and wherein the reaction chamber and the transfer chamber are separated by the susceptors and insulative isolation plates when the susceptors are at the processing position for processing substrates placed on the susceptors, and the transfer chamber is provided with a gas inlet port for introducing gas into the transfer chamber during processing and cleaning to inhibit reaction/cleaning gas in the reaction chamber from entering the transfer chamber.

8. The multiple-substrate processing apparatus according to claim 1, wherein the reaction chamber is provided with an exhaust port, each reaction station is surrounded by an exhaust duct, the exhaust duct of one of the reaction station and the exhaust duct of another of the reaction station are connected each other, and one of the exhaust ducts is connected to the exhaust port.

9. The multiple-substrate processing apparatus according to claim 8, wherein the exhaust ducts are made of an insulative material.

10. The multiple-substrate processing apparatus according to claim 1, wherein the transfer chamber is provided with a buffer mechanism for temporarily accommodating two substrates one above the other in the transfer chamber.

11. The multiple-substrate processing apparatus according to claim 10, wherein the one or more end-effectors of the transfer arm comprise an upper end-effector and a lower end-effector.

12. The multiple-substrate processing apparatus according to claim 1, wherein the reaction stations are each provided with showerheads serving as electrodes for plasma treatment.

13. A method for controlling exhaust flow in a multiple-substrate processing apparatus comprising:

(i) a reaction chamber comprised of two discrete reaction stations for simultaneously processing two substrates, said reaction stations being aligned one behind the other as viewed in a substrate-loading/unloading direction;

(ii) a transfer chamber disposed underneath the reaction chamber, for loading and unloading substrates to and from the reaction stations;

(iii) a load lock chamber disposed next to the transfer chamber, said load lock chamber being provided with a transfer arm for loading and unloading substrates to and from the transfer chamber, said transfer arm comprising one or more end-effectors for simultaneously supporting two substrates one behind the other as viewed in the substrate-loading/unloading direction; and

(iv) a transfer robot disposed in the vicinity of the load lock chamber, for loading and unloading substrates to and from the transfer arm, wherein an exhaust port is provided in the reaction chamber above a substrate processing level at which substrates are placed for treatment, and an exhaust port is provided in the transfer chamber below the substrate processing level, said method comprising;

evacuating both the reaction chamber and the transfer chamber selectively through the exhaust port of the transfer chamber rather than through the exhaust port of the reaction chamber, when substrates are in the transfer chamber;

evacuating the reaction chamber selectively through the exhaust port of the reaction chamber rather than through the exhaust port of the transfer chamber, while introducing a purge gas into the transfer chamber, when substrates are in the reaction chamber for processing; and

evacuating the reaction chamber predominantly or wholly through the exhaust port of the reaction chamber rather than through the exhaust port of the transfer chamber, when the reaction chamber is subjected to cleaning.

14. The method according to claim 13, wherein the exhaust port of the reaction chamber and the exhaust port of the transfer chamber are connected downstream of the reaction chamber and the transfer chamber, and the selection of the exhaust port of the reaction chamber or the exhaust port of the transfer chamber is performed by controlling a valve or valves provided in the vicinity of the connection point.