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METHOD FOR ELECTROPLATING A SUBSTRATE

  • US 20100147697A1
  • Filed: 02/10/2010
  • Published: 06/17/2010
  • Est. Priority Date: 07/29/2006
  • Status: Active Grant
First Claim
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1. A method for electroplating a substrate, the method comprising:

  • applying a voltage switchable dielectric (VSD) material onto a target region of a device, said VSD material comprising;

    a binder;

    high aspect ratio (HAR) particles that are conductive or semi-conductive and dispersed as nanoscale particles within the binder; and

    conductor and/or semiconductor particles;

    said conductor and/or semiconductor particles being distributed in the binder;

    wherein HAR particles and said conductor and/or semiconductor particles are combined to provide said composition with a characteristic of being (i) dielectric in absence of a voltage that exceeds a characteristic voltage level, and (ii) conductive with application of said voltage exceeding said characteristic voltage level;

    forming a pattern using the VSD material;

    applying the voltage that exceeds the characteristic voltage level so that the VSD material is conductive;

    while applying the voltage, exposing the target region of the device to an electrolytic medium.

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