ELECTRONIC DEVICE HOUSING

• US 20100148044A1
• Filed: 03/29/2007
• Published: 06/17/2010
• Est. Priority Date: 04/03/2006
• Status: Active Grant

• Current Assignee: Mitsubishi Electric Corporation
• Original Assignee: Mitsubishi Electric Corporation
• Inventors: Nakajima, Hajime, Ohmura, Yohichi, Satone, Toshikazu, Iijima, Mikio, Okamuro, Takashi
• Granted Patent: US 7,939,796 B2
• Time in Patent Office: Days
• US Class Current: 250/231.130
• CPC Class Codes: G01D 11/245 Housings for sensors
• CPC Class Codes: Y10T 29/49002 Electrical device making

Abstract

An electronic device housing includes a metallic base part 101; a resin part 402 fixed to the base part 101; and a printed circuit board 104 coming into contact with the resin part 402; wherein bonding of the base part 101 to the resin part 402 is carried out by way of a nanomold technique and wherein the resin part 402 has insulating property.

Claims

1. An encoder comprising:

a base part made of aluminum;

a resin part made of an insulating resin fixed to the base part; and

a printed circuit board coming into contact with the resin part; and

detecting a rotation of a pattern disc rotating while coupled to a rotary body;

wherein the base part is bonded to the resin part through bonding in which asperities in the nanometer order formed on a fixing surface of the base part opposed to the resin part is bonded to a resin of the resin part by way of a key structure, and

wherein the printed circuit board is mounted on the resin part so as to allow a pattern on the printed circuit board to be arranged on a contact surface of the resin part opposed to the printed circuit board.

2. The encoder according to claim 1, wherein the resin part supports the printed circuit board alone.

3. The encoder according to claim 1 or 2, wherein a light-emitting element and a light-receiving element for detecting the rotation of the pattern disc are arranged on the printed circuit board, the encoder further comprising:

a mirror rotating while coupled to the rotary body and returning light from the light-emitting element to the light-receiving element via the pattern disc.

4. An encoder manufacturing method for bonding a base part made of aluminum to a resin part made of an insulating resin and mounting a printed circuit board for detecting a rotation of a pattern disc rotating while coupled to a rotary body so as to cause the printed circuit board to come into contact with the resin part,

wherein the method includes steps of:

forming asperities in the nanometer order on a fixing surface of the base part to be fixed to the resin part;

bonding the resin part to the fixing surface of the base part by way of a key structure through injection molding; and

mounting the printed circuit board on the resin part so as to allow the pattern on the printed circuit board to be arranged on a contact surface of the resin part opposed to the printed circuit board.

5. (canceled)