LED package and method of assembling the same

• US 20100148206A1
• Filed: 02/26/2010
• Published: 06/17/2010
• Est. Priority Date: 10/06/2006
• Status: Active Grant

• Current Assignee: Industrial Technology Research Institute
• Original Assignee: Industrial Technology Research Institute
• Inventors: Lin, Ming-Yao, Lin, Ming-Te, Tai, Kuang-Yu
• Granted Patent: US 8,497,560 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/642 characterized by the shape

Abstract

An LED package is provided. The LED package includes a carrier, an LED chip, a conductive structure, a first encapsulant, a lens and a heat sink. The carrier is cup shaped and comprises a bottom portion and a lateral wall. The LED chip is received in the carrier and disposed on the bottom portion. The conductive structure is electrically connected to the LED chip. The first encapsulant is received in the carrier and fixing the carrier and the conductive structure. The lens is corresponding to the LED chip. The carrier is embedded in the heat sink, and heat generated by the LED chip is transmitted to the heat sink via the bottom portion and the lateral wall of the carrier.

Claims

1. An LED package, comprising:

a carrier, wherein the carrier is cup shaped and comprises a bottom portion and a lateral wall;

an LED chip, received in the carrier and disposed on the bottom portion;

a conductive structure, electrically connected to the LED chip;

a first encapsulant, received in the carrier and fixing the carrier and the conductive structure;

a lens, corresponding to the LED chip; and

a heat sink, wherein the carrier is embedded in the heat sink, and heat generated by the LED chip is transmitted to the heat sink via the bottom portion and the lateral wall of the carrier.

2. The LED package as claimed in claim 1, wherein the carrier is made of metal.

3. The LED package as claimed in claim 1, wherein the carrier is formed by punching.

4. The LED package as claimed in claim 1, wherein the conductive structure comprises at least one lead.

5. The LED package as claimed in claim 4, wherein the lead has a free end, and the free end is suspended in midair.

6. The LED package as claimed in claim 4, wherein the lead has a free end, and the free end is attached on a lateral surface of the first encapsulant.

7. The LED package as claimed in claim 1, further comprising a second encapsulant, connecting the lens to the first encapsulant.

8. The LED package as claimed in claim 1, wherein a reflective material is coated on the carrier and the conductive structure.

9. The LED package as claimed in claim 1, wherein an electrically conductive material is coated on the carrier and the conductive structure.

10. The LED package as claimed in claim 1, wherein a positioning hole is formed on the carrier.

11. The LED package as claimed in claim 1, wherein the carrier has a first cross section on a first plane and a second cross section on a second plane, the first plane is perpendicular to the second plane, the first cross section is circular, and the second cross section is U-shaped.

12. The LED package as claimed in claim 1, wherein a protrusion is formed on the center of the bottom portion, and the LED chip is disposed on the protrusion.

13. A method of assembling an LED package, comprising:

forming a carrier by punching, wherein the carrier is cup shaped and comprises a bottom portion and a lateral wall;

forming a conductive structure by punching;

assembling the carrier and the conductive structure;

injecting a first encapsulant into the carrier, wherein the first encapsulant fixes the carrier and the conductive structure, and the first encapsulant is entirely received in the carrier;

disposing a LED chip on the carrier;

electrically connecting the LED chip and the conductive structure;

packaging a lens with the LED chip, wherein the lens corresponds to the LED chip; and

embedding the carrier in a heat sink, wherein heat generated by the LED chip is transmitted to the heat sink via the bottom portion and the lateral wall of the carrier.

14. The method of assembling an LED package as claimed in claim 13, wherein a positioning hole is formed on the carrier.

15. The method of assembling an LED package as claimed in claim 13, further comprising:

injection molding an isolation layer on the carrier, wherein the isolation layer separates the carrier from the conductive structure.

16. The method of assembling an LED package as claimed in claim 13, wherein the carrier is made of metal.

17. The method of assembling an LED package as claimed in claim 13, wherein the conductive structure comprises at least one lead.

18. The method of assembling an LED package as claimed in claim 13, further comprising coating a reflective material on the carrier and the conductive structure.

19. The method of assembling an LED package as claimed in claim 13, further comprising coating an electrically conductive material on the carrier and the conductive structure.

20. The method of assembling an LED package as claimed in claim 13, wherein a protrusion is formed on a center portion of the carrier by punching, and the LED chip is disposed on the protrusion.