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Methods for Manufacturing RFID Tags and Structures Formed Therefrom

  • US 20100148859A1
  • Filed: 01/19/2010
  • Published: 06/17/2010
  • Est. Priority Date: 07/08/2005
  • Status: Active Grant
First Claim
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1. A device, comprising:

  • a) a metal antenna and/or inductor;

    b) a dielectric layer thereon, configured to support and insulate integrated circuitry from said metal antenna and/or inductor;

    c) a plurality of diodes and a plurality of thin film transistors on said dielectric layer, said diodes having at least one semiconductor layer in common with said thin film transistors; and

    d) a plurality of capacitors in electrical communication with said metal antenna and/or inductor and at least some of said diodes, said plurality of capacitors having at least one semiconductor layer in common with said plurality of diodes and/or at least one metal layer in common with contacts to said diodes and thin film transistors.

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