SEMICONDUCTOR DEVICE

• US 20100149774A1
• Filed: 05/18/2009
• Published: 06/17/2010
• Est. Priority Date: 12/17/2008
• Status: Abandoned Application

• Current Assignee: Mitsubishi Electric Corporation
• Original Assignee: Mitsubishi Electric Corporation
• Inventors: Miyazaki, Yuji, Matsumoto, Masafumi
• Application Number:
  US12/467,663
• Publication Number:
  US 20100149774A1
• Time in Patent Office: Days
• US Class Current: 361/783
• CPC Class Codes: H01L 23/055 the leads having a passage through the base H01L23/057 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 2201/10689 Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
• CPC Class Codes: H05K 2201/10863 Adaptations of leads or holes for facilitating insertion
• CPC Class Codes: H05K 3/308 Adaptations of leads connectors to printed circuits H01R12/00

Abstract

A semiconductor device includes a terminal case containing a semiconductor element, a plurality of pin terminals of equal length mounted in the terminal case and electrically connected to the semiconductor element, the plurality of pin terminals projecting outward from a predetermined surface of the terminal case in the same direction, and at least one protruding pin terminal mounted in the terminal case and projecting outward from the predetermined surface of the terminal case in the same direction farther than the plurality of pin terminals.

Claims

1. A semiconductor device comprising:

a terminal case containing a semiconductor element;

a plurality of pin terminals of equal length mounted in said terminal case and electrically connected to said semiconductor element, said plurality of pin terminals projecting outward from a predetermined surface of said terminal case in the same direction; and

at least one protruding pin terminal mounted in said terminal case and projecting outward from said predetermined surface of said terminal case in said same direction farther than said plurality of pin terminals.

2. The semiconductor device according to claim 1, wherein said at least one protruding pin terminal is electrically connected to said semiconductor element.

3. The semiconductor device according to claim 1, wherein:

said predetermined surface is rectangular in shape;

said plurality of pin terminals are arranged along sides of said rectangular surface; and

said at least one protruding pin terminal is mounted at least one end of a respective one of said sides of said rectangular surface.

4. The semiconductor device according to claim 3, wherein said at least one protruding pin terminal is mounted at diagonally opposite positions of said rectangular surface.

5. The semiconductor device according to claim 3, wherein said at least one protruding pin terminal is mounted at four corners of said rectangular surface.

6. The semiconductor device according to claim 4, wherein:

said plurality of pin terminals are arranged along one side of said rectangular surface; and

the one or ones of said at least one protruding pin terminal which are mounted at other sides of said rectangular surface are not electrically connected to said semiconductor element.