MANUFACTURE OF A RADIATING STRUCTURE FOR A MEDICAL IMPLANT

• US 20100151113A1
• Filed: 12/12/2008
• Published: 06/17/2010
• Est. Priority Date: 12/12/2008
• Status: Abandoned Application

• Current Assignee: MicroCHIPS Inc.
• Original Assignee: MicroCHIPS Inc.
• Inventors: Shelton, Kurt
• Application Number:
  US12/334,184
• Publication Number:
  US 20100151113A1
• Time in Patent Office: Days
• US Class Current: 427/2.240
• CPC Class Codes: A61B 5/0031 Implanted circuitry

Abstract

A method of manufacturing a radiating structure having a selected capacitance. The method includes receiving a particular lot of a dielectric material having a nominal permittivity; receiving a measured value of an actual permittivity for the particular lot, the actual permittivity being different from the nominal permittivity; using the actual permittivity, determining the number of laminas of dielectric material required to cause the radiating structure to have the selected capacitance; causing the determined number of laminas of the dielectric material to be formed on a substrate, thereby forming a dielectric layer; and causing the radiating element to form on the layer.

Claims

1. A method of manufacturing a radiating structure having a selected capacitance, the method comprising:

receiving a particular lot of a dielectric material having a nominal permittivity;

receiving a measured value of an actual permittivity for the particular lot, the actual permittivity being different from the nominal permittivity;

using the actual permittivity, determining the number of laminas of dielectric material required to cause the radiating structure to have the selected capacitance;

causing the determined number of laminas of the dielectric material to be formed on a substrate, thereby forming a dielectric layer; and

causing the radiating element to form on the layer.

2. The method of claim 1, wherein causing the determined number of laminas to be formed comprises screen printing a lamina on a substrate.

3. The method of claim 1, further comprising:

providing a medical implant;

incorporating the layer with the radiating element formed thereon into the medical implant.

4. The method of claim 1, further comprising connecting a transceiver to the radiating element.

5. The method of claim 1, further comprising selecting the dielectric material to be a biocompatible material.

6. The method of claim 1, further comprising selecting the dielectric material to be alumina.

7. The method of claim 1, further comprising selecting the dielectric material to have a relative permittivity of 9.5±

10%.

9. The medical implant of claim 5, wherein causing the determined number of laminas to be formed comprises screen printing a lamina on a substrate.

8. A medical implant for providing transdermal communication, the implant comprising a radiating element having a selected capacitance, formed on a layer, the layer having been formed by

receiving a particular lot of a dielectric material having a nominal permittivity;

receiving a measured value of an actual permittivity for the particular lot, the actual permittivity being different from the nominal permittivity;

using the actual permittivity, determining the number of laminas of dielectric material required to cause the radiating structure to have the selected capacitance;

causing the determined number of laminas of the dielectric material to be formed on a substrate, thereby forming a dielectric layer; and

wherein the radiating element is formed on the layer.