METALLIC SURFACE ENHANCEMENT
6 Assignments
0 Petitions
Accused Products
Abstract
A method and composition for enhancing corrosion resistance, wear resistance, and contact resistance of a device comprising a copper or copper alloy substrate and at least one metal-based layer on a surface of the substrate. The composition comprises a phosphorus oxide compound selected from the group consisting of a phosphonic acid, a phosphonate salt, a phosphonate ester, a phosphoric acid, a phosphate salt, a phosphate ester, and mixtures thereof; an organic compound comprising a nitrogen-containing functional group; and a solvent having a surface tension less than about 50 dynes/cm as measured at 25° C.
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Citations
35 Claims
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1. (canceled)
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13-14. -14. (canceled)
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19-24. -24. (canceled)
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29-31. -31. (canceled)
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34. (canceled)
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35. A method for enhancing the corrosion resistance, wear resistance, and contact resistance of a device comprising a copper or copper alloy substrate and at least one metal-based layer on a surface of the substrate, the method comprising
exposing the device to the composition comprising: -
a phosphorus oxide compound selected from the group consisting of a phosphonic acid, a phosphonate salt, a phosphonate ester, a phosphoric acid, a phosphate salt, a phosphate ester, and mixtures thereof; an organic compound comprising a nitrogen-containing functional group selected from the group consisting of amine, aromatic heterocycle comprising nitrogen, and a combination thereof; and a solvent having a surface tension less than about 50 dynes/cm as measured at 25°
C. wherein the solvent comprises water and a surfactant. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 15, 16, 17, 18, 25, 26, 27, 28, 32, 33)
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Specification