Method for identifying and using process window signature patterns for lithography process control

• US 20100151364A1
• Filed: 02/23/2010
• Published: 06/17/2010
• Est. Priority Date: 08/31/2005
• Status: Active Grant

• Current Assignee: ASML Netherlands BV (ASML Holding NV)
• Original Assignee: Brion Technologies Incorporated (ASML Holding NV)
• Inventors: Ye, Jun, Chen, Xun, Juang, Shauh-Teh, Wiley, James, Preil, Moshe E.
• Granted Patent: US 8,057,967 B2
• Time in Patent Office: Days
• US Class Current: 430/5
• CPC Class Codes: G03F 1/44 Testing or measuring features, e.g. grid patterns, focus monitors, sawtooth scales or notched scales
• CPC Class Codes: G03F 7/705 Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
• CPC Class Codes: G03F 7/70625 Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
• CPC Class Codes: G03F 7/70641 Focus

Abstract

A method for identifying process window signature patterns in a device area of a mask is disclosed. The signature patterns collectively provide a unique response to changes in a set of process condition parameters to the lithography process. The signature patterns enable monitoring of associated process condition parameters for signs of process drift, analyzing of the process condition parameters to determine which are limiting and affecting the chip yields, analyzing the changes in the process condition parameters to determine the corrections that should be fed back into the lithography process or forwarded to an etch process, identifying specific masks that do not transfer the intended pattern to wafers as intended, and identifying groups of masks that share common characteristics and behave in a similar manner with respect to changes in process condition parameters when transferring the pattern to the wafer.

Claims

1. A set of process window signature patterns, comprising:

a plurality of patterns in a circuit device area of a mask, wherein a collective response of the plurality of patterns to a lithography process uniquely identifies any deviation from nominal in process condition parameters of the lithography process.

2. A set of process window signature patterns as set forth in claim 1, wherein the patterns in the set are obtained by performing simulations of the lithography process, using a representation of the device area of a mask, at two or more non-nominal locations and at nominal condition in a process window to produce simulation results.

3. A set of process window signature patterns as set forth in claim 2, wherein the patterns in the set are further obtained by determining simulated values from the simulation results for at least one metric at the two or more non-nominal locations and at nominal condition in the process window, wherein the simulated values for the at least one metric are determined at a plurality of locations within the device area.

4. A set of process window signature patterns as set forth in claim 3, wherein the patterns in the set are further obtained by, for each of the plurality of locations within the device area, determining a difference between simulated values for the at least one metric at the two or more non-nominal locations in the process window and the simulated value for the at least one metric at nominal condition.

5. A set of process window signature patterns as set forth in claim 4, wherein the patterns in the set are further obtained by identifying a number of locations within the device area where the difference for the at least one metric is above a threshold.

6. A set of process window signature patterns as set forth in claim 5, wherein the patterns in the set are further obtained by, if the number of identified locations is greater than a predetermined number, modifying the threshold and identifying the locations within the device area where the difference for the at least one metric is above the threshold until the number of identified locations within the device area is less than the predetermined number.

7. A set of process window signature patterns as set forth in claim 6, wherein the patterns in the set are further obtained by assigning patterns associated with the number of identified locations within the device area that is less than the predetermined number to be signature patterns.

8. The set of process window signature patterns set forth in claim 2, wherein the process window is defined by at least two process condition parameters of the lithography process.

9. The set of process window signature patterns set forth in claim 8, wherein the at least two process condition parameters are focus and exposure dose.

10. The set of process window signature patterns set forth in claim 8, wherein the at least two process condition parameters are selected from the group consisting of focus, exposure dose, numerical aperture, film stacks, lens aberrations, coherence, and illumination shifts.

11. The set of process window signature patterns set forth in claim 7, wherein the patterns in the set are further obtained by:

obtaining measured values of the at least one metric for the signature patterns, the measured values being obtained from measurements of the signature patterns printed on a wafer processed by the lithography process using the mask;

finding a location in the process window where a total difference measure between the measured values of the at least one metric for all of the signature patterns and the simulated values of the at least one metric for all of the signature patterns at the location in the process window is minimized; and

determining a change between the location in the process window where the total difference measure is minimized and nominal condition to determine a change in the lithography process.