Methods of Forming Integrated Circuit Packages, and Methods of Assembling Integrated Circuit Packages
First Claim
1. A method of assembling an integrated circuit package, comprising:
- providing a semiconductor die comprising integrated circuitry, the die comprising electrically conductive bond pad regions and electrically conductive caps over an entirety of the bond pad regions;
providing an interposer having electrically conductive projections; and
bonding the electrically conductive projections to the electrically conductive caps utilizing vibrational energy having a frequency of at least about one kilohertz.
7 Assignments
0 Petitions
Accused Products
Abstract
Some embodiments include methods of assembling integrated circuit packages in which at least two different conductive layers are formed over a bond pad region of a semiconductor die, and in which a conductive projection associated with an interposer is bonded through a gold ball to an outermost of the at least two conductive layers. The conductive layers may comprise one or more of silver, gold, copper, chromium, nickel, palladium, platinum, tantalum, titanium, vanadium and tungsten. In some embodiments, the bond pad region may comprise aluminum, an inner of the conductive layers may comprise nickel, an outer of the conductive layers may comprise gold, the conductive projection associated with the interposer may comprise gold; and the thermosonic bonding may comprise gold-to-gold bonding of the interposer projection to a gold ball, and gold-to-gold bonding of the outer conductive layer to the gold ball. Some embodiments include integrated circuit packages.
27 Citations
48 Claims
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1. A method of assembling an integrated circuit package, comprising:
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providing a semiconductor die comprising integrated circuitry, the die comprising electrically conductive bond pad regions and electrically conductive caps over an entirety of the bond pad regions; providing an interposer having electrically conductive projections; and bonding the electrically conductive projections to the electrically conductive caps utilizing vibrational energy having a frequency of at least about one kilohertz. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 11, 12, 13)
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10. (canceled)
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14-23. -23. (canceled)
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24. A method of forming an integrated circuit package, comprising:
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forming adhesion layers over bond pad regions of a semiconductor die; forming electrically conductive inner layers over the adhesion layers, the electrically conductive inner layers comprising one or more of B, Co, Cr, Ni, P, Pt, Ta, Ti, V and W; forming electrically conductive outer layers over the inner layers; directly contacting the electrically conductive outer layers with electrically conductive structures; directly contacting the electrically conductive structures with electrically conductive surfaces of a piece separate from the die; and utilizing vibrational energy with a frequency of at least about one kilohertz to bond the electrically conductive outer layers to the electrically conductive structures; and utilizing vibrational energy with a frequency of at least about one kilohertz to bond the electrically conductive surfaces to the electrically conductive structures. - View Dependent Claims (25, 26, 27, 28, 29, 30, 31, 32, 33)
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34. A method of forming an integrated circuit package, comprising:
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forming zinc-containing layers over bond pad regions of a semiconductor die; forming nickel-containing layers over the zinc-containing layers; forming gold-containing layers over the nickel-containing layers; directly contacting the gold-containing layers with gold-containing surfaces of one or more pieces separate from the die; and utilizing vibrational energy with a frequency of at least about one kilohertz to bond the gold-containing layers to the gold-containing surfaces. - View Dependent Claims (35, 36, 37, 38, 48)
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39-47. -47. (canceled)
Specification