Layer-Specific Energy Distribution Delamination

• US 20100154992A1
• Filed: 03/20/2009
• Published: 06/24/2010
• Est. Priority Date: 12/22/2008
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Sung, Kuo-Hua, Grespan, Silvio, Zhong, John Z., Youngs, Lynn, Feinstein, Casey J.
• Granted Patent: US 9,409,383 B2
• Time in Patent Office: Days
• US Class Current: 156/344
• CPC Class Codes: B23K 26/00 Working by laser beam, e.g. welding, cutting or boring
• CPC Class Codes: B23K 26/06 Shaping the laser beam, e.g. by masks or multi-focusing
• CPC Class Codes: B23K 26/0604 by a combination of beams
• CPC Class Codes: B23K 26/50 Working by transmitting the laser beam through or within the workpiece
• CPC Class Codes: B23K 26/57 the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
• CPC Class Codes: B26D 1/547 having a wire-like cutting member endless wire B26D1/46; severing using a heated wire B26F3/12
• CPC Class Codes: B26D 2001/0013 consisting of a reciprocating or endless band
• CPC Class Codes: B26D 2001/006 the cutting blade having a special shape, e.g. a special outline, serrations
• CPC Class Codes: B26D 3/28 Splitting layers from work; Mutually separating layers by cutting B26D3/30 takes precedence; Recovery of plastics or other constituents of waste material containing plastics B29B17/00
• CPC Class Codes: B26D 3/282 by peeling-off
• CPC Class Codes: B26D 7/086 by vibrating, e.g. ultrasonically
• CPC Class Codes: B26D 7/10 by heating with Laser B23K26/00; severing by heating B26F
• CPC Class Codes: B32B 2038/045 Slitting
• CPC Class Codes: B32B 2310/022 Electrical resistance
• CPC Class Codes: B32B 2310/028 using vibration, e.g. sonic or ultrasonic
• CPC Class Codes: B32B 2310/0806 using electromagnetic radiation
• CPC Class Codes: B32B 2310/0825 using IR radiation
• CPC Class Codes: B32B 2310/0843 using laser
• CPC Class Codes: B32B 2310/0862 using microwave
• CPC Class Codes: B32B 2457/20 Displays, e.g. liquid crystal displays, plasma displays
• CPC Class Codes: B32B 37/12 : characterised by using adhesives
• CPC Class Codes: B32B 37/16 : with all layers existing as coherent layers before laminating
• CPC Class Codes: B32B 37/18 : involving the assembly of discrete sheets or panels only
• CPC Class Codes: B32B 38/0004 : Cutting, tearing or severing, e.g. bursting; Cutter details cutting in general B26D; laminating combined with punching or perforating B32B38/04; removing all or part of the layers B32B38/10; cutting in combination with laying up and registration B32B38/185 takes precedence
• CPC Class Codes: B32B 38/16 : Drying; Softening; Cleaning
• CPC Class Codes: B32B 43/006 : Delaminating
• CPC Class Codes: B32B 7/12 : using interposed adhesives or interposed materials with bonding properties
• CPC Class Codes: G02F 1/1309 : Repairing; Testing
• CPC Class Codes: G02F 1/133308 : Support structures for LCD panels, e.g. frames or bezels
• CPC Class Codes: G02F 1/13338 : Input devices, e.g. touch panels
• CPC Class Codes: G06F 2200/1634 : Integrated protective display lid, e.g. for touch-sensitive display in handheld computer
• CPC Class Codes: G06F 2200/1635 : Stackable modules
• CPC Class Codes: G06F 3/03547 : Touch pads, in which fingers can move on a surface
• CPC Class Codes: Y10T 156/1153 : Temperature change for delamination [e.g., heating during delaminating, etc.]
• CPC Class Codes: Y10T 156/1158 : Electromagnetic radiation applied to work for delamination [e.g., microwave, uv, ir, etc.]
• CPC Class Codes: Y10T 156/1184 : Piercing layer during delaminating [e.g., cutting, etc.]
• CPC Class Codes: Y10T 156/1911 : Heating or cooling delaminating means [e.g., melting means, freezing means, etc.]
• CPC Class Codes: Y10T 156/1917 : Electromagnetic radiation delaminating means [e.g., microwave, uv, ir, etc.]
• CPC Class Codes: Y10T 156/1967 : Cutting delaminating means

Abstract

Delamination of a laminated multilayer stack is provided by generating a layer-specific energy distribution in the stack during delamination. A localized energy transferrer can generate localized heating, cooling heating, cooling, or other form of energy absorption or transmission, in a bonding layer of a multilayer stack. Localized energy transfer can include thermal energy transfer, such as heating and/or cooling, acoustic energy transfer, such as applying ultrasonic energy, electromagnetic energy transfer, such as applying laser light, directed microwaves, etc. Localized energy transfer can generate a layer-specific energy distribution that can weaken the bonding layer while reducing damage to other layers of the stack.

Claims

1. A method of delaminating a multilayer laminated stack including a bonding layer that bonds a first layer to a second layer, the method comprising:

generating a layer-specific energy distribution among layers of the multilayer laminated stack, wherein a distribution of energy in the bonding layer weakens a bonding capability of the bonding layer, and distributions of energy in the first and second layers result in no substantial damage to the first and second layers; and

breaking the weakened bonding layer to separate the first layer and the second layer.

2. The method of claim 1, wherein generating a layer-specific energy distribution comprises:

applying a directed transmission of energy to the bonding layer, while restricting the transmission of the energy to the first and second layers.

3. The method of claim 2, wherein applying a directed transmission of energy comprises:

applying thermal energy to a surface of the bonding layer.

4. The method of claim 3, wherein applying thermal energy comprises applying a heated mechanical separation mechanism to the surface.

5. The method of claim 1, wherein generating a layer-specific energy distribution comprises:

generating a directed transmission of energy from the bonding layer, while restricting the transmission of the energy from the first and second layers.

6. The method of claim 5, wherein generating a directed transmission of energy comprises:

removing thermal energy from the bonding layer through a surface of the bonding layer.

7. The method of claim 6, wherein removing thermal energy comprises applying a cooling mechanical separation mechanism to the surface.

8. The method of claim 1, wherein generating a layer-specific energy distribution comprises:

applying electromagnetic energy to the bonding layer, while restricting exposure of the first and second layers to the electromagnetic energy.

9. The method of claim 8, wherein applying electromagnetic energy comprises irradiating the surface with one of (i) laser light, (ii) microwaves, and (iii) infrared radiation.

10. The method of claim 1, wherein generating a layer-specific energy distribution comprises:

transmitting energy into the multilayer laminated stack, wherein one of the first and second layers transmits substantially all of the energy, and the bonding layer absorbs substantially all of the energy.

11. The method of claim 2, wherein applying a directed transmission of energy comprises:

transmitting the energy from a mechanical separator that breaks the weakened bonding layer.

12. An apparatus for delaminating a multilayer laminated stack including a bonding layer that bonds a first layer to a second layer, the apparatus comprising:

a localized energy transferrer; and

a separator,

wherein the localized energy transferrer generates a layer-specific energy distribution among layers of the multilayer laminated stack to weaken the bonding layer, and the separator breaks the weakened bonding layer to separate the first layer and the second layer.

13. The apparatus of claim 12, wherein the localized energy transferrer includes a heating mechanism operatively coupled to a mechanical cutting element.

14. The apparatus of claim 13, wherein the heating mechanism includes an electrical energy source, and the mechanical cutting element includes an electrically conductive material.

15. The apparatus of claim 12, wherein the localized energy transferrer includes a cooling mechanism operatively coupled to a mechanical cutting element.

16. The apparatus of claim 15, wherein the cooling mechanism includes a coolant and coolant delivery system, and the mechanical cutting element includes a thermally conductive material.

17. The apparatus of claim 12, wherein the localized energy transferrer includes a bandsaw pulley operatively coupled to an energy transmitter.

18. The apparatus of claim 17, wherein the energy transmitter is one of a heating mechanism, a cooling mechanism, an ultrasonic transducer, and an electromagnetic transmitter.

19. The apparatus of claim 12, wherein the localized energy transferrer includes a laser operatively coupled to a controller that directs laser light from the laser to an exposed surface of the bonding layer.

20. The apparatus of claim 19, wherein the controller further directs the laser light to scan along a line on the exposed surface.

21. The apparatus of claim 12, wherein the localized energy transferrer includes a coolant delivery mechanism and a mechanical separator, wherein the coolant delivery mechanism delivers a coolant to an exposed surface of the bonding layer, and the mechanical separator breaks the cooled exposed surface of the bonding layer.

22. The apparatus of claim 12, wherein the localized energy transferrer includes an energy beam mechanism that transmits an energy beam, and a focusing mechanism that focuses the energy beam on the bonding layer.

23. The apparatus of claim 22, wherein the energy beam mechanism includes a light source, and the focusing mechanism includes an optical lens.

24. The apparatus of claim 22, wherein the energy beam mechanism includes a plurality of lasers, and the focusing mechanism includes an aiming mechanism that aims the lasers such that laser beams from the lasers converge in the bonding layer.

25. The apparatus of claim 12, wherein the localized energy transferrer includes a conductive layer embedded in the bonding layer.

26. The apparatus of claim 25, wherein the conductive layer is electrically conductive and a portion of the electrically conductive layer extends from the multilayer laminated stack to form an exposed electrical contact surface.

27. The apparatus of claim 25, wherein the conductive layer is thermally conductive and a portion of the thermally conductive layer extends from the multilayer laminated stack to form an exposed thermal contact surface.

28. The apparatus of claim 12, wherein the localized energy transferrer includes an energy transmitter that transmits energy through the first layer to the bonding layer of the multilayer laminated stack, wherein the first layer transmits substantially all of the energy and the bonding layer absorbs substantially all of the energy.