HEAT PIPE AND COOLING DEVICE USED IN CRYOTECHNOLOGY
First Claim
1. A heat pipe for cryotechnology, the heat pipe comprising:
- a casing pipe and a chamber encapsulated hermetically by a condensation element at one pipe end and by an evaporation element at the other pipe end and filled with heat transfer medium, wherein in the chamber, between the condensation element and the evaporation element, at least one cooling module is installed which partially bears with a tubular surface area against the inner surface of the casing pipe and which is provided at least on the condensation element side with a conducting means in order to guide at least one of condensed and liquid heat transfer medium to the inside of the surface area of the cooling module.
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Accused Products
Abstract
The invention relates to a heat pipe or cold pipe for cryotechnology, with a casing pipe and with a chamber encapsulated hermetically by a condensation element at one pipe end and by an evaporation element at the other pipe end and filled with a heat transfer medium suitable for cryogenics. So that superconductive elements or components can be cooled to the required transition temperature with high operating reliability and efficiency in a short cooling time, in the chamber, between the condensation element and the evaporation element, at least one cooling module is installed which partially bears with a tubular surface area against the inner surface of the casing pipe and which is provided at least on the condensation element side with a conducting means in order to guide condensed and/or liquid heat transfer medium to the surface area. The invention also relates to a cooling device having a plurality of cold pipes.
20 Citations
20 Claims
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1. A heat pipe for cryotechnology, the heat pipe comprising:
- a casing pipe and a chamber encapsulated hermetically by a condensation element at one pipe end and by an evaporation element at the other pipe end and filled with heat transfer medium, wherein in the chamber, between the condensation element and the evaporation element, at least one cooling module is installed which partially bears with a tubular surface area against the inner surface of the casing pipe and which is provided at least on the condensation element side with a conducting means in order to guide at least one of condensed and liquid heat transfer medium to the inside of the surface area of the cooling module.
- View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A cooling device for cryotechnology for the cooling of superconductor components or superconductor coils with at least one heat pipe, the cooling device comprising:
- a reception pipe, in the inner space of which the reception pipe are arranged a plurality of heat pipes, condensation elements of the heat pipes are coupled thermally to a cryocooler and casing pipes of the cryocooler are at least partially in contact with the reception pipe, cooling modules of a plurality of the heat pipes lying in one common plane, and a superconductive component being positioned in the same plane on the outer circumference of the reception pipe.
- View Dependent Claims (19, 20)
Specification