SEMICONDUCTOR CHIP ASSEMBLY WITH BASE HEAT SPREADER AND CAVITY IN BASE

• US 20100155769A1
• Filed: 02/26/2010
• Published: 06/24/2010
• Est. Priority Date: 03/25/2008
• Status: Active Grant

• Current Assignee: Bridge Semiconductor Corporation
• Original Assignee: Bridge Semiconductor Corporation
• Inventors: Lin, Charles W.C., Lim, Sangwhoo, Wang, Chia-Chung
• Granted Patent: US 8,207,553 B2
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: H01L 21/486 Via connections through the substrate with or without pins
• CPC Class Codes: H01L 21/4882 Assembly of heatsink parts
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/85205 Ultrasonic bonding
• CPC Class Codes: H01L 23/3677 Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/642 characterized by the shape

Abstract

A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a base. A cavity extends through the adhesive into the base. The semiconductor device extends into the cavity, is electrically connected to the conductive trace and is thermally connected to the heat spreader. The adhesive extends between the cavity and the conductive trace and between the base and the conductive trace. The conductive trace is located outside the cavity and provides signal routing between a pad and a terminal.

Claims

1. A semiconductor chip assembly, comprising:

a semiconductor device;

an adhesive;

a heat spreader that includes a base;

a conductive trace that includes a pad and a terminal; and

an encapsulant;

wherein a cavity extends through the adhesive into the base, faces in the upward direction and has a diameter that increases as it extends downwardly through the adhesive to the base and decreases as it extends downwardly from the adhesive into the base;

wherein the semiconductor device extends into the cavity, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the base;

wherein the adhesive is mounted on and extends above the base, extends between the cavity and the pad, extends laterally from the cavity to or beyond the terminal and is sandwiched between the base and the pad;

wherein the conductive trace is located outside the cavity;

wherein the encapsulant extends into the cavity and covers the semiconductor device in the upward direction; and

wherein the base extends below the semiconductor device, the adhesive, the cavity, the encapsulant and the pad.

2. The assembly of claim 1, wherein the semiconductor device is located within the cavity.

3. The assembly of claim 1, wherein the semiconductor device is an LED chip.

4. The assembly of claim 1, wherein the semiconductor device is electrically connected to the pad using a wire bond that extends outside the cavity and is thermally connected to the base using a die attach that is located within the cavity.

5. The assembly of claim 1, wherein the adhesive contacts the base, the encapsulant, the pad and the terminal.

6. The assembly of claim 1, wherein the adhesive covers and surrounds the cavity above the base in the lateral directions.

7. The assembly of claim 1, wherein the adhesive conformally coats a top surface of the base outside the cavity.

8. The assembly of claim 1, wherein the adhesive fills the space between the base and the conductive trace.

9. The assembly of claim 1, wherein the adhesive extends laterally from the cavity beyond the terminal.

10. The assembly of claim 1, wherein the adhesive extends to peripheral edges of the assembly.

11. The assembly of claim 1, wherein the cavity has a cut-off conical shape in the adhesive.

12. The assembly of claim 1, wherein the cavity has a concave crater-like shape in the base.

13. The assembly of claim 1, wherein the cavity has a cut-off conical shape in the adhesive and a concave crater-like shape in the base.

14. The assembly of claim 1, wherein the base covers the semiconductor device, the adhesive, the cavity, the encapsulant and the conductive trace in the downward direction and extends to peripheral edges of the assembly.

15. The assembly of claim 1, wherein the conductive trace is spaced from the cavity and the base, and the pad and the terminal contact and overlap the adhesive.

16. A semiconductor chip assembly, comprising:

a semiconductor device;

an adhesive;

a heat spreader that includes a base;

a substrate that includes a dielectric layer, wherein an aperture extends through the substrate;

a conductive trace that includes a pad and a terminal; and

an encapsulant;

wherein a cavity extends through the adhesive into the base, faces in the upward direction and has a diameter that increases as it extends downwardly through the adhesive to the base and decreases as it extends downwardly from the adhesive into the base;

wherein the semiconductor device is located within the cavity, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the base;

wherein the adhesive is mounted on and extends above the base, extends into a gap in the aperture between the cavity and the substrate, extends across the dielectric layer in the gap, extends laterally from the cavity to or beyond the terminal and is sandwiched between the encapsulant and the dielectric layer and between the base and the dielectric layer;

wherein the substrate is mounted on the adhesive and extends above the base;

wherein the conductive trace is located outside the cavity;

wherein the encapsulant extends into the cavity and covers the semiconductor device in the upward direction; and

wherein the base extends below the semiconductor device, the adhesive, the cavity, the encapsulant, the substrate and the pad.

17. The assembly of claim 16, wherein the semiconductor device is an LED chip.

18. The assembly of claim 16, wherein the semiconductor device is electrically connected to the pad using a wire bond that extends within and outside the cavity and is thermally connected to the base using a die attach that is located within the cavity.

19. The assembly of claim 16, wherein the adhesive contacts the encapsulant and the dielectric layer in the gap and contacts the base and the dielectric layer outside the gap.

20. The assembly of claim 16, wherein the adhesive covers and surrounds the cavity above the base in the lateral directions.

21. The assembly of claim 16, wherein the adhesive fills the space between the cavity and the dielectric layer.

22. The assembly of claim 16, wherein the adhesive fills the space between the base and the substrate.

23. The assembly of claim 16, wherein the adhesive extends laterally from the cavity beyond the terminal.

24. The assembly of claim 16, wherein the adhesive extends to peripheral edges of the assembly.

25. The assembly of claim 16, wherein the cavity has a cut-off conical shape in the adhesive.

26. The assembly of claim 16, wherein the cavity has a concave crater-like shape in the base.

27. The assembly of claim 16, wherein the cavity has a cut-off conical shape in the adhesive and a concave crater-like shape in the base.

28. The assembly of claim 16, wherein the base covers the semiconductor device, the adhesive, the cavity, the encapsulant, the substrate and the conductive trace in the downward direction and extends to peripheral edges of the assembly.

29. The assembly of claim 16, wherein the substrate is spaced from the cavity and the base and is a laminated structure.

30. The assembly of claim 16, wherein the encapsulant contacts the semiconductor device and the adhesive in the cavity.

31. A semiconductor chip assembly, comprising:

a semiconductor device;

an adhesive;

a heat spreader that includes a base;

a substrate that includes a conductive trace and a dielectric layer, wherein the conductive trace includes a pad, a terminal and a routing line, the pad, the terminal and the routing line contact and extend above the dielectric layer, an electrically conductive path between the pad and the terminal includes the routing line, and an aperture extends through the substrate; and

an encapsulant;

wherein a cavity in the adhesive extends through the adhesive into the base, faces in the upward direction and has a diameter that increases as it extends downwardly through the adhesive to the base and decreases as it extends downwardly from the adhesive into the base;

wherein the semiconductor device is located within the cavity, is mounted on the base, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the base;

wherein the adhesive is mounted on and extends above the base, extends into a gap in the aperture between the cavity and the substrate, extends across the dielectric layer in the gap, is sandwiched between the encapsulant and the dielectric layer in the gap, is sandwiched between the base and the dielectric layer outside the gap, surrounds the cavity above the base in the lateral directions, is overlapped by the pad, the terminal and the routing line and extends to peripheral edges of the assembly;

wherein the substrate is mounted on the adhesive, extends above the base and is located outside the cavity;

wherein the encapsulant extends into the cavity and covers the semiconductor device in the upward direction; and

wherein the base extends below the semiconductor device, the adhesive, the cavity, the encapsulant and the substrate, covers the adhesive, the cavity, the encapsulant and the substrate in the downward direction and extends to peripheral edges of the assembly.

32. The assembly of claim 31, wherein the semiconductor device is an LED chip, is electrically connected to the pad using a wire bond that extends within and outside the cavity and is thermally connected to the base using a die attach that is located within the cavity.

33. The assembly of claim 31, wherein the substrate is spaced from the cavity and the base, the adhesive contacts the encapsulant and the dielectric layer in the gap and contacts the base and the dielectric layer outside the gap, and the encapsulant contacts the semiconductor device and the adhesive in the cavity.

34. The assembly of claim 31, wherein the cavity has a cut-off conical shape in the adhesive and a concave crater-like shape in the base.

35. The assembly of claim 31, wherein the adhesive is adjacent to and coplanar with the base below the dielectric layer.