SEMICONDUCTOR CHIP ASSEMBLY WITH BASE HEAT SPREADER AND CAVITY IN BASE
First Claim
Patent Images
1. A semiconductor chip assembly, comprising:
- a semiconductor device;
an adhesive;
a heat spreader that includes a base;
a conductive trace that includes a pad and a terminal; and
an encapsulant;
wherein a cavity extends through the adhesive into the base, faces in the upward direction and has a diameter that increases as it extends downwardly through the adhesive to the base and decreases as it extends downwardly from the adhesive into the base;
wherein the semiconductor device extends into the cavity, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the base;
wherein the adhesive is mounted on and extends above the base, extends between the cavity and the pad, extends laterally from the cavity to or beyond the terminal and is sandwiched between the base and the pad;
wherein the conductive trace is located outside the cavity;
wherein the encapsulant extends into the cavity and covers the semiconductor device in the upward direction; and
wherein the base extends below the semiconductor device, the adhesive, the cavity, the encapsulant and the pad.
1 Assignment
0 Petitions
Accused Products
Abstract
A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a base. A cavity extends through the adhesive into the base. The semiconductor device extends into the cavity, is electrically connected to the conductive trace and is thermally connected to the heat spreader. The adhesive extends between the cavity and the conductive trace and between the base and the conductive trace. The conductive trace is located outside the cavity and provides signal routing between a pad and a terminal.
-
Citations
35 Claims
-
1. A semiconductor chip assembly, comprising:
-
a semiconductor device; an adhesive; a heat spreader that includes a base; a conductive trace that includes a pad and a terminal; and an encapsulant; wherein a cavity extends through the adhesive into the base, faces in the upward direction and has a diameter that increases as it extends downwardly through the adhesive to the base and decreases as it extends downwardly from the adhesive into the base; wherein the semiconductor device extends into the cavity, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the base; wherein the adhesive is mounted on and extends above the base, extends between the cavity and the pad, extends laterally from the cavity to or beyond the terminal and is sandwiched between the base and the pad; wherein the conductive trace is located outside the cavity; wherein the encapsulant extends into the cavity and covers the semiconductor device in the upward direction; and wherein the base extends below the semiconductor device, the adhesive, the cavity, the encapsulant and the pad. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
-
-
16. A semiconductor chip assembly, comprising:
-
a semiconductor device; an adhesive; a heat spreader that includes a base; a substrate that includes a dielectric layer, wherein an aperture extends through the substrate; a conductive trace that includes a pad and a terminal; and an encapsulant; wherein a cavity extends through the adhesive into the base, faces in the upward direction and has a diameter that increases as it extends downwardly through the adhesive to the base and decreases as it extends downwardly from the adhesive into the base; wherein the semiconductor device is located within the cavity, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the base; wherein the adhesive is mounted on and extends above the base, extends into a gap in the aperture between the cavity and the substrate, extends across the dielectric layer in the gap, extends laterally from the cavity to or beyond the terminal and is sandwiched between the encapsulant and the dielectric layer and between the base and the dielectric layer; wherein the substrate is mounted on the adhesive and extends above the base; wherein the conductive trace is located outside the cavity; wherein the encapsulant extends into the cavity and covers the semiconductor device in the upward direction; and wherein the base extends below the semiconductor device, the adhesive, the cavity, the encapsulant, the substrate and the pad. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30)
-
-
31. A semiconductor chip assembly, comprising:
-
a semiconductor device; an adhesive; a heat spreader that includes a base; a substrate that includes a conductive trace and a dielectric layer, wherein the conductive trace includes a pad, a terminal and a routing line, the pad, the terminal and the routing line contact and extend above the dielectric layer, an electrically conductive path between the pad and the terminal includes the routing line, and an aperture extends through the substrate; and an encapsulant; wherein a cavity in the adhesive extends through the adhesive into the base, faces in the upward direction and has a diameter that increases as it extends downwardly through the adhesive to the base and decreases as it extends downwardly from the adhesive into the base; wherein the semiconductor device is located within the cavity, is mounted on the base, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the base; wherein the adhesive is mounted on and extends above the base, extends into a gap in the aperture between the cavity and the substrate, extends across the dielectric layer in the gap, is sandwiched between the encapsulant and the dielectric layer in the gap, is sandwiched between the base and the dielectric layer outside the gap, surrounds the cavity above the base in the lateral directions, is overlapped by the pad, the terminal and the routing line and extends to peripheral edges of the assembly; wherein the substrate is mounted on the adhesive, extends above the base and is located outside the cavity; wherein the encapsulant extends into the cavity and covers the semiconductor device in the upward direction; and wherein the base extends below the semiconductor device, the adhesive, the cavity, the encapsulant and the substrate, covers the adhesive, the cavity, the encapsulant and the substrate in the downward direction and extends to peripheral edges of the assembly. - View Dependent Claims (32, 33, 34, 35)
-
Specification