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SEMICONDUCTOR CHIP ASSEMBLY WITH BASE HEAT SPREADER AND CAVITY IN BASE

  • US 20100155769A1
  • Filed: 02/26/2010
  • Published: 06/24/2010
  • Est. Priority Date: 03/25/2008
  • Status: Active Grant
First Claim
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1. A semiconductor chip assembly, comprising:

  • a semiconductor device;

    an adhesive;

    a heat spreader that includes a base;

    a conductive trace that includes a pad and a terminal; and

    an encapsulant;

    wherein a cavity extends through the adhesive into the base, faces in the upward direction and has a diameter that increases as it extends downwardly through the adhesive to the base and decreases as it extends downwardly from the adhesive into the base;

    wherein the semiconductor device extends into the cavity, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the base;

    wherein the adhesive is mounted on and extends above the base, extends between the cavity and the pad, extends laterally from the cavity to or beyond the terminal and is sandwiched between the base and the pad;

    wherein the conductive trace is located outside the cavity;

    wherein the encapsulant extends into the cavity and covers the semiconductor device in the upward direction; and

    wherein the base extends below the semiconductor device, the adhesive, the cavity, the encapsulant and the pad.

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