MEMS PROCESS AND DEVICE

• US 20100155864A1
• Filed: 03/09/2010
• Published: 06/24/2010
• Est. Priority Date: 03/20/2006
• Status: Active Grant

• Current Assignee: Cirrus Logic Incorporated
• Original Assignee: Anthony Traynor, Mark Begbie, Richard I. Laming
• Inventors: Laming, Richard I., Traynor, Anthony, Begbie, Mark
• Granted Patent: US 7,856,804 B2
• Time in Patent Office: Days
• US Class Current: 257/416
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 2203/0127 Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
• CPC Class Codes: B81C 1/00158 Diaphragms, membranes manufacture process for semi-permeable inorganic membranes B01D67/0039
• CPC Class Codes: B81C 2201/0109 Sacrificial layers not provided for in B81C2201/0107 - B81C2201/0108
• CPC Class Codes: B81C 99/004 during manufacturing
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 2307/207 Shape aspects of the outer suspension of loudspeaker diaphragms
• CPC Class Codes: H04R 7/10 comprising superposed layers in contact
• CPC Class Codes: H04R 7/18 at the periphery
• CPC Class Codes: Y10S 977/733 Nanodiaphragm

Abstract

A MEMS device, for example a capacitive microphone, comprises a flexible membrane 11 that is free to move in response to pressure differences generated by sound waves. A first electrode 13 is mechanically coupled to the flexible membrane 11, and together form a first capacitive plate of the capacitive microphone device. A second electrode 23 is mechanically coupled to a generally rigid structural layer or back-plate 14, which together form a second capacitive plate of the capacitive microphone device. The capacitive microphone is formed on a substrate 1, for example a silicon wafer. A back-volume 33 is provided below the membrane 11, and is formed using a “back-etch” through the substrate 1. A first cavity 9 is located directly below the membrane 11, and is formed using a first sacrificial layer during the fabrication process. Interposed between the first and second electrodes 13 and 23 is a second cavity 17, which is formed using a second sacrificial layer during the fabrication process. A plurality of bleed holes 15 connect the first cavity 9 and the second cavity 17. Acoustic holes 31 are arranged in the back-plate 14 so as to allow free movement of air molecules, such that the sound waves can enter the second cavity 17. The first and second cavities 9 and 17 in association with the back-volume 33 allow the membrane 11 to move in response to the sound waves entering via the acoustic holes 31 in the back-plate 14. The provision of first and second sacrificial layers has the advantage of protecting the membrane during manufacture, and disassociating the back etch process from the definition of the membrane. The bleed holes 15 aid with the removal of the first and second sacrificial layers. The bleed holes 15 also contribute to the operating characteristics of the microphone.

Claims

1-47. -47. (canceled)

48. A micro-electrical-mechanical system (MEMS) capacitive microphone comprising:

first and second electrodes;

a membrane that it is mechanically coupled to the first electrode; and

a back plate that it is mechanically coupled to the second electrode;

wherein the first and second electrodes each have a diameter that is different to the diameter of the membrane.

49. A micro-electrical-mechanical system (MEMS) microphone as claimed in claim 48, wherein the diameters of the first and second electrodes are smaller than the diameter of the membrane.

50. A micro-electrical-mechanical system (MEMS) microphone as claimed in claim 49, wherein the diameters of the first and second electrodes are less than 90% of the diameter of the membrane.

51. A micro-electrical-mechanical system (MEMS) microphone as claimed in claim 49, wherein the diameters of the first and second electrodes are less than 80% of the diameter of the membrane.

52. A micro-electrical-mechanical system (MEMS) microphone as claimed in claim 49, wherein the diameters of the first and second electrodes are between 50-70% of the diameter of the membrane.

53. A micro-electrical-mechanical system (MEMS) microphone as claimed in claim 48, wherein the diameters of the first and second electrodes are substantially equal.

85. An electronic device comprising a micro-electrical-mechanical system (MEMS) microphone as claimed in claim 48.

86. A communications device comprising a micro-electrical-mechanical system (MEMS) microphone as claimed in claim 48.

87. A portable telephone device comprising a micro-electrical-mechanical system (MEMS) microphone as claimed in claim 48.

88. An audio device comprising a micro-electrical-mechanical system (MEMS) microphone as claimed in claim 48.

89. A computer device comprising a micro-electrical-mechanical system (MEMS) microphone as claimed in claim 48.

90. A vehicle comprising a micro-electrical-mechanical system (MEMS) microphone as claimed in claim 48.

91. A medical device comprising a micro-electrical-mechanical system (MEMS) microphone as claimed in claim 48.

92. An industrial device comprising a micro-electrical-mechanical system (MEMS) microphone as claimed in claim 48.

54. A micro-electrical-mechanical system (MEMS) capacitive microphone comprising:

first and second electrodes;

a membrane that it is mechanically coupled to the first electrode; and

a back plate that it is mechanically coupled to the second electrode;

wherein the second electrode comprises one or more openings.

55. A micro-electrical-mechanical system (MEMS) capacitive microphone as claimed in claim 54, wherein the one or more openings correspond to one or more openings formed in the back plate.

56. A micro-electrical-mechanical system (MEMS) capacitive microphone as claimed in claim 55, wherein at least one of the openings in the second electrode is larger than a corresponding opening in the back plate.

57. A micro-electrical-mechanical system (MEMS) capacitive microphone as claimed in claim 54, wherein the membrane comprises one or more openings corresponding to one or more openings in the first electrode.

58. A method as claimed in claim 57, wherein at least one of the openings in the first electrode is larger than a corresponding opening in the membrane.

59-63. -63. (canceled)

64. A micro-electrical-mechanical system (MEMS) microphone comprising:

a substrate;

first and second electrodes;

a membrane that it is mechanically coupled to the first electrode; and

a back plate that it is mechanically coupled to the second electrode;

and further comprising;

a first cavity beneath the membrane, the first cavity formed using a first sacrificial layer; and

a second cavity between the first and second electrodes, the second cavity formed using a second sacrificial layer.

65. A micro-electrical-mechanical system (MEMS) microphone as claimed in claim 64, further comprising a third cavity, the third cavity connecting with the first cavity to form a back volume.

66. A micro-electrical-mechanical system (MEMS) microphone as claimed in claim 65, wherein the third cavity is formed such that the area of the third cavity at a plane where the third cavity meets the first cavity is smaller than the area of the first cavity, such that the area of the third cavity in said plane falls substantially within the perimeter of the first cavity.

67. A micro-electrical-mechanical system (MEMS) microphone as claimed in any one of claims 64, further comprising a plurality of openings in the material of the membrane, the plurality of openings connecting the first cavity and the second cavity.

68. A micro-electrical-mechanical system (MEMS) microphone as claimed in claim 67, wherein the plurality of openings are located in an outer area of the first cavity, the outer area of the first cavity being outside the area defined by the third cavity at the plane where the third cavity meets the first cavity.

69. A micro-electrical-mechanical system (MEMS) microphone as claimed in claim 68, wherein said openings are formed on one or more concentric circles in the outer area of the first cavity.

70. A micro-electrical-mechanical system (MEMS) microphone as claimed in claim 67, wherein the plurality of openings are arranged such that an area etched through a first opening substantially overlaps an area etched through an adjacent opening.

71. A micro-electrical-mechanical system (MEMS) microphone as claimed in claim 70, wherein the openings having a spacing of less than 100 um.

72. A micro-electrical-mechanical system (MEMS) microphone as claimed in claim 64, wherein the first and second electrodes each have a diameter that is different to the diameter of the membrane.

73. A micro-electrical-mechanical system (MEMS) microphone as claimed in claim 72, wherein the diameters of the first and second electrodes are smaller than the diameter of the membrane.

74. A micro-electrical-mechanical system (MEMS) microphone as claimed in claim 73, wherein the diameters of the first and second electrodes are less than 90% of the diameter of the membrane.

75. A micro-electrical-mechanical system (MEMS) microphone as claimed in claim 73, wherein the diameters of the first and second electrodes are less than 80% of the diameter of the membrane.

76. A micro-electrical-mechanical system (MEMS) microphone as claimed in claim 73, wherein the diameters of the first and second electrodes are between 50-70% of the diameter of the membrane.

77. A micro-electrical-mechanical system (MEMS) microphone as claimed in claim 72, wherein the diameters of the first and second electrodes are substantially equal.

78. A micro-electrical-mechanical system (MEMS) microphone as claimed in claim 64, further comprising a plurality of openings in the back plate.

79. A micro-electrical-mechanical system (MEMS) microphone as claimed in claim 78, wherein at least some of the openings in the back plate pass through the second electrode.

80. A micro-electrical-mechanical system (MEMS) microphone as claimed in claim 64, further comprising one or more dimples on an inner surface of the back plate.

81. A micro-electrical-mechanical system (MEMS) microphone as claimed in claim 64, further comprising one or more dimples on a surface of the membrane.

82. A micro-electrical-mechanical system (MEMS) microphone as claimed in claim 81, wherein the one or more dimples are located on a surface of the membrane facing the first cavity, and on the outer area of the membrane, the outer area of the membrane being outside the area defined by the third cavity at the plane where the third cavity meets the first cavity

83. A micro-electrical-mechanical system (MEMS) microphone as claimed in claim 64, further comprising electronic circuitry on the same substrate as the MEMS microphone.

84. A micro-electrical-mechanical system (MEMS) microphone as claimed in claim 64, further comprising one or more electrical interface pads for connection to external electronic circuitry.