HIGH TEMPERATURE RESISTANT SOLID STATE PRESSURE SENSOR
First Claim
1. A harsh environment transducer comprising:
- a substrate having a first surface and a second surface, wherein said second surface is in communication with the environment;
a device layer sensor means located on said substrate for measuring a parameter associated with the environment, said sensor means including a single crystal semiconductor material having a thickness of less than about 0.5 microns;
an output contact located on said substrate and in electrical communication with said sensor means;
a package having an internal package space and a port for communication with the environment, said package receiving said substrate in said internal package space such that said first surface of said substrate is substantially isolated from the environment and said second surface of said substrate is substantially exposed to the environment through said port;
a connecting component coupled to said package; and
a wire electrically connecting said connecting component and said output contact such that an output of said sensor means can be communicated, wherein an external surface of said wire is substantially platinum, and wherein an external surface of at least one of said output contact and said connecting component is substantially platinum.
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Accused Products
Abstract
A harsh environment transducer including a substrate having a first surface and a second surface, wherein the second surface is in communication with the environment. The transducer includes a device layer sensor means located on the substrate for measuring a parameter associated with the environment. The sensor means including a single crystal semiconductor material having a thickness of less than about 0.5 microns. The transducer further includes an output contact located on the substrate and in electrical communication with the sensor means. The transducer includes a package having an internal package space and a port for communication with the environment. The package receives the substrate in the internal package space such that the first surface of the substrate is substantially isolated from the environment and the second surface of the substrate is substantially exposed to the environment through the port. The transducer further includes a connecting component coupled to the package and a wire electrically connecting the connecting component and the output contact such that an output of the sensor means can be communicated. An external surface of the wire is substantially platinum, and an external surface of at least one of the output contact and the connecting component is substantially platinum.
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Citations
40 Claims
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1. A harsh environment transducer comprising:
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a substrate having a first surface and a second surface, wherein said second surface is in communication with the environment; a device layer sensor means located on said substrate for measuring a parameter associated with the environment, said sensor means including a single crystal semiconductor material having a thickness of less than about 0.5 microns; an output contact located on said substrate and in electrical communication with said sensor means; a package having an internal package space and a port for communication with the environment, said package receiving said substrate in said internal package space such that said first surface of said substrate is substantially isolated from the environment and said second surface of said substrate is substantially exposed to the environment through said port; a connecting component coupled to said package; and a wire electrically connecting said connecting component and said output contact such that an output of said sensor means can be communicated, wherein an external surface of said wire is substantially platinum, and wherein an external surface of at least one of said output contact and said connecting component is substantially platinum. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
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27. A pressure sensor for use in a harsh environment comprising:
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a substrate including a generally flexible diaphragm configured to flex when exposed to a differential pressure thereacross; a sensing element at least partially located on said diaphragm whereby flexure of said diaphragm induces a change in an electrical property of said sensing element; a package defining an internal space and receiving said substrate in said internal space such that pressure fluctuations in the environment manifest as said differential pressure; and
,a bond between said package and said substrate formed by melting a high temperature braze material or a glass frit material, wherein said bond has a liquidus temperature of between about 650°
C. and about 750°
C., and has stable mechanical properties at about 400°
C.
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28. A pressure sensor for use in a harsh environment comprising:
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a substrate including a generally flexible diaphragm configured to flex when exposed to a differential pressure thereacross; a sensing element at least partially located on said diaphragm whereby flexure of said diaphragm induces a change in an electrical property of said sensing element; a package defining an internal space and receiving said substrate in said internal space such that pressure fluctuations in the environment manifest as said differential pressure; and
,a bond between said package and said substrate formed by melting a high temperature braze material or a glass frit material, wherein said bond is formed by a high temperature brazing preform material comprised of indium-copper-gold containing about 15% indium by weight, or gold-germanium, or glass frit. - View Dependent Claims (29)
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30. A pressure sensor for use in a harsh environment comprising:
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a generally flexible non-metallic diaphragm configured to flex when exposed to a sufficient differential pressure thereacross; a semiconductive single crystal piezoelectric or piezoresistive sensing element at least partially located on said diaphragm such that said sensing element provides an electrical signal upon flexure of said diaphragm; and an oxide layer positioned between said diaphragm and said sensing element, wherein said sensor can withstand, and continue functioning when exposed to, a pressure of 600 psig and a temperature of 450°
C. - View Dependent Claims (31, 32, 33, 34, 35, 36, 37, 38)
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39. A method for forming a transducer comprising the steps of:
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providing a semiconductor-on-insulator wafer including first and second semiconductor layers separated by an electrically insulating layer, wherein said first layer is formed or provided by hydrogen ion delamination of a starting wafer; doping said first layer to form a piezoresistive film; etching said piezoresistive film to form at least one piezoresistor; depositing or growing a metallization layer on said semiconductor-on-insulator wafer, said metallization layer including an electrical connection portion that is located on or is electrically coupled to said piezoresistor; removing at least part of said second semiconductor layer to form a diaphragm, with said at least part of said piezoresistor being located on said diaphragm; and joining said wafer to a package by melting a high temperature braze material or a glass frit material.
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40. A pressure sensor for use in a harsh environment comprising:
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a substrate in communication with the environment, said substrate including a generally flexible diaphragm configured to flex when exposed to a sufficient differential pressure thereacross; a sensing element at least partially located on said diaphragm such that said sensing element provides an electrical signal upon flexure of said diaphragm; an electrically insulating layer positioned between said diaphragm and said sensing element; a cap configured to generally sealingly mate with said substrate and substantially cover said sensing element; and a bond formed between said cap and said substrate by aligning said cap with said substrate and heating said cap and said substrate to a first temperature, whereby said bond that is formed after heating said cap and said substrate to said first temperature is stable at a second temperature, where said second temperature is greater than said first temperature.
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Specification