METHOD FOR BONDING TWO SUBSTRATES
First Claim
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1. A method for bonding two substrates comprising the steps of:
- providing each substrate with a surface for contact;
applying an activation treatment to at least one surface of the two substrates to be bonded; and
contacting the surfaces of the two substrates under partial vacuum to bond the substrates together.
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Abstract
The invention relates to a method for bonding two substrates by applying an activation treatment to at least one of the substrates, and performing the contacting step of the two substrates under partial vacuum. Due to the combination of the two steps, it is possible to carry out the bonding and obtain high bonding energy with a reduced number of bonding voids. The invention is in particular applicable to a substrate of processed or at least partially processed devices.
62 Citations
17 Claims
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1. A method for bonding two substrates comprising the steps of:
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providing each substrate with a surface for contact; applying an activation treatment to at least one surface of the two substrates to be bonded; and contacting the surfaces of the two substrates under partial vacuum to bond the substrates together. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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Specification