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METHOD FOR BONDING TWO SUBSTRATES

  • US 20100155882A1
  • Filed: 09/09/2009
  • Published: 06/24/2010
  • Est. Priority Date: 12/22/2008
  • Status: Abandoned Application
First Claim
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1. A method for bonding two substrates comprising the steps of:

  • providing each substrate with a surface for contact;

    applying an activation treatment to at least one surface of the two substrates to be bonded; and

    contacting the surfaces of the two substrates under partial vacuum to bond the substrates together.

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