Low cost anufacturing of micro-channel heatsink
First Claim
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1. A cooling device comprising:
- a substrate assembly comprising;
a ceramic layer comprising a first planar surface and a second planar surface substantially parallel to the first planar surface;
a metal layer bonded to the first planar surface;
a channel layer bonded to the second planar surface; and
a manifold layer bonded to a surface of the channel layer opposite the second planar surface, the substrate layers configured together as a single unitary substrate; and
a plenum housing bonded to the substrate assembly and configured to provide manifold layer inlet and outlet ports.
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Abstract
A cooling device includes a ceramic substrate with a metal layer bonded to an outer planar surface. The cooling device also includes a channel layer bonded to an opposite side of the ceramic substrate and a manifold layer bonded to an outer surface of the channel layer. The substrate layers are bonded together using a high temperature process such as brazing to form a single substrate assembly. A plenum housing is bonded to the single substrate assembly via a low temperature bonding process such as adhesive bonding and is configured to provide extended manifold layer inlet and outlet ports.
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Citations
22 Claims
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1. A cooling device comprising:
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a substrate assembly comprising; a ceramic layer comprising a first planar surface and a second planar surface substantially parallel to the first planar surface; a metal layer bonded to the first planar surface; a channel layer bonded to the second planar surface; and a manifold layer bonded to a surface of the channel layer opposite the second planar surface, the substrate layers configured together as a single unitary substrate; and a plenum housing bonded to the substrate assembly and configured to provide manifold layer inlet and outlet ports. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A method of manufacturing a cooling device, the method comprising:
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providing a first ceramic substrate; bonding a first metal layer to one side of the first ceramic substrate; bonding a first side of a first channel layer to an opposite side of the first ceramic substrate; and bonding a first manifold layer to a second side of the first channel layer opposite the first side of the first channel layer bonded to the first ceramic substrate, such that the first ceramic substrate, first metal layer, first channel layer and the first manifold layer bonded together form a first substrate assembly. - View Dependent Claims (17, 18, 19, 20, 21, 22)
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Specification