Low cost anufacturing of micro-channel heatsink

• US 20100157526A1
• Filed: 12/22/2008
• Published: 06/24/2010
• Est. Priority Date: 12/22/2008
• Status: Active Grant

• Current Assignee: General Electric Company
• Original Assignee: General Electric Company
• Inventors: Stevanovic, Ljubisa Dragoljub, Beaupre, Richard Alfred, Woychik, Charles Gerard, Erno, Daniel Jason
• Granted Patent: US 8,929,071 B2
• Time in Patent Office: Days
• US Class Current: 361/689
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 23/3735 Laminates or multilayers, e.g. direct bond copper ceramic substrates
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: Y10T 29/4935 Heat exchanger or boiler making

Abstract

A cooling device includes a ceramic substrate with a metal layer bonded to an outer planar surface. The cooling device also includes a channel layer bonded to an opposite side of the ceramic substrate and a manifold layer bonded to an outer surface of the channel layer. The substrate layers are bonded together using a high temperature process such as brazing to form a single substrate assembly. A plenum housing is bonded to the single substrate assembly via a low temperature bonding process such as adhesive bonding and is configured to provide extended manifold layer inlet and outlet ports.

Claims

1. A cooling device comprising:

a substrate assembly comprising;

a ceramic layer comprising a first planar surface and a second planar surface substantially parallel to the first planar surface;

a metal layer bonded to the first planar surface;

a channel layer bonded to the second planar surface; and

a manifold layer bonded to a surface of the channel layer opposite the second planar surface, the substrate layers configured together as a single unitary substrate; and

a plenum housing bonded to the substrate assembly and configured to provide manifold layer inlet and outlet ports.

2. The cooling device according to claim 1, wherein the metal layer, channel layer and manifold layer each have a thickness of about 0.3 mm.

3. The cooling device according to claim 1, wherein the metal layer has a thickness of about 0.3 mm and the channel layer and manifold layer each have a thickness of about 0.15 mm.

4. The cooling device according to claim 1, wherein the metal layer has a thickness of about 0.6 mm and the channel layer and manifold layer each have a thickness of about 0.3 mm.

5. The cooling device according to claim 1, wherein the channel layer comprises a plurality of channel regions, each channel region having a thickness of about 0.05 mm to about 0.6 mm, the plurality of channel regions configured with a pitch of about 0.2 mm to about 0.8 mm between each channel region.

6. The cooling device according to claim 1, wherein the manifold layer comprises a plurality of inlet manifolds and a plurality of outlet manifolds, wherein the plurality of inlet manifolds are configured to receive a coolant and the plurality of outlet manifolds are configured to exhaust the coolant, and further wherein the plurality of inlet and outlet manifolds are interleaved and are oriented substantially parallel to the first and second planar surfaces.

7. The cooling device according to claim 1, wherein the plenum housing comprises a moldable or castable material.

8. The cooling device according to claim 1, wherein the plenum housing comprises a manifold pattern that replicates the manifold pattern associated with the manifold layer.

9. The cooling device according to claim 1, wherein the substrate layers are bonded together via a high temperature bonding process between about 980°

C. and about 1000°

C.

10. The cooling device according to claim 1, wherein the substrate layers comprise thermally conductive materials, each having a corresponding thickness and thermal coefficient of expansion configured to prevent structural degradation of the substrate during high temperature bonding between about 980°

C. and about 1000°

C.

11. The cooling device according to claim 1, wherein the top metal layer comprises a direct bonded copper or an active metal braze structure.

12. The cooling device according to claim 1, wherein the bond between the plenum housing and the substrate assembly is a solderless bond.

13. The cooling device according to claim 1, wherein the ceramic layer is selected from aluminum-oxide (AL₂O₃), aluminum nitride (AIN), beryllium oxide (BeO) and silicon nitride (Si3N4).

14. The cooling device according to claim 1, further comprising at least one semiconductor power device bonded to an outer surface of the metal layer opposite the metal layer surface bonded to the ceramic layer.

15. The cooling device according to claim 1, wherein the substrate assembly and the plenum housing are together configured to be joined together with at least one other like substrate assembly and one other like plenum housing to form a tiled cooling device structure.

16. A method of manufacturing a cooling device, the method comprising:

providing a first ceramic substrate;

bonding a first metal layer to one side of the first ceramic substrate;

bonding a first side of a first channel layer to an opposite side of the first ceramic substrate; and

bonding a first manifold layer to a second side of the first channel layer opposite the first side of the first channel layer bonded to the first ceramic substrate, such that the first ceramic substrate, first metal layer, first channel layer and the first manifold layer bonded together form a first substrate assembly.

17. The method according to claim 16, wherein each bond is a high temperature bond between about 980°

C. and about 1000°

C.

18. The method according to claim 16, further comprising bonding a first plenum housing to the first substrate assembly via a low temperature bond below about 300°

C.

19. The method according to claim 18, further comprising:

providing a second ceramic substrate;

bonding a second metal layer to one side of the second ceramic substrate;

bonding a first side of a second channel layer to an opposite side of the second ceramic substrate; and

bonding a second manifold layer to a second side of the second channel layer opposite the first side of the second channel layer, such that the second ceramic substrate, second metal layer, second channel layer and the second manifold layer bonded together form a second substrate assembly.

20. The method according to claim 19, wherein each bond is a high temperature bond between about 980°

C. and about 1000°

C.

21. The method according to claim 19, further comprising bonding a second plenum housing to the second substrate assembly via a low temperature bond below about 300°

C.

22. The method according to claim 21, further comprising coupling the first cooling device to the second cooling device to form a single unitary tiled cooling device comprising a single coolant inlet port and a single coolant outlet port.